| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/23/2004 | US20040255456 Method for manufacturing a chip carrier |
| 12/23/2004 | DE10350349B3 Laser machining method for electrical circuit board has size and shape of individual machining fields matched to surface area of circle provided by imaging unit for laser beam |
| 12/23/2004 | DE10349392B3 Demetallizing contact devices in galvanizing plants used in production of circuit boards or foils comprises chemically etching auxiliary electrode during electrolytic metallization and simultaneously demetallizing |
| 12/23/2004 | DE10337280A1 Surface condition analyzing system for printed circuit board, has analyzing unit performing mapping operation for RGB signals and comparing determined relative RGB values with values derived through moisture absorption test |
| 12/23/2004 | DE10336281B3 Electrical component group with screened electromagnetic component has contact elements engaging conductive layer applied to rear side of component substrate and secured to base substrate |
| 12/23/2004 | DE10325243A1 Abscheidung von Kupferschichten auf Substraten Deposition of copper layers on substrates |
| 12/23/2004 | DE10325118A1 Method for application of electrically-conductive structure to insulating substrate e.g. for electrical circuit board manufacture, using laser energy for transfer of metal by vaporization |
| 12/23/2004 | DE10324043A1 Manufacturing method for a chip card with a functional insert such as a display, whereby two plastic films with insert holes are overlapped to provide an insert window with at least an electrical contact for an electronic part |
| 12/22/2004 | EP1489698A2 Device and method for electrical connection of an electric conductor with an electronic element |
| 12/22/2004 | EP1489696A2 Method for contacting conductive fibers |
| 12/22/2004 | EP1489695A1 Anisotropic conductive film and method for producing the same |
| 12/22/2004 | EP1489687A1 Dielectric substrate with selectively controlled effective permittivity and loss tangent |
| 12/22/2004 | EP1489471A1 Ground connection of a printed circuit board placed in a wristwatch-type electronic device |
| 12/22/2004 | EP1489460A2 Light-sensitive sheet comprising support, first light-sensitive layer and second light-sensitive layer |
| 12/22/2004 | EP1488880A2 Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method |
| 12/22/2004 | EP1488827A1 Process for fabricating electrode structures and electrode structure and use thereof |
| 12/22/2004 | EP1488025A1 Conveyorized plating line and method for electrolytically metal plating a workpiece |
| 12/22/2004 | EP1487888A2 Polymerisable composition |
| 12/22/2004 | EP1487759A1 Method for the production of a metal-ceramic substrate, preferably a copper-ceramic substrate |
| 12/22/2004 | EP1487646A1 Method of stripping silver from a printed circuit board |
| 12/22/2004 | EP1487605A1 Device and method for laser structuring functional polymers and the uses thereof |
| 12/22/2004 | EP1433368B1 Electronic circuit comprising conductive bridges and method for making such bridges |
| 12/22/2004 | EP1363811B1 Method for producing a moulded vehicle component comprising an integrated conductor strip and moulded vehicle component |
| 12/22/2004 | EP1106039B1 Method for producing a contact between two conductive layers separated by an insulating layer |
| 12/22/2004 | CN2666089Y Electronic package surface adhesion and resin reinforced adhesion structure |
| 12/22/2004 | CN2666088Y Fixing combined device of swinging framework of circuit board printing machine |
| 12/22/2004 | CN1557000A Conductive paste and conductive film using it, plating method and production method for fine metal component |
| 12/22/2004 | CN1556927A Tester and testing method |
| 12/22/2004 | CN1556926A Tester and testing method |
| 12/22/2004 | CN1556738A Flux composition for solder, solder paste, and method of soldering |
| 12/22/2004 | CN1556667A Electric conductor embedding method and circuit board and chip using said method |
| 12/22/2004 | CN1556666A Plane display capable of proventing heat expansion effect accumulating and its printing circuit board |
| 12/22/2004 | CN1555952A Connecting method of electric conductor and welding flux and electron component element using said method |
| 12/22/2004 | CN1181718C Multi-layer circuit board and its preparing process |
| 12/22/2004 | CN1181717C Multilayer printed wiring board and its manufacturing method, and resin composition for filling through-hole |
| 12/22/2004 | CN1181716C Multilayer ceramic supporting base with anchored welding pad and its mfg. method |
| 12/22/2004 | CN1181715C Element assembling methodfor connecting board of circuitboard |
| 12/22/2004 | CN1181714C Method for making multi-layer circuit board by substrate with open |
| 12/22/2004 | CN1181713C Method and system for processing metal-clad laminate for printed-circuit board |
| 12/22/2004 | CN1181712C Device for removing printed circuit board film |
| 12/22/2004 | CN1181710C Method for mfg. glass-ceramic board |
| 12/22/2004 | CN1181528C Probe card for testing semiconductor chip with many semiconductor device and method thereof |
| 12/22/2004 | CN1181526C Component installation method and manufacture method of electro-optical device thereof |
| 12/22/2004 | CN1181383C Liquid crystal display and its inspecting method |
| 12/22/2004 | CN1181354C Inspection unit and method of manufacturing substrate |
| 12/22/2004 | CN1181229C Electrochemical processing device and method for transferring current to printed circuitboard material |
| 12/22/2004 | CN1181140C Polyporous material |
| 12/21/2004 | US6834131 System and method for integrating optical layers in a PCB for inter-board communications |
| 12/21/2004 | US6833997 Combination terminal/leadframe for heat sinking and electrical contacts |
| 12/21/2004 | US6833911 Method and apparatus for reading firearm microstamping |
| 12/21/2004 | US6833775 Microwave circuit |
| 12/21/2004 | US6833727 Method and apparatus for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operability |
| 12/21/2004 | US6833627 To form, in situ, at least semisolid dam structures of photopolymeric material about the devices to entrap liquid, unpolymerized resin between the devices and the substrate |
| 12/21/2004 | US6833616 Multilayer wiring board with mounting pad |
| 12/21/2004 | US6833615 Via-in-pad with off-center geometry |
| 12/21/2004 | US6833613 Stacked semiconductor package having laser machined contacts |
| 12/21/2004 | US6833563 Multi-stack surface mount light emitting diodes |
| 12/21/2004 | US6833528 Method and apparatus for laser processing |
| 12/21/2004 | US6833526 Flex to flex soldering by diode laser |
| 12/21/2004 | US6833513 Crosstalk reduction in a PWB connector footprint |
| 12/21/2004 | US6833511 Multilayer circuit board and method of manufacturing the same |
| 12/21/2004 | US6833509 Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder |
| 12/21/2004 | US6833224 Metal film formed from organometallic compound; combustion |
| 12/21/2004 | US6833198 Copper clad laminate |
| 12/21/2004 | US6833087 Moisture confining barrier; protective coatings |
| 12/21/2004 | US6833042 Method of manufacturing clad board for forming circuitry, clad board, and core board for clad board |
| 12/21/2004 | US6832843 Illumination for inspecting surfaces of articles |
| 12/21/2004 | US6832827 Cleaning nozzle |
| 12/21/2004 | US6832747 Hybrid molds for molten solder screening process |
| 12/21/2004 | US6832714 Heated filling device |
| 12/21/2004 | US6832436 Method for forming a substructure of a multilayered laminate |
| 12/21/2004 | CA2334524C Electronic apparatus provided with an electronic circuit substrate having high heat dissipation |
| 12/19/2004 | CA2469371A1 Dielectric substrate with selectively controlled effective permittivity and loss tangent |
| 12/16/2004 | WO2004110120A1 Printed board and printed board unit |
| 12/16/2004 | WO2004110118A1 Method for the structured metal-coating of polymeric and ceramic support materials, and compound that can be activated and is used in said method |
| 12/16/2004 | WO2004110117A1 Substrate and process for producing the same |
| 12/16/2004 | WO2004110116A1 Production method for feedthrough electrode-carrying substrate |
| 12/16/2004 | WO2004110114A1 Flexible wiring board and flex-rigid wiring board |
| 12/16/2004 | WO2004110113A2 Electrical devices embedded in printed circuit boards |
| 12/16/2004 | WO2004109860A2 Board-to-board power connector for a projection device |
| 12/16/2004 | WO2004109802A1 Memory expansion and integrated circuit stacking system and method |
| 12/16/2004 | WO2004109719A2 Polymer thick film resistor, layout cell, and method |
| 12/16/2004 | WO2004108819A1 Vulcanized fluorine rubber and cushioning material for heat press containing same |
| 12/16/2004 | WO2004108397A1 Method for producing laminate |
| 12/16/2004 | WO2004108332A1 Drilled porous resin base material, and method of manufacturing porous resin base material with conductive drilled inner wall surface |
| 12/16/2004 | WO2004081262A8 Method of electroplating a workpiece having high-aspect ratio holes |
| 12/16/2004 | WO2004004004A3 Forming contact arrays on substrates |
| 12/16/2004 | US20040255305 Method of forming a pattern of sub-micron broad features |
| 12/16/2004 | US20040253875 Circuitized connector for land grid array |
| 12/16/2004 | US20040253862 Method for providing socket on substrate and socket applied with such method |
| 12/16/2004 | US20040253852 Electrical connector solder terminal |
| 12/16/2004 | US20040253851 Circuit-connecting structure including a terminal piece |
| 12/16/2004 | US20040253850 Electrical connector housing |
| 12/16/2004 | US20040253846 Land grid array connector including heterogeneous contact elements |
| 12/16/2004 | US20040253845 Remountable connector for land grid array packages |
| 12/16/2004 | US20040253835 Methods of fabricating patterned layers on a substrate |
| 12/16/2004 | US20040253825 Semiconductor device |
| 12/16/2004 | US20040253816 High resolution patterning method |
| 12/16/2004 | US20040253540 Exposure to alkaline developer; flexible, soldering heat resistance |
| 12/16/2004 | US20040253474 Solder joint structure, soldering method, and electronic-component manufacturing apparatus using the same structure and the method |