| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/10/2005 | WO2004101865A3 Device for treating objects, in particular for plating printed circuit boards |
| 02/10/2005 | WO2004095685A3 Low cost rf oscillator devices manufactured from conductive loaded resin-based materials |
| 02/10/2005 | WO2004084421A3 Grouped element transmission channel link with pedestal aspects |
| 02/10/2005 | WO2004068921A3 Electronic component |
| 02/10/2005 | WO2004068389A3 Method of forming a conductive metal region on a substrate |
| 02/10/2005 | US20050033125 Electrical connector for connecting electrical units, electrical device, and production method for producing electrical device |
| 02/10/2005 | US20050033069 gas-in-liquid emulsion in a reactor to continuously process relatively large quantities of materials; hydrogen peroxide synthesis by reacting a solution of DI H2O with oxygen and hydrogen gases; p-xylene oxidation by reacting p-xylene in water with oxygen |
| 02/10/2005 | US20050032946 Resin composition |
| 02/10/2005 | US20050032935 Heat-curable resin composition |
| 02/10/2005 | US20050032387 Asymmetric plating |
| 02/10/2005 | US20050032347 Method for contacting electrical contact surfaces of a substrate and device consisting of a substrate having electrical contact surfaces |
| 02/10/2005 | US20050032273 Structure and method for fine pitch flip chip substrate |
| 02/10/2005 | US20050032270 Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials |
| 02/10/2005 | US20050032258 Wiring substrate, process for manufacturing the wiring substrate, and carrier sheet for green sheet used in the manufacturing process |
| 02/10/2005 | US20050032254 Filling vias with thick film paste using contact printing |
| 02/10/2005 | US20050031996 Fabrication of durable thermal liquid discharge head; forming protective layer and anticavitation film in edge portion of wirings; ink jet printing |
| 02/10/2005 | US20050031879 Laminate for electronic circuit |
| 02/10/2005 | US20050031849 Blend of liquid crystalline aromatic polyester and dielectric ceramics |
| 02/10/2005 | US20050031837 Glass composition in binders; paste |
| 02/10/2005 | US20050031836 Pattern forming method, pattern forming apparatus, device manufacturing method, conductive film wiring, electro-optical device, and electronic apparatus |
| 02/10/2005 | US20050031795 Contacting substrate with plasma |
| 02/10/2005 | US20050031776 Method and device for applying material to a workpiece |
| 02/10/2005 | US20050031294 Method for arranging conducting lines of a flexible cable in an optical disk drive |
| 02/10/2005 | US20050030842 Optical pickup actuator and method |
| 02/10/2005 | US20050030823 Electronic circuit device |
| 02/10/2005 | US20050030762 Light-emitting diode lamp |
| 02/10/2005 | US20050030754 Systems, devices, and methods for mounting a light emitting diode |
| 02/10/2005 | US20050030725 Modular electronic assembly and method of making |
| 02/10/2005 | US20050030467 Liquid crystal display |
| 02/10/2005 | US20050030338 Inkjet printer with low nozzle to chamber cross-section ratio |
| 02/10/2005 | US20050030231 High frequency circuit module |
| 02/10/2005 | US20050029680 First hard encapsulation which covers and mechanically stabilizes the contact point of the component; and a second encapsulation of silicone, polyurethane and/or a textile adhesive that permits a mechanical connection of the component to the textile; resistant to laundering and ironing of the clothing |
| 02/10/2005 | US20050029676 Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks |
| 02/10/2005 | US20050029675 Tin/indium lead-free solders for low stress chip attachment |
| 02/10/2005 | US20050029667 Electroconductive alloy of tin and lead; first fluxing agent reacting with oxide of metal to promote melting of metal at first temperature; second fluxing agent having higher melting temperature; resolidification; rosin or resin binder |
| 02/10/2005 | US20050029666 Semiconductor device structural body and electronic device |
| 02/10/2005 | US20050029635 Film substrate, semiconductor device, method of manufacturing film substrate, method of manufacturing semiconductor device and method of manufacturing circuit board with semiconductor device |
| 02/10/2005 | US20050029552 Bow control in an electronic package |
| 02/10/2005 | US20050029550 Semiconductor die packages with recessed interconnecting structures |
| 02/10/2005 | US20050029515 Organic/inorganic oxide mixed film, passive device contained electronic substrate using the film, and method of manufacturing organic/inorganic oxide mixed film |
| 02/10/2005 | US20050029334 Multi-functional solder and articles made therewith, such as microelectronic components |
| 02/10/2005 | US20050029110 Circuit board having electrically conductive structure formed between circuit layers thereof and method for fabricating the same |
| 02/10/2005 | US20050029109 Method of electrochemically fabricating multilayer structures having improved interlayer adhesion |
| 02/10/2005 | US20050029014 Multilayer; dielectric substrate with aperture, grounding layer and electroconductive overcoatings |
| 02/10/2005 | US20050029013 Printed wiring board having impedance-matched differential pair signal traces |
| 02/10/2005 | US20050029012 Green ceramic insert, ceramic insert, ceramic green body or green body composite and ceramic laminated composite produced thereby |
| 02/10/2005 | US20050029011 Circuit board |
| 02/10/2005 | US20050029008 Surface mounted electronic circuit module |
| 02/10/2005 | US20050028887 Electroconductive alloy of tin and lead; first fluxing agent reacting with oxide of metal to promote melting of metal at first temperature; second fluxing agent having higher melting temperature; resolidification; rosin or resin binder |
| 02/10/2005 | US20050028363 Contact structures and methods for making same |
| 02/10/2005 | US20050028362 Method for producing a semiconductor device in chip format |
| 02/10/2005 | US20050028358 Process for manufacturing multilayer flexible wiring boards |
| 02/10/2005 | DE202004016572U1 Verbindungsstück für Karten mit gedruckten Schaltkreisen Connector for cards with printed circuits |
| 02/10/2005 | DE202004016463U1 Bauelement für Leiterplattenbestückung Component for PCB Assembly |
| 02/10/2005 | DE19964335A1 Applying metal coating to the surface of different materials used in the production of e.g. circuit boards comprises degreasing and cleaning the surface to be coated, mechanically applying the particles, and heating |
| 02/10/2005 | DE19840167B4 Verfahren zur elektrischen Prüfung von Basismaterial für die Herstellung gedruckter Schaltungen und Verfahren zur Erzeugung einer elektrisch geprüften Leiterplatte A method for electrical testing of a base material for the production of printed circuits and methods for producing a circuit board electrically tested |
| 02/10/2005 | DE10350568A1 Production of foil cables or multi-layered circuit boards for printed circuits comprises using a thermoplastic plastic support film absorbing a prescribed wavelength with strip conductors or a thermoplastic circuit board |
| 02/10/2005 | DE10336171B3 Multichip-Schaltungsmodul und Verfahren zur Herstellung hierzu Multichip circuit module and method for manufacturing this, |
| 02/10/2005 | DE10333566A1 Electrical connection between parallel electronic circuit boards is provided by hollow studs that also provide mechanical support |
| 02/10/2005 | DE10332827A1 Electrical, mechanical, electromechanical, electrooptical or electroacoustic component has flux diversion structures between solder pad and component structure at surface of component substrate |
| 02/10/2005 | DE10329653A1 Chip card for contactless data transfer using stud bumps pressed into connection locations when chip module is assembled in card body |
| 02/10/2005 | DE10326788A1 Kontaktoberflächen für elektrische Kontakte und Verfahren zur Herstellung Contact surfaces for electrical contacts and processes for preparing |
| 02/10/2005 | DE10259310B4 Verfahren zur Herstellung eines elektronischen Teils und stromloses Plattierverfahren A method of manufacturing an electronic part and electroless plating |
| 02/10/2005 | DE10241662B4 Verfahren und Einrichtung zur Überwachung des Prozesses beim Verlöten von durch Induktion erwärmten Leitern Method and apparatus for monitoring the process in soldering heated by induction conductors |
| 02/09/2005 | EP1505860A1 Surface mounted electronic circuit module |
| 02/09/2005 | EP1505859A2 Multilayer printed wiring board having filled via-holes |
| 02/09/2005 | EP1505858A2 Circuit module and manufacturing method thereof |
| 02/09/2005 | EP1505857A2 Printed circuit board assembly with integrated connector |
| 02/09/2005 | EP1505685A1 Microstrip line and method for producing of a microstrip line |
| 02/09/2005 | EP1505645A2 Resin moulded electronic module |
| 02/09/2005 | EP1505040A1 Thick film dielectric compositions for use on aluminium nitride substrates |
| 02/09/2005 | EP1504636A1 Cooled power switching device |
| 02/09/2005 | EP1504466A2 Metal object to be at least partially coated with a substance |
| 02/09/2005 | EP1503665A1 Woven electronic textile, yarn and article |
| 02/09/2005 | EP1110437B1 Scanning method and apparatus |
| 02/09/2005 | EP1057384B1 Electronic control device |
| 02/09/2005 | CN1578853A Method and conveyorized system for electorlytically processing work pieces |
| 02/09/2005 | CN1578753A Method for manufacturing metal microstructure |
| 02/09/2005 | CN1578728A Polyimide-metal layered products and polyamideimide-metal layered product |
| 02/09/2005 | CN1578713A Solder metal, soldering flux and solder paste |
| 02/09/2005 | CN1578609A Mounting structure for circuit board in electronic device and mounting method thereof |
| 02/09/2005 | CN1578602A Image forming apparatus and image forming method and program |
| 02/09/2005 | CN1578600A Parts coupling device and method and parts assembling device |
| 02/09/2005 | CN1578599A Regenerating method for welding tool |
| 02/09/2005 | CN1578597A Wiring substrate, apparatus for producing wiring substrate and method for producing the same |
| 02/09/2005 | CN1578594A Copper compound and method for producing copper thin film using the same |
| 02/09/2005 | CN1578593A Wiring board provided with a resistor and process for manufacturing the same |
| 02/09/2005 | CN1578591A Flexible substrate and a connection method thereof that can achieve reliable connection |
| 02/09/2005 | CN1578590A Printed wiring board, electronic component mounting method, and electronic apparatus |
| 02/09/2005 | CN1578589A Wiring substrate for intermediate connection and multi-layered wiring board and their production |
| 02/09/2005 | CN1578588A Flexible wiring plate and producing method thereof |
| 02/09/2005 | CN1578587A Hybrid integrated circuit device |
| 02/09/2005 | CN1578585A Epoxy resin laminated plate for reinforced material of flexible printed circuit board |
| 02/09/2005 | CN1578584A Method for bonding reinforcing plate |
| 02/09/2005 | CN1578015A Suction cap for ic sockets and ic socket assembly using same |
| 02/09/2005 | CN1577839A Hybrid integrated circuit |
| 02/09/2005 | CN1577827A Semiconductor device and its manufacturing method |
| 02/09/2005 | CN1577826A Semiconductor device and mixed integrated circuit device |
| 02/09/2005 | CN1577819A Circuit board with in-built electronic component and method for manufacturing the same |
| 02/09/2005 | CN1577818A Cost-reducing and process-simplifying wiring board and manufacturing method thereof |