| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 01/27/2005 | US20050019495 Method for producing contact terminal with textured surface and use thereof |
| 01/27/2005 | US20050019122 Printed board machining apparatus |
| 01/27/2005 | US20050018994 Active and passive to-can extension boards |
| 01/27/2005 | US20050018412 Pitch change and chip scale stacking system |
| 01/27/2005 | US20050018410 Printed circuit board assembly with integrated connector |
| 01/27/2005 | US20050018390 Electronic control unit |
| 01/27/2005 | US20050018352 Flexible printed circuit for spindle motor and disk drive having the same |
| 01/27/2005 | US20050018255 Image-recording apparatus using spatial light-modulation device on which divided reset actuation is performed |
| 01/27/2005 | US20050018017 Inkjet nozzle chamber holding two fluids |
| 01/27/2005 | US20050018015 Inkjet nozzle with resiliently biased ejection actuator |
| 01/27/2005 | US20050018011 Slurried suspension ejector and related systems and methods of forming same |
| 01/27/2005 | US20050017918 Data processing terminal, parent substrate, child substrate, terminal design apparatus and method, computer program, and information storage medium |
| 01/27/2005 | US20050017827 Signal transmission structure |
| 01/27/2005 | US20050017740 Module part |
| 01/27/2005 | US20050017739 Method and apparatus for processing semiconductor devices in a singulated form |
| 01/27/2005 | US20050017375 Ball grid array package substrate and method for manufacturing the same |
| 01/27/2005 | US20050017373 Electronic circuit device and its manufacturing method |
| 01/27/2005 | US20050017369 Interposer |
| 01/27/2005 | US20050017349 Method for supporting circuit component having solder column array interconnects using interposed support shims |
| 01/27/2005 | US20050017347 Circuit module and manufacturing method thereof |
| 01/27/2005 | US20050017345 Flexible tape electronics packaging and methods of manufacture |
| 01/27/2005 | US20050017271 Multilayered substrate for semiconductor device and method of manufacturing same |
| 01/27/2005 | US20050017156 High-speed, precision, laser-based method and system for processing material of one or more targets within a field |
| 01/27/2005 | US20050017058 [method of fabricating circuit substrate] |
| 01/27/2005 | US20050017054 Flyback transformer wire attach method to printed circuit board |
| 01/27/2005 | US20050017052 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device |
| 01/27/2005 | US20050016961 Etchant, replenishment solution and method for producing copper wiring using the same |
| 01/27/2005 | US20050016897 Connection structure of circuit substrate |
| 01/27/2005 | US20050016768 Inverted microvia structure and method of manufacture |
| 01/27/2005 | US20050016767 Electronic module with dual connectivity |
| 01/27/2005 | US20050016765 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof |
| 01/27/2005 | US20050016764 Wiring substrate for intermediate connection and multi-layered wiring board and their production |
| 01/27/2005 | US20050016763 Circuit board with embedded components and method of manufacture |
| 01/27/2005 | US20050016762 Method of forming a multi-layer printed circuit board and the product thereof |
| 01/27/2005 | US20050016749 Method and system for optimizing routing layers and board space requirements for a ball grid array land pattern |
| 01/27/2005 | US20050016567 Substrate treatment apparatus |
| 01/27/2005 | US20050016451 Interchangeable microdesition head apparatus and method |
| 01/27/2005 | US20050016325 Metal slurry for electrode formation and production method of the same |
| 01/27/2005 | US20050016251 Forming tool for forming a contoured microelectronic spring mold |
| 01/27/2005 | US20050015976 Method for reinforcing the connection of flat cable member and method for manufacturing image display unit |
| 01/27/2005 | US20050015970 Method, system, and apparatus for transfer of dies using a pin plate |
| 01/27/2005 | US20050015967 Method for testing print circuit boards |
| 01/27/2005 | DE20319646U1 Print template, especially for mounting components on circuit board, has template soldered to metal wire mesh and/or metal wire mesh soldered to stable shape frame |
| 01/27/2005 | DE19938056B4 Verfahren zum Entfernen leitfähiger Abschnitte A method of removing conductive portions |
| 01/27/2005 | DE10356449B3 Bath for electroless deposition of silver, e.g. on circuit boards, comprises a soluble silver ion source, an acid and an aromatic dicarboxylic acid with electron-withdrawing substituents |
| 01/27/2005 | DE10331132A1 Verfahren zum Reinigen einer metallischen Oberfläche A method of cleaning a metallic surface |
| 01/27/2005 | DE10330754A1 Manufacturing electrical circuit, involves using regions between metallized free areas as contact pins for electrical connection of individual conducting tracks to external circuits or connecting plugs |
| 01/27/2005 | DE10330448A1 Verfahren zum platzsparenden Anbringen elektrischer Leitungen A method for space-saving mounting electrical lines |
| 01/27/2005 | DE10330271A1 Selbstjustierende Vorrichtung, selbstjustierendes System und Verfahren zum Anordnen einer selbstjustierenden Vorrichtung an einem Flächengebilde Self-adjusting device, in auto-tuning system and method for positioning a self-adjusting device on a sheet |
| 01/27/2005 | DE10330062A1 Verfahren und Vorrichtung zur Strukturierung von organischen Schichten Method and apparatus for patterning organic layers |
| 01/27/2005 | DE10329267A1 Circuit carrier arrangement for carrying an electronic circuit, has heat conducting body extending between upper and lower surfaces of circuit carrier and flush with upper and lower surfaces |
| 01/27/2005 | DE10328776B3 Stanzvorrichtung für flächige Gegenstände Punching device for flat objects |
| 01/27/2005 | DE10328362A1 Preparation of conductive substrate by light exposure of a photosensitive layer of a conductive substrate, etching and removal of the photosensitive layer |
| 01/27/2005 | DE10327882A1 Improved reliability of solder link at semiconductor products with ball grid array (BGA) or similar components, with substrate locating chips secured by die-attach material, with substrate coated with solder stop lacquer on ball side |
| 01/27/2005 | DE10326989A1 Measurement device with a measurement sensor, especially for use with railway rolling stock, has a circuit board with a flexible section or area linking two adjoining rigid circuit board areas |
| 01/27/2005 | DE102004021570A1 Fastening and/or contacting appliance for flexible solar cells onto circuit boards, enabling conductive and mechanically solid connection, even at extreme temperature fluctuations |
| 01/26/2005 | EP1501104A1 Circuit board having resistor and method for manufacturing the circuit board |
| 01/26/2005 | EP1500719A1 Etchant, replenishment solution and method for producing copper wiring using the same |
| 01/26/2005 | EP1500515A2 Addressing the imaging elements of a spatial light modulator in an image recording apparatus |
| 01/26/2005 | EP1500466A1 Device for alternately machining a workpiece |
| 01/26/2005 | EP1500317A1 Method of manufacturing an electronic device |
| 01/26/2005 | EP1500316A1 Method for creating a trench structure in a polymer substrate |
| 01/26/2005 | EP1500314A1 Electrically insulating body, and electronic device |
| 01/26/2005 | EP1500136A1 Semiconductor device and method of manufacturing same |
| 01/26/2005 | EP1500131A2 Method for the production of contact pads on a substrate and device for carrying out said method |
| 01/26/2005 | EP1500043A2 Manufacturing method for a wireless communication device and manufacturing apparatus |
| 01/26/2005 | EP1499549A2 Sheeted roll and methods and apparatus for sheeting a roll |
| 01/26/2005 | EP1499499A1 Printing screens, frames therefor and printing screen units |
| 01/26/2005 | EP1401609B1 Method for the calibration of the optical system on a laser machine for machining electrical circuit substrates |
| 01/26/2005 | EP1232294B1 Metallizing method for dielectrics |
| 01/26/2005 | EP1162238B1 Conductive layers made from compositions containing polythiophene and solvent |
| 01/26/2005 | CN1572129A Solder-coated ball and method for manufacture thereof, and method for forming semiconductor interconnecting structure |
| 01/26/2005 | CN1572128A Photoimageable dielectric material for circuit protection |
| 01/26/2005 | CN1572023A Encapsulation of pin solder for maintaining accuracy in pin position |
| 01/26/2005 | CN1572009A Process and device for etching a thin conducting layer deposited on an insulating plate, so as to form an array of electrodes thereon |
| 01/26/2005 | CN1571923A Optical inspection system having integrated component learning |
| 01/26/2005 | CN1571867A Surface treatment copper foil for low dielectric substrate, copper clad laminate including the same and printed wiring board |
| 01/26/2005 | CN1571865A System and method for electrolytic plating |
| 01/26/2005 | CN1571627A Method for solder planting of conducting terminal |
| 01/26/2005 | CN1571626A Bonding pads for a printed circuit board |
| 01/26/2005 | CN1571625A A figurized polyaniline deposition method |
| 01/26/2005 | CN1571624A Miniature circulating flow passage system and manufacturing method thereof |
| 01/26/2005 | CN1571621A Wiring circuit board, manufacturing method for the wiring circuit board, and circuit module |
| 01/26/2005 | CN1571620A Structure of substrate, structure of insulating layer of substrate, and manufacturing method thereof |
| 01/26/2005 | CN1571149A Discontinuous solder ball contact and circuit board assembly using the same |
| 01/26/2005 | CN1571128A Method for manufacturing image sensor base plate |
| 01/26/2005 | CN1571117A Process of surface treatment, surface treating device, surface treated plate, and electro-optic device |
| 01/26/2005 | CN1571076A Low cost shielded cable manufactured from conductive loaded resin-based materials |
| 01/26/2005 | CN1570718A Method for joining chip and other devices to liquid crystal display panel and display device |
| 01/26/2005 | CN1570212A Etching solution of copper or copper alloy and method for producing electronic substrate using the solution |
| 01/26/2005 | CN1186972C 印制电路板 Printed circuit board |
| 01/26/2005 | CN1186971C Printed circuit board, battery pack, and method of manufacturing printed circuit board |
| 01/26/2005 | CN1186885C 差分线路驱动器 Differential Line Driver |
| 01/26/2005 | CN1186847C RF switch |
| 01/26/2005 | CN1186294C Crystal glass composite article, crystal glass, insulating composite article, insulating paste and thick film circuit board |
| 01/26/2005 | CN1186166C Heating head for hot-pressing bonding and making method thereof |
| 01/26/2005 | CN1186130C Polymer-coated metal composites by dip autopolymerization |
| 01/26/2005 | CN1186128C Electrode forming method on electronic component part and conductive paste coating device |
| 01/26/2005 | CN1186127C Roller coater and method for manufacturing printed wiring board by the same |
| 01/25/2005 | US6847529 Ultra-low impedance power interconnection system for electronic packages |