| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/24/2005 | WO2005009096A3 Systems and methods for connecting electrical components |
| 02/24/2005 | WO2005001927A3 Stackable integrated circuit package and method therefor |
| 02/24/2005 | WO2004113041A3 Method for producing a ceramic/metal substrate |
| 02/24/2005 | WO2004050959A3 Reduction of surface oxidation during electroplating |
| 02/24/2005 | US20050044517 Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations |
| 02/24/2005 | US20050043826 Method and apparatus for positioning a test head on a printed circuit board |
| 02/24/2005 | US20050043502 The polyimide contains 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane and the addition-condensation polyamide contains carboxylated polybutadiene with an optional acrylonitrile block; low elasticity, excellent flexibility and heat resistance |
| 02/24/2005 | US20050042941 Connector for surface mounting subassemblies vertically on a mother board and assemblies comprising the same |
| 02/24/2005 | US20050042932 Construction structures and manufacturing processes for integrated circuit wafer probe card assemblies |
| 02/24/2005 | US20050042894 Electrical connection and component assembly for constitution of a hard disk drive |
| 02/24/2005 | US20050042892 Printed circuit board and an image forming apparatus having the printed circuit board |
| 02/24/2005 | US20050042868 Method for forming plating film |
| 02/24/2005 | US20050042852 Method for applying solder mask onto pad spacings of a printed circuit board |
| 02/24/2005 | US20050042851 Connector terminal device and its fabrication method |
| 02/24/2005 | US20050042803 Semiconductor device and method for production thereof |
| 02/24/2005 | US20050042801 Electronic parts packaging structure and method of manufacturing the same |
| 02/24/2005 | US20050042782 Method and apparatus for processing semiconductor devices in a singulated form |
| 02/24/2005 | US20050042556 preparing by a photographic process the silver grid coated on a first layer of an intrinsically conductive polymer, such as PEDOT/PSS, resulting in a multilayer configuration; photovoltaic devices, transistors and electroluminescent devices; may contain a 1-phenyl-5-mercapto-tetrazole and a PdS nucleator |
| 02/24/2005 | US20050042430 Pattern forming method, wiring pattern forming method, electro-optical device, and electronic apparatus |
| 02/24/2005 | US20050042383 Colloidal seed formation for printed circuit board metallization |
| 02/24/2005 | US20050042381 Fully automated paste dispense system for dispensing small dots and lines |
| 02/24/2005 | US20050042366 Forming openings in dielectric layer laminated onto substrate; applying uniform copper plating |
| 02/24/2005 | US20050041851 Screen printing apparatus |
| 02/24/2005 | US20050041405 Stacked via structure that includes a skip via |
| 02/24/2005 | US20050041404 Integrated circuit stacking system and method |
| 02/24/2005 | US20050041403 Integrated circuit stacking system and method |
| 02/24/2005 | US20050041402 Integrated circuit stacking system and method |
| 02/24/2005 | US20050041400 Electronic device |
| 02/24/2005 | US20050041399 Volumetrically efficient electronic circuit module |
| 02/24/2005 | US20050041398 Integrated circuit substrate having embedded back-side access conductors and vias |
| 02/24/2005 | US20050041367 Electronic component |
| 02/24/2005 | US20050041230 Projection exposure device |
| 02/24/2005 | US20050041190 Liquid crystal display device |
| 02/24/2005 | US20050040930 Fuel tank resistor card having improved corrosion resistance |
| 02/24/2005 | US20050040929 Fuel tank resistor card having improved corrosion resistance |
| 02/24/2005 | US20050040544 Electric circuit substrate |
| 02/24/2005 | US20050040535 has plating catalytic activity; multilayered printed wiring board using a conductive film; good adhesive strength between adjacent insulating layers |
| 02/24/2005 | US20050040531 Wiring board, manufacturing method thereof, semiconductor device and manufacturing method thereof |
| 02/24/2005 | US20050040528 Method of arranging micro spheres with liquid, micro sphere arranging device, and semiconductor device |
| 02/24/2005 | US20050040525 Package module for an IC device and method of forming the same |
| 02/24/2005 | US20050040522 High-frequency semiconductor device |
| 02/24/2005 | US20050040513 Copper-faced modules, imprinted copper circuits, and their application to supercomputers |
| 02/24/2005 | US20050040502 Interconnections |
| 02/24/2005 | US20050039950 High speed circuitized substrate with reduced thru-hole stub, method for fabrication and information handling system utilizing same |
| 02/24/2005 | US20050039949 Methods for fabricating current-carrying structures using voltage switchable dielectric materials |
| 02/24/2005 | US20050039948 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 02/24/2005 | US20050039947 Multi-layered printed wiring board |
| 02/24/2005 | US20050039946 Electronic circuit unit and method of manufacturing same |
| 02/24/2005 | US20050039945 Flexible circuit board mounted with semiconductor chip and method for mounting semiconductor chip |
| 02/24/2005 | US20050039944 Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate |
| 02/24/2005 | US20050039935 Interference signal decoupling on a printed circuit board |
| 02/24/2005 | US20050039840 Circuitized substrate and method of making same |
| 02/24/2005 | US20050039824 An epoxy flux, a lead-free tin-zinc (SnZn) alloy, and an organic carboxylic acid with stability of viscosity, printability and solderability over time, not requiring flux removal; does not cause corrosion like rosin-based fluxes |
| 02/24/2005 | US20050039330 Apparatus and method for force mounting semiconductor packages to printed circuit boards |
| 02/24/2005 | US20050039329 Method for making conductive circuits using powdered metals |
| 02/24/2005 | DE20320779U1 Component for mounting on circuit board has shrinkage component matched to circuit board so that part can be fixed against falling out for situation where underside of circuit board is being populated |
| 02/24/2005 | DE20320761U1 Base laminate for flexible or semi-flexible mono- or multi-layered printed circuits comprises a support film layer made from a thin resin-impregnated fibrous material, and a conducting foil layer, especially a copper foil |
| 02/24/2005 | DE20320759U1 Circuit board used in electrical devices and vehicles for electronic control comprises an insulating filler material applied on a base material or on conductor strips so that channels between the strips are filled with the filler material |
| 02/24/2005 | DE19649650B4 Oberflächenmontierbares strahlungsemittierendes Halbleiterbauelement Surface-mountable radiation-emitting semiconductor component |
| 02/24/2005 | DE10357525B3 Applying cover layer to moving structured base layer involves determining base layer structure position, triggering signal from control unit, making aperture in cover layer by laser to synchronize |
| 02/24/2005 | DE10335312A1 Generation of a reference pattern for testing a substrate on which a reference pattern has been applied, e.g. for testing a circuit board with applied solder paste, whereby a reference data set is generated from control data |
| 02/24/2005 | DE10335015A1 Verfahren zur Fixierung von elektrischen Leiterbahnen auf einer Grundplatte sowie Anordnung aus Leiterbahnen und Grundplatte A method for fixing electrical conductors on a base plate and arrangement of conductors and base plate |
| 02/24/2005 | DE10334581A1 Manufacture of an electronic circuit on double sided board having interconnections using push in pins |
| 02/24/2005 | DE10332215A1 Electric connection matrix plate designed as multi-layer printed circuit, has contacts connected via separable conductive webs to adjacent conductor paths or arranged between them |
| 02/24/2005 | DE10331840A1 Bauteil für eine Leiterplatte und Verfahren zum Bestücken der Leiterplatte mit diesem Bauteil Component for a circuit board and method for populating the printed circuit board with this component |
| 02/24/2005 | DE10260774B4 Lötvorrichtung Soldering device |
| 02/24/2005 | DE10204151B4 Verfahren zum definierten Tiefenbohren von Sacklöchern ( blind vias ) in mehrlagigen Leiterplatten (Multilayer) Defined method for deep drilling blind holes (blind vias) in multilayer printed circuit boards (multilayer) |
| 02/24/2005 | DE102004032533A1 Production of multiple layer ceramic composite used in electronics industry comprises forming metallic layer structures on film-like intermediate support, positioning support between films and forming composite |
| 02/24/2005 | DE102004032184A1 Laserstrahlbearbeitungsverfahren und Laserstrahlbearbeitungsmaschine bzw. -Vorrichtung Laser beam machining method and laser processing machine |
| 02/24/2005 | DE10145420B4 Verfahren zur Herstellung einer Lotverbindung A method for producing a solder joint |
| 02/24/2005 | DE10064221B4 Leiterplatine mit gekühltem SMD-Baustein Printed circuit board having a cooled SMD component |
| 02/24/2005 | DE10027961B4 Vorrichtung zum elektrisch leitenden Verbinden von Anschlussstiften Device for the electrically conductive connection of pins |
| 02/23/2005 | EP1509071A1 Aluminum nitride sintered compact having metallized layer and method for preparation thereof |
| 02/23/2005 | EP1509070A2 Method for producing an electrical conductor element and electrical conductor element |
| 02/23/2005 | EP1509069A2 Double-sided wiring circuit board and process for producing the same |
| 02/23/2005 | EP1509068A1 Method of making a microstructure using a circuit board |
| 02/23/2005 | EP1508942A1 Electrical connection device between two boards and method of use in a microelectronic component |
| 02/23/2005 | EP1508936A1 Duplexer fabrication method using embedded PCB and duplexer fabricated by the same |
| 02/23/2005 | EP1508905A2 Electronic component |
| 02/23/2005 | EP1508453A2 Method of forming metal fine particle pattern and method of forming electroconductive pattern |
| 02/23/2005 | EP1508261A1 Nanoparticle filled underfill |
| 02/23/2005 | EP1507906A1 Plural layer woven electronic textile, article and method |
| 02/23/2005 | EP1507900A1 Copper laminate, composite lamellar material comprising said copper laminate and a procedure for producing it |
| 02/23/2005 | EP1507627A1 Automatic machine tool |
| 02/23/2005 | EP1419290B1 Segmented counterelectrode for an electrolytic treatment system |
| 02/23/2005 | EP1198799B1 Method of producing pi-conjugated polymers |
| 02/23/2005 | CN2681526Y Vacuum pressing machine for flexible circuit board |
| 02/23/2005 | CN2681525Y Line carrier plate |
| 02/23/2005 | CN2681524Y Line carrier plate |
| 02/23/2005 | CN2681523Y Apparatus for tin ball cementing device |
| 02/23/2005 | CN2681522Y All-purpose tray |
| 02/23/2005 | CN2681521Y 一种夹具 A clamp |
| 02/23/2005 | CN1585992A Method of producing a multilayer microelectronic substrate |
| 02/23/2005 | CN1585594A Double-sided wiring circuit board and process for producing the same |
| 02/23/2005 | CN1585593A Multilayer printed wiring board having filled-via structure |
| 02/23/2005 | CN1585592A Tin cream coating assistant apparatus |
| 02/23/2005 | CN1585591A Flexible circuit board mounted with semiconductor chip and method for mounting semiconductor chip |
| 02/23/2005 | CN1585590A Printed circuit board and imaging device therewith |
| 02/23/2005 | CN1585589A Electric circuit substrate |
| 02/23/2005 | CN1585575A Thermal treatment, layout pattern forming method, photoelectric device and its manufacture |