| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/09/2004 | DE10325559B3 Verfahren und Vorrichtung zum Herstellen eines Systems mit einer an einer vorbestimmten Stelle einer Oberfläche eines Substrats aufgebrachten Komponente Method and apparatus for producing a system with an applied at a predetermined position of a surface of a substrate component |
| 12/09/2004 | DE10323761A1 Selektives Aufbringen und Trocknen einer Beschichtung auf einer Leiterplatte Selectively applying and drying a coating on a printed circuit board |
| 12/09/2004 | DE102004024753A1 Konforme Dichtfolie Compliant sealing film |
| 12/09/2004 | DE102004023294A1 Vektortransientes Aufschmelzen von bleifreiem Lot zur Beherrschung von Substratverwerfung Vektortransientes melting of lead-free solder for the control of substrate warpage |
| 12/09/2004 | DE102004019878A1 Eine Klebeschicht bildende Lösung, Verfahren zur Herstellung einer die Lösung verwendende Kupfer-zu-Harz-Klebeschicht, und durch dieses Verfahren gewonnenes beschichtetes Produkt Forming an adhesive layer solution, process for preparing a copper-to-resin adhesive layer, the solution used, and coated product obtained by this method |
| 12/09/2004 | DE102004002274A1 Component gluing method for circuit board, involves selecting distance between circuit component edge and adhesive lines, and quantity of adhesive, for applying adhesive along lines for placing circuit components on circuit board |
| 12/09/2004 | DE10126568B4 Elektronisches Bauelement sowie Verfahren zur Herstellung desselben The same electronic device and methods for preparing |
| 12/09/2004 | CA2526068A1 Method for producing metal conductors on a substrate |
| 12/08/2004 | EP1484952A1 Multilayer wiring board, base for multilayer wiring board, printed wiring board, and its manufacturing method |
| 12/08/2004 | EP1484950A2 Method for electrical connection |
| 12/08/2004 | EP1484949A2 Processing low dielectric constant materials for high speed electronics |
| 12/08/2004 | EP1484793A1 Electronic circuit device and porduction method therefor |
| 12/08/2004 | EP1484714A1 Conductive paste and method of forming antenna for transponder |
| 12/08/2004 | EP1484713A1 Conductive paste and method of forming an antenna for transponder |
| 12/08/2004 | EP1484430A2 Deposition of copper layers on substrates |
| 12/08/2004 | EP1484119A1 Printed circuit board recycle method and apparatus thereof |
| 12/08/2004 | EP1483723A1 Methods and apparatus for fabricating chip-on-board modules |
| 12/08/2004 | EP1483722A1 Memory module assembly using partially defective chips |
| 12/08/2004 | EP1483419A2 Lead−free tin−silver−copper alloy solder composition |
| 12/08/2004 | EP1483320A2 Printing of organic conductive polymers containing additives |
| 12/08/2004 | EP1419678B1 Thermosetting electroconductive paste for electroconductive bump use |
| 12/08/2004 | EP1266426A4 Method for forming radio frequency antenna using conductive inks |
| 12/08/2004 | EP1224847A4 Flexible circuit board and method for making a flexible circuit board |
| 12/08/2004 | CN2662596Y 电路板 Circuit board |
| 12/08/2004 | CN2662595Y Component for guiding printed circuit board to be inserted into apparatus |
| 12/08/2004 | CN1554215A A method of etching copper on cards |
| 12/08/2004 | CN1554214A An electronic assembly and a method of constructing an electronic assembly |
| 12/08/2004 | CN1554213A Pin-free socket compatible with optical-electrical interconnects |
| 12/08/2004 | CN1554115A Circuit device mounitng method and press |
| 12/08/2004 | CN1554100A Coated conductive particle, coated conductive particle manufacturing method, anisotropic conductive material, and conductive connection structure |
| 12/08/2004 | CN1553855A Method for producing a ceramic substrate and ceramic substrate |
| 12/08/2004 | CN1553763A Circuitized substrate assembly and method of making same |
| 12/08/2004 | CN1553762A Wire fixing method and fixer |
| 12/08/2004 | CN1553761A Multilayer printed wiring board, solder resist composition, method for manufacturing multilayer printed wiring board, and semiconductor device |
| 12/08/2004 | CN1553760A Printed circuit boarsd with high-radiating metallized holes with Al or Mg or their alloy basement and production thereof |
| 12/08/2004 | CN1179614C Method for making multi-layer PCB composed of flexible and rigid layers |
| 12/08/2004 | CN1179613C Surface treatment method to improve adhesive force of organic low dielectric constant layer |
| 12/08/2004 | CN1179612C Printed circuit board and mask of screen printing such printed circuit board |
| 12/08/2004 | CN1179611C Composite foil of aluminium and copper |
| 12/08/2004 | CN1179610C Method for making circuit board |
| 12/08/2004 | CN1179609C Pressure-bonded substrate, liquid crystal device, and electronic device |
| 12/08/2004 | CN1179414C 电子电路组件 Electronic circuit assembly |
| 12/08/2004 | CN1179381C Method of manufacturing plurality of electronic components |
| 12/08/2004 | CN1179378C Monolithic inductor and its manufacturing method |
| 12/08/2004 | CN1179355C Flexible wiring base unit and wiring board |
| 12/08/2004 | CN1179348C Data processing of Bitstream signal |
| 12/08/2004 | CN1179244C Photopolymerizable thermosetting resin composition |
| 12/08/2004 | CN1179014C Fire resistant adhesive and circuit components using same |
| 12/08/2004 | CN1178760C Composition for preventing creeping of flux for soldering and use thereof |
| 12/07/2004 | US6829749 Design support apparatus for circuit including directional coupler, design support tool, method of designing circuit, and circuit board |
| 12/07/2004 | US6829149 Placement of sacrificial solder balls underneath the PBGA substrate |
| 12/07/2004 | US6829148 Apparatus and method for providing a ground reference potential |
| 12/07/2004 | US6829147 Multilayered hybrid electronic module |
| 12/07/2004 | US6829133 Capacitor |
| 12/07/2004 | US6828898 Fuel tank resistor card having improved corrosion resistance |
| 12/07/2004 | US6828812 Test apparatus for testing semiconductor dice including substrate with penetration limiting contacts for making electrical connections |
| 12/07/2004 | US6828677 Precision electroplated solder bumps and method for manufacturing thereof |
| 12/07/2004 | US6828670 Module component |
| 12/07/2004 | US6828669 Plurality of terminal pads located at positions corresponding to plurality of solder bumps or flip chips; semiconductors |
| 12/07/2004 | US6828667 Surface mounting type electronic component |
| 12/07/2004 | US6828660 Semiconductor device with double nickel-plated leadframe |
| 12/07/2004 | US6828543 Flip chip package structure for an image sensor and an image sense module with the flip chip package structure |
| 12/07/2004 | US6828524 Method and apparatus for cleaning inkjet cartridges |
| 12/07/2004 | US6828514 High speed circuit board and method for fabrication |
| 12/07/2004 | US6828513 Electrical connector pad assembly for printed circuit board |
| 12/07/2004 | US6828512 Apparatus and methods for interconnecting components to via-in-pad interconnects |
| 12/07/2004 | US6828511 Prefabricated semiconductor chip carrier |
| 12/07/2004 | US6828510 Multilayer printed wiring board and method of manufacturing multilayer printed wiring board |
| 12/07/2004 | US6828224 Method of fabricating substrate utilizing an electrophoretic deposition process |
| 12/07/2004 | US6828221 Manufacturing method for wiring circuit substrates |
| 12/07/2004 | US6828215 Device and method for core buildup using a separator |
| 12/07/2004 | US6828067 Polymeric matrix having a carbon pigment to absorb relatively long wavelengths of light to cause ablation of the medium and an ultraviolet absorbing dye to give high optical density in ultraviolet portions of the spectrum. |
| 12/07/2004 | US6827880 Anisotropic conductive adhesive |
| 12/07/2004 | US6827867 Method for manufacturing printed wiring board |
| 12/07/2004 | US6827833 Electrodeposition of metals in high-aspect ratio cavities using modulated reverse electric fields |
| 12/07/2004 | US6827827 Metal plating apparatus and process |
| 12/07/2004 | US6827783 Paste application apparatus and method for applying paste |
| 12/07/2004 | US6827634 Ultra fine particle film forming method and apparatus |
| 12/07/2004 | US6826987 Method for cutting movable web material |
| 12/07/2004 | US6826830 Multi-layered interconnect structure using liquid crystalline polymer dielectric |
| 12/07/2004 | CA2351245C Potted timer and circuit board assembly for use in a regenerative desiccant air dryer |
| 12/07/2004 | CA2335002C Method for encapsulating solder metal powders and solder metal powders produced according to this method |
| 12/07/2004 | CA2157587C Drum-side treated metal foil and laminate for use in printed circuit boards and methods of manufacture |
| 12/02/2004 | WO2004105456A1 Transfer assembly for manufacturing electronic devices |
| 12/02/2004 | WO2004105454A1 Wiring board manufacturing method |
| 12/02/2004 | WO2004105453A1 Through hole electrical connection structure for flexible multilayer circuit board and method for forming the same |
| 12/02/2004 | WO2004105452A1 Covering stencil and covering stencil unit |
| 12/02/2004 | WO2004105451A1 Printed ciruit board and method of producing the same |
| 12/02/2004 | WO2004105189A1 Contacting device for a flexible ribbon conductor |
| 12/02/2004 | WO2004105183A2 Method for manufacturing an emi shielding element |
| 12/02/2004 | WO2004105131A1 Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board |
| 12/02/2004 | WO2004105118A1 Stencil and method for depositing material onto a substrate |
| 12/02/2004 | WO2004105071A1 Thermal management in electronic displays |
| 12/02/2004 | WO2004105053A1 Conductive ball, method of forming electrode of electronic part, electronic part and electronic equipment |
| 12/02/2004 | WO2004104103A1 Polyimide resin composition, polymer film containing polyimide resin and laminate using the same, and method for manufacturing printed wiring board |
| 12/02/2004 | WO2004103691A1 Sheet for thermal pressing |
| 12/02/2004 | WO2004103619A2 Rotary tool holder assemblies |
| 12/02/2004 | WO2004103581A1 Selective application and drying of a coating on a printed circuit board |
| 12/02/2004 | WO2004103103A1 System for the mechanical and electrical connection of printed circuits |
| 12/02/2004 | WO2004088731A3 Methods for fabricating three-dimensional all organic interconnect structures |