| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/02/2005 | CN1574304A Package for semiconductor devices |
| 02/02/2005 | CN1574261A Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus |
| 02/02/2005 | CN1574255A Flip chip assembly process and substrate used therewith and printed half-tone screen free from being stained with solder |
| 02/02/2005 | CN1574237A Chemical processing apparatus, chemical processing method, and method for manufacturing circuit substrate |
| 02/02/2005 | CN1574222A Photosensitive tabular member suction mechanism and image recording device |
| 02/02/2005 | CN1574207A Pattern forming method, device, method of manufacture thereof, electro-optical apparatus, and electronic apparatus |
| 02/02/2005 | CN1574201A Pattern formation method and pattern formation apparatus, method for manufacturing device, electro-optical device, |
| 02/02/2005 | CN1574129A Multilayer ceramic electronic component and mounting structure and method for the same |
| 02/02/2005 | CN1574121A Paste dispenser and method for controlling the same |
| 02/02/2005 | CN1574027A Wired circuit board |
| 02/02/2005 | CN1574026A Wired circuit board |
| 02/02/2005 | CN1573802A 透明接触板 Transparent contact plates |
| 02/02/2005 | CN1573652A Electronic apparatus including printed wiring board provided with heat generating component |
| 02/02/2005 | CN1573559A Double-sided projection exposure device of belt-shape workpieces |
| 02/02/2005 | CN1573555A Patten drawing device |
| 02/02/2005 | CN1573553A Composition for forming wiring protective film and uses thereof |
| 02/02/2005 | CN1573449A Method for fabricating thin film pattern, device and fabricating method therefor, method for fabricating liquid crystal display, liquid crystal display |
| 02/02/2005 | CN1573445A Liquid crystal display device and method of fabricating the same |
| 02/02/2005 | CN1573434A Substrate treatment apparatus |
| 02/02/2005 | CN1573280A Figure checking device |
| 02/02/2005 | CN1572910A Plating machine and process for producing film carrier tapes for mounting electronic parts |
| 02/02/2005 | CN1572897A Method and apparatus for manufacturing a thin film, thin-film laminate, and electronic parts |
| 02/02/2005 | CN1572838A Thermosetting resin composition and articles using the same |
| 02/02/2005 | CN1188022C Electronic unit manufacturing apparatus and method |
| 02/02/2005 | CN1188021C Copper tin displacement method for printed circuit board |
| 02/02/2005 | CN1188020C Fluid material filling device and filling method thereof |
| 02/02/2005 | CN1188018C Interconnecting device for electronic equipments |
| 02/02/2005 | CN1188017C System and method for providing anti-high voltage ability between contact pins of connector |
| 02/02/2005 | CN1187866C Chip parts on glass and connecting material used thereof |
| 02/02/2005 | CN1187865C Multiplayer microwave coupler using vertically-connected stripline |
| 02/02/2005 | CN1187806C Method for producing electric circuit device |
| 02/02/2005 | CN1187769C Method for producing laminated electronic assembly and producing apparatus |
| 02/02/2005 | CN1187619C Method and device for testing printed circuit boards with a parallel tester |
| 02/02/2005 | CN1187481C Electrolyzing apparatus |
| 02/02/2005 | CN1187232C High-speed constant-volume discharging distributor head |
| 02/02/2005 | CN1187192C Screen printing apparatus and screen printing method |
| 02/02/2005 | CN1187161C Control method for copper content in solder dipping bath |
| 02/02/2005 | CN1187138C Waste recovery method of circuit products with welded parts |
| 02/01/2005 | US6850411 Method and structure to support heat sink arrangement on chip carrier packages |
| 02/01/2005 | US6850307 Display device substrate, method for manufacturing the display device substrate, liquid-crystal display device, and electronic equipment |
| 02/01/2005 | US6850084 Assembly for testing silicon wafers which have a through-via |
| 02/01/2005 | US6849953 Microelectronic assemblies with composite conductive elements |
| 02/01/2005 | US6849944 Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die pad |
| 02/01/2005 | US6849943 Power module package for high frequency switching system |
| 02/01/2005 | US6849935 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board |
| 02/01/2005 | US6849934 Dielectric film for printed wiring board, multilayer printed board, and semiconductor device |
| 02/01/2005 | US6849824 Multibeam laser drilling apparatus |
| 02/01/2005 | US6849823 Arrangement and method for processing electrical substrates using lasers |
| 02/01/2005 | US6849805 Printed wiring board and electronic apparatus |
| 02/01/2005 | US6849800 Board-level conformal EMI shield having an electrically-conductive polymer coating over a thermally-conductive dielectric coating |
| 02/01/2005 | US6849480 Surface mount IC stacking method and device |
| 02/01/2005 | US6849479 Substrate based ESD network protection method for flip chip design |
| 02/01/2005 | US6849308 Method of forming a masking pattern on a surface |
| 02/01/2005 | US6849305 Photolytic conversion process to form patterned amorphous film |
| 02/01/2005 | US6849294 Overcoating dielectric with polymer; then metal; eching; overcoating with gold |
| 02/01/2005 | US6848912 Via providing multiple electrically conductive paths through a circuit board |
| 02/01/2005 | US6848819 Light-emitting diode arrangement |
| 02/01/2005 | US6848610 Approaches for fluxless soldering |
| 02/01/2005 | US6848178 Enhancement of current-carrying capacity of a multilayer circuit board |
| 02/01/2005 | US6848176 Process for manufacturing flexible wiring boards |
| 02/01/2005 | US6848175 Method of forming an out-of-plane structure |
| 02/01/2005 | US6848173 Microelectric packages having deformed bonded leads and methods therefor |
| 02/01/2005 | CA2373565C Beam shaping and projection imaging with solid state uv gaussian beam to form vias |
| 02/01/2005 | CA2326244C Electrical connecting element and method of producing the same |
| 02/01/2005 | CA2097135C Fast response film coater |
| 01/27/2005 | WO2005009096A2 Systems and methods for connecting electrical components |
| 01/27/2005 | WO2005009095A1 A cross-over of conductive interconnects and a method of crossing conductive interconnects |
| 01/27/2005 | WO2005009094A1 Electronic module and method for the production thereof |
| 01/27/2005 | WO2005009093A1 Copper foil with extremely thin adhesive layer and method for producing the copper foil with extremely thin adhesive layer |
| 01/27/2005 | WO2005009092A1 Flexible strip conductor structure and method for producing and using the same |
| 01/27/2005 | WO2005008842A1 Component, double-sided printed circuit board and method for making an electrical connection of a double-sided printed circuit |
| 01/27/2005 | WO2005008837A1 Electrical contact assembly with insulative carrier, stapled contact attachment and fusible element |
| 01/27/2005 | WO2005008766A1 Method for generation of soldered contacts on components and component or solder deposit support plate suitable for application in said method |
| 01/27/2005 | WO2005008765A2 Semiconductor power module with strip conductors which are detached from a substrate as external connections |
| 01/27/2005 | WO2005008761A1 Layered components, materials, methods of production and uses thereof |
| 01/27/2005 | WO2005008733A2 Modular electronic assembly and method of making |
| 01/27/2005 | WO2005008698A1 Surface mounting type part |
| 01/27/2005 | WO2005008663A1 An improved method of head stack assembly flexible circuit assembly attached to an actuator arm |
| 01/27/2005 | WO2005007930A1 Electroless deposition methods and systems |
| 01/27/2005 | WO2005007929A2 Resin substrate having a resin-metal composite layer and method for manufacturing thereof |
| 01/27/2005 | WO2005007919A2 Coating metal particles |
| 01/27/2005 | WO2005007756A1 Primer, conductor foil with resin, laminate and process for producing the laminate |
| 01/27/2005 | WO2004061960A3 Semiconductor device power interconnect striping |
| 01/27/2005 | WO2004006173A3 Method for the production of electrically-conducting connections on chipcards |
| 01/27/2005 | US20050022149 Generating a split power plane of a multi-layer printed circuit board |
| 01/27/2005 | US20050020115 Method and apparatus for connecting multiple coaxial cables to a printed circuit board in a compact |
| 01/27/2005 | US20050020108 Electrical connector |
| 01/27/2005 | US20050020079 Structure having flush circuit features and method of making |
| 01/27/2005 | US20050020069 Nickel bonding cap over copper metalized bondpads |
| 01/27/2005 | US20050020062 Substrate with multiple conductive layers and methods for making and using same |
| 01/27/2005 | US20050019983 Method of manufacturing a stackable ball grid array |
| 01/27/2005 | US20050019707 Method for forming patterned insulating elements and methods for making electron source and image display device |
| 01/27/2005 | US20050019654 Battery provided with terminals |
| 01/27/2005 | US20050019598 The laminate of a electrolytically plated copper film and a polyimide film using no adhesive and on which a fine circuit pattern can be formed; copper film has at most 200 protrusions having a diameter of >15 mu m (abnormally large protrusions) on a surface not facing the polyimide film; peel strength |
| 01/27/2005 | US20050019582 Blend curable at a low and high temperature of an epoxy resin-unsaturated aliphatic acid adduct, a (meth)acrylate, a free radical initiator, a crystallizable epoxy resin, and latent curing agent; smooth undercoatings for circuit boards |
| 01/27/2005 | US20050019554 Adhesives film for multilayer printed circuit polyamide heat resistant resin and copolymers with ether, imide and benzimidazole and polybutadiene layer |
| 01/27/2005 | US20050019541 Lightweight circuit board with conductive constraining cores |
| 01/27/2005 | US20050019535 Lightweight circuit board with conductive constraining cores |
| 01/27/2005 | US20050019534 Method for producing a hybrid product composed of several wiring planes, as well as a sensor or evaluation circuit and a control device with hybrid product produced by the inventive method |
| 01/27/2005 | US20050019527 Lamination of liquid crystal polymer dielectric films |