| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/06/2005 | US20050000645 Method for bonding reinforcing plate |
| 01/06/2005 | US20050000634 Transfer assembly for manufacturing electronic devices |
| 01/06/2005 | US20050000422 Over-clocking in a microdeposition control system to improve resolution |
| 01/06/2005 | US20050000414 Method and apparatus for applying conductive ink onto semiconductor substrates |
| 01/06/2005 | CA2774224A1 Method for producing parts for passive electronic components and parts thus obtained |
| 01/06/2005 | CA2530687A1 Component and method for manufacturing printed circuit boards |
| 01/06/2005 | CA2529899A1 Parts for passive electronic components and method for production thereof |
| 01/06/2005 | CA2528505A1 Dielectric composite material comprising benzocyclobutene which contains a filler in order to decrease the coefficient of thermal expansion |
| 01/05/2005 | EP1494516A2 Wiring board and manufacturing method thereof |
| 01/05/2005 | EP1494515A2 Electronic component mounting method, substrate manufacturing apparatus, and circuit board |
| 01/05/2005 | EP1494514A2 Wiring board provided with a resistor and process for manufacturing the same |
| 01/05/2005 | EP1494513A1 Circuit board device for information apparatus, multilayered module board, and navigator |
| 01/05/2005 | EP1494362A1 Signal reception device, signal reception circuit, and reception device |
| 01/05/2005 | EP1494321A1 Zipper connector |
| 01/05/2005 | EP1494319A2 Flexible substrate and a connection method thereof that can achieve reliable connection |
| 01/05/2005 | EP1494277A2 Module with a built-in semiconductor and method for producing the same |
| 01/05/2005 | EP1494271A1 Method for dicing substrate |
| 01/05/2005 | EP1494077A2 Image forming apparatus and image forming method |
| 01/05/2005 | EP1494073A2 Photosensitive resin composition and printed wiring board |
| 01/05/2005 | EP1493313A2 Waterborne printed circuit board coating compositions |
| 01/05/2005 | EP1493188A2 Electronic component having at least one semiconductor chip and flip-chip contacts, and method for the production thereof |
| 01/05/2005 | EP0835600B1 Perimeter matrix ball grid array circuit package with a populated center |
| 01/05/2005 | DE202004014353U1 Socket base for electrical components, such as fuses, in motor vehicle, has circuit board connected to connector contact, and arranged in different plane to punched conductor |
| 01/05/2005 | DE202004012466U1 Einpreßverbinder Press-fit |
| 01/05/2005 | DE10327767A1 Schaltungsbaugruppe und Herstellungsverfahren dafür Circuit module and manufacturing method thereof |
| 01/05/2005 | DE10327360A1 Verfahren zum Herstellen eines Keramik-Metall-Substrates A method of manufacturing a ceramic-metal substrate |
| 01/05/2005 | DE10325884A1 Vorrichtung und Verfahren zum elektrischen Verbinden eines elektrischen Leiters mit einem elektronischen Bauelement Apparatus and method for electrically connecting an electrical conductor to an electronic component |
| 01/05/2005 | DE10325550A1 Elektrisches Kontaktierungsverfahren Electrical contacting methods |
| 01/05/2005 | DE10324936A1 Stamping or embossing cylinder, for use in production of a large range of industrial objects, has a seamless surface on which 2 or 3-dimensional structures are created using an ultraviolet etching process |
| 01/05/2005 | DE10324047A1 Elektronikeinheit sowie Verfahren zur Herstellung einer Elektronikeinheit Electronic unit as well as methods for producing an electronic unit |
| 01/05/2005 | DE10322628A1 Producing suction surface on electrical surface mount component, especially coil, involves pressing component onto adhesion-compatible material on band while pre-hardening, releasing, final hardening |
| 01/05/2005 | DE10297505T5 Verschaltgerät-Steuergerät Verschaltgerät controller |
| 01/05/2005 | DE10016037B4 Verfahren zur Herstellung eines Etiketts oder einer Chipkarte Process for the preparation of a label or a chip card |
| 01/05/2005 | CN2669547Y Dual-line efficient wire jumper |
| 01/05/2005 | CN1561657A Electronic circuit comprising conductive bridges and method for making such bridges |
| 01/05/2005 | CN1561656A Method for mounting an electronic component |
| 01/05/2005 | CN1561655A Vented vias for via in pad technology assembly process yield improvements |
| 01/05/2005 | CN1561527A Multiple terminal SMT BGA-style wound capacitor |
| 01/05/2005 | CN1561409A Segmented counterelectrode for an electrolytic treatment system |
| 01/05/2005 | CN1561277A A laser machining system and method |
| 01/05/2005 | CN1561158A Manufacturing technological process of printed circuit board |
| 01/05/2005 | CN1561157A Signal transmission structure |
| 01/05/2005 | CN1561156A Soft printed circuit board |
| 01/05/2005 | CN1560912A Manufacturing process of conducting hole |
| 01/05/2005 | CN1560911A Manufacturing method of circuit board |
| 01/05/2005 | CN1559742A Laser processing device |
| 01/05/2005 | CN1183818C Component and device mounting device |
| 01/05/2005 | CN1183815C Method for mfg. glass ceramic multi-substrate |
| 01/05/2005 | CN1183814C Copper foil with good chemicals-resisting and heat-resisting characteristicas for printed circuit board |
| 01/05/2005 | CN1183813C Parts mounting baseplate and making method therefor |
| 01/05/2005 | CN1183812C Method for manufacturing double-side flexible printed circuit board |
| 01/05/2005 | CN1183811C Method and device for laser drilling laminates |
| 01/05/2005 | CN1183810C Terminal structure |
| 01/05/2005 | CN1183636C Control device and soldering method |
| 01/05/2005 | CN1183486C Electronic module for chip card |
| 01/05/2005 | CN1183423C Photosensitive composition for sandblasting and photosensitive film comprising the same |
| 01/05/2005 | CN1182936C Beam shaping and projection imaging with solid state UV gaussien beam to form vias |
| 01/04/2005 | US6839885 Determining via placement in the printed circuit board of a wireless test fixture |
| 01/04/2005 | US6839243 Electronic component and method of producing the same |
| 01/04/2005 | US6839219 Laminate for forming capacitor layer and method for manufacturing the same |
| 01/04/2005 | US6839218 Ceramic electronic component having lead wires |
| 01/04/2005 | US6839202 Electromagnetic wave shielded write and read wires on a support for a magnetic media drive |
| 01/04/2005 | US6838894 Stress relieved contact array |
| 01/04/2005 | US6838893 Probe card assembly |
| 01/04/2005 | US6838775 Semiconductor device comprising ESD protection circuit for protecting circuit from being destructed by electrostatic discharge |
| 01/04/2005 | US6838759 Small memory card |
| 01/04/2005 | US6838750 Interconnect circuitry, multichip module, and methods of manufacturing thereof |
| 01/04/2005 | US6838623 Electrical circuit board and a method for making the same |
| 01/04/2005 | US6838546 Less anisotropic films |
| 01/04/2005 | US6838400 A woven fiberglass cloth comprising 0.01-2% of an oxide or salt of copper and/or cromium to reduce the glass transmittance of ultra-violet light; reinforced prepregs; printed circuit boards and cards; laminated chip carrier |
| 01/04/2005 | US6838377 High frequency circuit chip and method of producing the same |
| 01/04/2005 | US6838372 Via interconnect forming process and electronic component product thereof |
| 01/04/2005 | US6838351 Manufacturing method of circuit board, circuit board, and liquid discharging apparatus |
| 01/04/2005 | US6838318 Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them |
| 01/04/2005 | US6838317 Techniques for joining an opto-electronic module to a semiconductor package |
| 01/04/2005 | US6838314 Substrate with stacked vias and fine circuits thereon, and method for fabricating the same |
| 01/04/2005 | US6838170 Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same |
| 01/04/2005 | US6838164 Method and apparatus for fabricating circuit-forming-substrate and circuit-forming-substrate material |
| 01/04/2005 | US6838022 Anisotropic conductive compound |
| 01/04/2005 | US6838021 Irregular shaped copper particles and methods of use |
| 01/04/2005 | US6838009 Rework method for finishing metallurgy on chip carriers |
| 01/04/2005 | US6837978 Actuator is connected to the holder and adjustably positions the substrate relative to the electrolyte cell; |
| 01/04/2005 | US6837755 Fuse holder component |
| 01/04/2005 | US6837747 Filtered connector |
| 01/04/2005 | US6837731 Locking assembly for securing a semiconductor device to a carrier substrate |
| 01/04/2005 | US6837252 Apparatus for treating a workpiece with steam and ozone |
| 12/30/2004 | US20040268283 Method for creating, modifying, and simulating electrical circuits over the internet |
| 12/30/2004 | US20040268000 Pass through circuit for reduced memory latency in a multiprocessor system |
| 12/30/2004 | US20040266384 High frequency and low noise interconnect system |
| 12/30/2004 | US20040266252 Structure of terminal member |
| 12/30/2004 | US20040266251 Electrical connector with integrated strain relief attachment clip |
| 12/30/2004 | US20040266247 Land grid array connector assembly with pick up cap |
| 12/30/2004 | US20040266245 Land grid array connector assembly with readily removable pick-up cap |
| 12/30/2004 | US20040266244 Apparatus and method for connecting an electric conductor electrically to an electronic component |
| 12/30/2004 | US20040266228 Board-to-board power connector for a projection device |
| 12/30/2004 | US20040266173 Method for forming patterns for semiconductor devices |
| 12/30/2004 | US20040266070 Method of forming an integrated circuit substrate |
| 12/30/2004 | US20040266064 Method and apparatus for imprinting a circuit pattern using ultrasonic vibrations |
| 12/30/2004 | US20040266060 Cost-reducing and process-simplifying wiring board and manufacturing method thereof |
| 12/30/2004 | US20040265730 Photosensitive composition and production processes for photosensitive film and printed wiring board |