| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/17/2005 | US20050034302 Component connecting apparatus and method and component mounting apparatus |
| 02/17/2005 | DE4343509B4 Leitfähiges Element und seine Verwendung Conductive element and its use |
| 02/17/2005 | DE202004018149U1 Adapter plate or board for surface mount device (SMD), requires use of production panel of specified maximum thickness |
| 02/17/2005 | DE10335230A1 Verfahren zur Herstellung von RFID Etiketten A process for producing RFID labels |
| 02/17/2005 | DE10333806A1 Printed circuit board e.g. for mobile telephone components comprising screen for at least one component against electromagnetic radiation |
| 02/17/2005 | DE10333439A1 Verfahren zur Herstellung eines aus mehreren Verdrahtungsebenen bestehenden Hybrid-Produktes Process for the preparation of a multi-wiring planes hybrid product |
| 02/17/2005 | DE10332573A1 Verfahren zum Erzeugen von Lotkontakten auf Bauelementen und Bauelement bzw. Lotdepot-Trägerplatte mit Eignung zur Anwendung in diesem Verfahren A method for generating Lotkontakten on components and component or solder deposit base board with suitability for use in this process, |
| 02/17/2005 | DE10331574A1 Leistungshalbleitermodul The power semiconductor module |
| 02/17/2005 | DE10329325A1 Structuring treatment of surface with edge, on which protection layer is deposited and then removed by etching together with edge |
| 02/17/2005 | DE10259195B4 System und Verfahren zum Löten von Oberflächenmontagekomponenten an ein Substrat unter Verwendung eines Lasers System and method for the soldering of surface mount components to a substrate using a laser |
| 02/17/2005 | DE102004032903A1 Leitfähiges Pulver und Verfahren zur Herstellung desselben Conductive powder and process for producing same |
| 02/16/2005 | EP1507448A1 Base material, substrate and connection module |
| 02/16/2005 | EP1507171A2 Light-Sensitive sheet comprising support, first and second light-sensitive layers and barrier layer |
| 02/16/2005 | EP1507169A1 Photosensitive thick-film paste materials for forming light-transmitting electromagnetic shields, light-transmitting electromagnetic shields formed using the same, and method of manufacture thereof |
| 02/16/2005 | EP1506701A1 Improved structure of stacked vias in multiple layer electronic device carriers |
| 02/16/2005 | EP1506578A2 Glass material for use at high frequencies |
| 02/16/2005 | EP1506568A2 Direct-connect signaling system |
| 02/16/2005 | EP1506329A1 Methods and apparatus for monitoring deposition quality during conformable contact mask plating operations |
| 02/16/2005 | EP1410403A4 Low temperature method and compositions for producing electrical conductors |
| 02/16/2005 | EP1147070B1 Electrically conductive ceramic layers |
| 02/16/2005 | EP0877713B1 Ultrasonic mixing of through hole treating compositions |
| 02/16/2005 | CN2679972Y Rigid/floexible multilayer board |
| 02/16/2005 | CN2679971Y 锁定工具 Lockdown |
| 02/16/2005 | CN2679970Y Welding structure of circuit protecting component |
| 02/16/2005 | CN2679969Y Tool for preventing golden finger from soaking tin |
| 02/16/2005 | CN2678805Y Aluminium composite substrate |
| 02/16/2005 | CN1582416A Photosensitive film and photosensitive composition for printed wiring board and production processes |
| 02/16/2005 | CN1582415A Photosensitive ceramics composition and method for making multi-layer substrate using it |
| 02/16/2005 | CN1582318A Flame-retardant heat-resistant resin composition and adhesive film comprising the same |
| 02/16/2005 | CN1582232A 丝网印刷设备 Screen Printing Equipment |
| 02/16/2005 | CN1582096A Printing clamp for printing circuit substrate |
| 02/16/2005 | CN1582095A Mask-free ceramic base board interconnecting lead manufacturing technique |
| 02/16/2005 | CN1582094A Figure-forming method and wire-layout figure forming method and photoelectronic device |
| 02/16/2005 | CN1582093A Figure-forming method and wire-layout figure forming method, photoelectronic device and electronic apparatus |
| 02/16/2005 | CN1582092A Method for forming wire-layout pattern and method for making semiconductor device and photoelectronic device |
| 02/16/2005 | CN1582091A Method for forming store grid cofferdam and pattern , photoelectronic device and electronic machine |
| 02/16/2005 | CN1582090A Method for making circuit substrate |
| 02/16/2005 | CN1582089A Method for manufacturing soft circuit board |
| 02/16/2005 | CN1582088A Method and device for checking and comparing consistency of circuit schematic diagram and PCB wiring diagram |
| 02/16/2005 | CN1582087A Electronic circuit unit |
| 02/16/2005 | CN1582086A 电子线路单元 Electronic circuit unit |
| 02/16/2005 | CN1581711A 天线开关模块 Antenna Switch Module |
| 02/16/2005 | CN1581524A Light-emitting diode lamp |
| 02/16/2005 | CN1581473A Lead frame and its manufacturing method and semiconductor device |
| 02/16/2005 | CN1581472A Wire-layingout plate and its making method, semiconductor device and its making method |
| 02/16/2005 | CN1581454A Encapsulated pin structure for improved reliability of wafer |
| 02/16/2005 | CN1581447A Method for making layout wire and method for making semiconductor device |
| 02/16/2005 | CN1581436A Method for forming corrosion-resisting pattern and distribution pattern, and method for making semiconductor device |
| 02/16/2005 | CN1581370A Method for manufacturing film resistance |
| 02/16/2005 | CN1581346A Optical head activator and driving method |
| 02/16/2005 | CN1580950A Pattern production system, exposure system, and exposure method |
| 02/16/2005 | CN1580889A Display panel having noise shielding structure |
| 02/16/2005 | CN1579772A Ink-jet head |
| 02/16/2005 | CN1579698A Thermal-setting welding-assistant, welding paste and welding method |
| 02/16/2005 | CN1190118C Multilayer printed wiring board manufacturing method |
| 02/16/2005 | CN1190117C Method of producing ceramic multilayer substrate |
| 02/16/2005 | CN1190116C Method for preventing production of tin ball and its mould |
| 02/16/2005 | CN1190115C composite materid for making printed substrate |
| 02/16/2005 | CN1190114C Substrate structure |
| 02/16/2005 | CN1190113C Ceramic laminated device |
| 02/16/2005 | CN1189983C HF signal conversion apparatus |
| 02/16/2005 | CN1189982C Connecting plug and method for manufacturing the same |
| 02/16/2005 | CN1189929C Electronic element mounting body and its producing method and electronic apparatus using it |
| 02/16/2005 | CN1189893C Conductive pasty material, method for controlling its viscosity and electronic component using same |
| 02/15/2005 | US6856362 Structure of liquid crystal display device for easy assembly and disassembly |
| 02/15/2005 | US6856210 High-frequency multilayer circuit substrate |
| 02/15/2005 | US6856209 EMI suppression method for powertrain control modules |
| 02/15/2005 | US6856151 Conductive polymer contact system and test method for semiconductor components |
| 02/15/2005 | US6856017 Device having resin package and method of producing the same |
| 02/15/2005 | US6856008 Laminated multilayer package |
| 02/15/2005 | US6855953 Electronic circuit assembly having high contrast fiducial |
| 02/15/2005 | US6855892 Insulation sheet, multi-layer wiring substrate and production processes thereof |
| 02/15/2005 | US6855891 Card edge connector, method of manufacturing same, electronic card and electronic equipment |
| 02/15/2005 | US6855738 Grafting brominated epoxy resins with carbonic esters, then curing to form low dielectric nanostructure composites |
| 02/15/2005 | US6855626 Wiring substrate having position information |
| 02/15/2005 | US6855625 Conductor pattern film; filling aperture with conductive paste; lamination electrode by pressing, heating thermoplastic resin |
| 02/15/2005 | US6855623 Recessed tape and method for forming a BGA assembly |
| 02/15/2005 | US6855399 Copper paste and wiring board using the same |
| 02/15/2005 | US6855385 PCB support plate for PCB via fill |
| 02/15/2005 | US6855378 Printing of electronic circuits and components |
| 02/15/2005 | US6855367 Method of producing electronic parts, and member for production thereof |
| 02/15/2005 | US6855191 Reducing agent that is oxidized by gold, and an additional reducing agent that is either oxidized by gold or by a substrate metal |
| 02/15/2005 | US6854853 Method for wave soldering of surface mounted light emitting diodes |
| 02/15/2005 | US6854671 Nozzle for ejecting molten metal |
| 02/15/2005 | US6854636 Structure and method for lead free solder electronic package interconnections |
| 02/15/2005 | US6854633 Flux includes a dielectric resin such as an epoxy resin, a silicone resin, natural or synthetic rubber that cures to form polymer support members; fluxing agent such as an organic acid for removing oxides from the contact pads |
| 02/15/2005 | US6854418 Intensive machine for performing a plurality of processes in fabrication of multilayer substrate |
| 02/15/2005 | US6854179 Modification of circuit features that are interior to a packaged integrated circuit |
| 02/15/2005 | US6854176 Process for manufacturing a composite polymeric circuit protection device |
| 02/15/2005 | CA2325148C Bus bar heat sink |
| 02/15/2005 | CA2235991C Method and apparatus for dispensing small amounts of liquid material |
| 02/10/2005 | WO2005013653A1 Printed-wiring board and method of producing the same |
| 02/10/2005 | WO2005013652A1 Connecting flexible circuitry by stitching |
| 02/10/2005 | WO2005013363A2 Circuit arrangement placed on a substrate and method for producing the same |
| 02/10/2005 | WO2005013189A2 Method for producing rfid labels |
| 02/10/2005 | WO2005012445A2 Conducting inks |
| 02/10/2005 | WO2005012368A2 Method and chemistry for automatic self-joining of failures in polymers |
| 02/10/2005 | WO2005011908A1 Method for producing connections in a micro electronics system |
| 02/10/2005 | WO2005011877A2 Method and device for filling areas situated in hollows or between tracks with a viscous product on a printed circuit board and equipment using said device |
| 02/10/2005 | WO2004111299A3 Solution and method for ultra thin, non-porous and highly adhesive gold coating |