| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/09/2005 | CN1577813A 电路模块及其制造方法 Circuit module and manufacturing method thereof |
| 02/09/2005 | CN1577783A Semiconductor device and method of manufacturing the same |
| 02/09/2005 | CN1577755A Laser beam processing method and laser beam processing machine |
| 02/09/2005 | CN1577736A Module with a built-in semiconductor and method for producing the same |
| 02/09/2005 | CN1577735A Method of forming multilayer interconnection structure, method of manufacturing circuit board, and method of manufacturing device |
| 02/09/2005 | CN1577638A Conductive powder and producing method thereof |
| 02/09/2005 | CN1577187A Surface-mounted antenna apparatus |
| 02/09/2005 | CN1576972A 显示装置 The display device |
| 02/09/2005 | CN1576395A Etchant, replenishment solution and method for producing copper wiring using the same |
| 02/09/2005 | CN1576295A Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition containing the same, film-forming material and adhesive for electronic parts made thereof |
| 02/09/2005 | CN1575979A Method for controlling screen printer |
| 02/09/2005 | CN1575947A Stamping device for generally flat articles |
| 02/09/2005 | CN1575862A Viscous material noncontact jetting system |
| 02/09/2005 | CN1189071C Mounting machine and its part mounting method |
| 02/09/2005 | CN1189068C Multi-layered printed circuit board and prodn. method thereof |
| 02/09/2005 | CN1189067C Production method of circuit substrate module |
| 02/09/2005 | CN1189066C Tinol printer capable of being beneficial to tinol actively separating |
| 02/09/2005 | CN1189065C Method for making printed circuit board with corrosion-resistant dry film |
| 02/09/2005 | CN1189064C Electrode joint structure and its manufacture |
| 02/09/2005 | CN1188908C Metallizing system |
| 02/09/2005 | CN1188902C Method for shaping layered patterns |
| 02/09/2005 | CN1188840C Bonding pad of suspension circuit |
| 02/09/2005 | CN1188748C Optical imaging compositions with improved flexibility and stripping ability, dry film photoetching glue and oligomer thereof |
| 02/09/2005 | CN1188747C Optical imaging compositions with improved stripping ability and resolution and dry film photoetching glue |
| 02/09/2005 | CN1188367C Insulation ceramic press block, ceramic laminal substrate and ceramic electronic device |
| 02/09/2005 | CN1188333C Printed circuit board film adhering device |
| 02/08/2005 | US6853779 Floating optical carrier |
| 02/08/2005 | US6853558 Surface mount power supply device and associated method |
| 02/08/2005 | US6853544 Process for forming printed circuit film used in waterproof keyboard |
| 02/08/2005 | US6853542 Video-apparatus-tuner mounting board |
| 02/08/2005 | US6853334 Multi-layer-substrate and satellite broadcast reception apparatus |
| 02/08/2005 | US6853210 Test interconnect having suspended contacts for bumped semiconductor components |
| 02/08/2005 | US6853092 Circuit board, mounting structure for semiconductor device with bumps, and electro-optic device and electronic device |
| 02/08/2005 | US6853091 Printed circuit board and soldering structure for electronic parts thereto |
| 02/08/2005 | US6853088 Semiconductor module and method for fabricating the semiconductor module |
| 02/08/2005 | US6853087 Component and antennae assembly in radio frequency identification devices |
| 02/08/2005 | US6853084 Conducting wires for electroplating are not necessary to be formed on the substrate, so that the effective area for circuit layout pattern is increased and the noise is thus reduced. |
| 02/08/2005 | US6853080 Electronic device and method of manufacturing the same, and electronic instrument |
| 02/08/2005 | US6853077 Ball electrode made of a Sn Zn-based lead-free solder of 7-9.5 wt % zinc and the remaining tin. |
| 02/08/2005 | US6853074 Electronic part, an electronic part mounting element and a process for manufacturing such the articles |
| 02/08/2005 | US6853061 Dual power supply method and apparatus |
| 02/08/2005 | US6853060 Semiconductor package using a printed circuit board and a method of manufacturing the same |
| 02/08/2005 | US6853001 Electrode substrate of plasma display panel and method for making the same |
| 02/08/2005 | US6852932 Circuit board with air-bridge |
| 02/08/2005 | US6852931 Configuration having an electronic device electrically connected to a printed circuit board |
| 02/08/2005 | US6852830 Polythiophenes formed form monomers such as (2,3-dihydro-thieno(3,4-b)(1,4)dioxin-2-yl-methoxy)-acetic acid, for use as coatings, printable pastes or electroconductive layers |
| 02/08/2005 | US6852814 Thermosetting resin compositions containing maleimide and/or vinyl compounds |
| 02/08/2005 | US6852627 Conductive through wafer vias |
| 02/08/2005 | US6852625 Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same |
| 02/08/2005 | US6852571 Method of manufacturing stacked semiconductor device |
| 02/08/2005 | US6852569 Method of fabricating multilayer ceramic substrate |
| 02/08/2005 | US6852427 Directed to an aqueous, antitarnish and adhesion promoting treatment composition, comprising: zinc ions; metal ions selected from the group consisting of tungsten ions, molybdenum ions, cobalt ions, nickel ions, zirconium ions, |
| 02/08/2005 | US6852152 Colloidal seed formulation for printed circuit board metallization |
| 02/08/2005 | US6851999 Interactive LED device |
| 02/08/2005 | US6851599 Method for producing multilayer wiring circuit board |
| 02/08/2005 | US6851598 Electronic component with a semiconductor chip and method for producing the electronic component |
| 02/08/2005 | US6851596 Wave soldering apparatus |
| 02/08/2005 | US6851184 Method for manufacturing a printed circuit board |
| 02/08/2005 | CA2320064C Method of making microwave, multifunction modules using fluoropolymer composite substrates |
| 02/08/2005 | CA2159188C An electric fuse and protective circuit |
| 02/03/2005 | WO2005011347A1 Overmolded mcm with increased surface mount component reliability |
| 02/03/2005 | WO2005011346A1 Component support capable of being brazed by refusion |
| 02/03/2005 | WO2005011345A1 Layer assembly for a supporting part, which can be fitted with electronic components, and method for the production thereof |
| 02/03/2005 | WO2005011343A2 Circuit board with embedded components and method of manufacture |
| 02/03/2005 | WO2005011341A2 Electronic module with dual connectvity |
| 02/03/2005 | WO2005010990A2 Memory stack using flexible circuit and low-profile contacts |
| 02/03/2005 | WO2005010930A2 Method for forming high resolution electronic circuits |
| 02/03/2005 | WO2005010812A1 Peripheral card with hidden test pins |
| 02/03/2005 | WO2005010808A2 Memory card with raised portion |
| 02/03/2005 | WO2005010599A1 Electronic apparatus with a wiring terminal |
| 02/03/2005 | WO2005010241A1 Surface-treated copper foil having blackening-treated surface, process for producing the surface-treated copper foil and, using the surface-treated copper foil, electromagnetic wave shielding conductive mesh for front panel of plasma display |
| 02/03/2005 | WO2005010108A1 Palladium complexes for printing circuits |
| 02/03/2005 | WO2005009733A1 Screen printing apparatus |
| 02/03/2005 | WO2004107260A3 Method for producing a contactless ticket comprising a chip |
| 02/03/2005 | WO2004090942A3 Thermally conductive adhesive composition and process for device attachment |
| 02/03/2005 | WO2004088722A3 Printed wiring board, apparatus for electrically connecting an electronic element and a substrate, and method for manufacturing a printed wiring board |
| 02/03/2005 | WO2004077506A3 Resistive vias in a substrate and method of making |
| 02/03/2005 | WO2004001807B1 Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs |
| 02/03/2005 | WO2002020876A3 Segmenting of processing system into wet and dry areas |
| 02/03/2005 | US20050027078 Releases the flowable polymerizing agent responsive to the rupturing and cross-linking the flowable polymerizing agent with the plurality of reactable pendant groups in the failure region |
| 02/03/2005 | US20050026478 Solder bearing conductive terminal |
| 02/03/2005 | US20050026421 Method of forming multilayer interconnection structure, method of manufacturing circuit board, and method of manufacturing device |
| 02/03/2005 | US20050026419 Method of forming multilayer interconnection structure, and manufacturing method for multilayer wiring boards |
| 02/03/2005 | US20050026416 Encapsulated pin structure for improved reliability of wafer |
| 02/03/2005 | US20050026414 Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads |
| 02/03/2005 | US20050026330 Conductive block mounting process for electrical connection |
| 02/03/2005 | US20050026069 Solventless thermosetting photosensitive via-filling material |
| 02/03/2005 | US20050026051 UV absorbing glass cloth and use thereof |
| 02/03/2005 | US20050025990 Controlling concentration gradient of diffused material of overcoating |
| 02/03/2005 | US20050025946 Mixture of binder, photopolymerizable compound and photoinitiator |
| 02/03/2005 | US20050025944 Heat resistance; low temperature fusion; forming apertures in dielectric substrate |
| 02/03/2005 | US20050025919 Low cost conductive containers manufactured from conductive loaded resin-based materials |
| 02/03/2005 | US20050025897 Kinetic spray application of coatings onto covered materials |
| 02/03/2005 | US20050024840 Power distribution system with a dedicated power structure and a high performance voltage regulator |
| 02/03/2005 | US20050024839 Ball grid array package |
| 02/03/2005 | US20050024573 Display panel having noise shielding structure |
| 02/03/2005 | US20050024553 Semiconductor device, liquid crystal module adopting same, method of manufacturing liquid crystal module, and electronic equipment adopting same |
| 02/03/2005 | US20050024437 Inkjet printer with low droplet to chamber volume ratio |
| 02/03/2005 | US20050024436 Inkjet nozzle with long ink supply channel |
| 02/03/2005 | US20050024424 Inkjet printer |