| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 02/23/2005 | CN1585248A Switching power supply |
| 02/23/2005 | CN1585114A Semiconductor sealing baseplate structure of electric padding metal protective layer and producing method thereof |
| 02/23/2005 | CN1585107A Method of forming multilayer interconnection structure, and manufacturing method for multilayer wiring boards |
| 02/23/2005 | CN1585055A 电子零件 Electronic Parts |
| 02/23/2005 | CN1584745A Projection exposure device |
| 02/23/2005 | CN1584717A 液晶显示器件 Liquid crystal display device |
| 02/23/2005 | CN1584673A Manufacture of electronic device installing bodies |
| 02/23/2005 | CN1584672A Installation structure and method of electronic device, photoelectric device and electronic apparatus |
| 02/23/2005 | CN1584670A Electronic components and their manufacture |
| 02/23/2005 | CN1584575A Electrochemical biological sensor and preparing method thereof |
| 02/23/2005 | CN1583349A High performance leadless tin-copper solder for electronic elements |
| 02/23/2005 | CN1191005C Surface treatment method for copper and copper alloy |
| 02/23/2005 | CN1191004C System for mounting electronic device |
| 02/23/2005 | CN1191003C Device and method for treating circuit supports with impulse excitation |
| 02/23/2005 | CN1191002C PC board and its making method |
| 02/23/2005 | CN1191000C Flexible wire distribution board and its making method |
| 02/23/2005 | CN1190999C Electronic element apparatus and its mfg. method |
| 02/23/2005 | CN1190836C Clad Plate, interposer for semiconductor device and method for mfg. them |
| 02/23/2005 | CN1190801C Aeolotropic conductive adhering film |
| 02/23/2005 | CN1190799C Electronic assembly and mfg. method thereof |
| 02/23/2005 | CN1190705C Optical imageadable composite with improved flexibility |
| 02/23/2005 | CN1190524C Electrical contacting element and method for objects to be electrolyted |
| 02/23/2005 | CN1190330C Thermal mass transfer donor element with ligh-to-heat conversion layer and transfering method |
| 02/23/2005 | CN1190294C Non-lead welding material and soldered fitting |
| 02/22/2005 | US6859915 Signal line impedance verification tool |
| 02/22/2005 | US6859052 Electric test of the interconnection of electric conductors on a substrate |
| 02/22/2005 | US6858921 Flexible printed circuit substrate |
| 02/22/2005 | US6858807 Substrate for receiving a circuit configuration and method for producing the substrate |
| 02/22/2005 | US6858806 Process for producing printed circuits and printed circuits thus obtained |
| 02/22/2005 | US6858804 Cable-enrolling conductive thin-film sheet and manufacturing method thereof |
| 02/22/2005 | US6858798 Housing part for an electrical adjusting drive |
| 02/22/2005 | US6858796 Grounding mechanism retention feature |
| 02/22/2005 | US6858660 Releases the flowable polymerizing agent responsive to the rupturing and cross-linking the flowable polymerizing agent with the plurality of reactable pendant groups in the failure region |
| 02/22/2005 | US6858475 Method of forming an integrated circuit substrate |
| 02/22/2005 | US6858468 Techniques for joining an opto-electronic module to a semiconductor package |
| 02/22/2005 | US6858453 Integrated circuit package alignment feature |
| 02/22/2005 | US6858352 Printed circuit fabrication |
| 02/22/2005 | US6858253 Method of making dimensionally stable composite article |
| 02/22/2005 | US6858111 Conductive polymer interconnection configurations |
| 02/22/2005 | US6857915 Wire bonding surface for connecting an electrical energy storage device to an implantable medical device |
| 02/22/2005 | US6857898 Apparatus and method for low-profile mounting of a multi-conductor coaxial cable launch to an electronic circuit board |
| 02/22/2005 | US6857880 Electrical connector |
| 02/22/2005 | US6857828 Incremental step drilling system and method |
| 02/22/2005 | US6857559 System and method of soldering electronic components to a heat sensitive flexible substrate with cooling for a vector transient reflow process |
| 02/22/2005 | US6857557 Low temperature microelectronic die to substrate interconnects |
| 02/22/2005 | US6857552 Method and apparatus for making smart card solder contacts |
| 02/22/2005 | US6857361 Method and apparatus for printing solder paste of different thickness on lands on printed circuit board |
| 02/22/2005 | US6857184 Connecting method of pins and tin balls of an electric connector |
| 02/22/2005 | US6857183 Methods of bonding solder balls to bond pads on a substrate, and bonding frames |
| 02/22/2005 | US6857182 Mounting system for mounting an electronic component on a substrate |
| 02/17/2005 | WO2005015967A1 Method for fixing conductor tracks onto a base plate and assembly consisting of conductor tracks and base plate |
| 02/17/2005 | WO2005015966A1 Printed wiring board and method of producing the same |
| 02/17/2005 | WO2005015965A1 Ruthenium-layer-formed circuit board and product including the same |
| 02/17/2005 | WO2005015632A1 Multichip circuit module and method for the production thereof |
| 02/17/2005 | WO2005015477A2 Circuit forming system and method |
| 02/17/2005 | WO2005015449A1 Method and device for electromagnetic field analysis of circuit board, and circuit board and its design method |
| 02/17/2005 | WO2005014289A1 Liquid jetting device, liquid jetting method, and method of forming wiring pattern on circuit board |
| 02/17/2005 | WO2005014284A1 Device for step-wise lamination of steps |
| 02/17/2005 | WO2005014184A1 Method of pattern coating |
| 02/17/2005 | WO2005014180A1 Electrostatic suction-type fluid discharging method and device |
| 02/17/2005 | WO2005014179A1 Electrostatic suction type fluid discharge device, electrostatic suction type fluid discharge method, and plot pattern formation method using the same |
| 02/17/2005 | WO2004094682B1 Improved coating for silver plated circuits |
| 02/17/2005 | WO2004093164A3 Layered microelectronic contact and method for fabricating same |
| 02/17/2005 | WO2004049401A3 Laser trimming of resistors |
| 02/17/2005 | WO2003094582A3 A system and method for manufacturing printed circuit boards employing non-uniformly modified images |
| 02/17/2005 | US20050037638 Load board |
| 02/17/2005 | US20050037614 Method for manufacturing wiring and method for manufacturing semiconductor device |
| 02/17/2005 | US20050037601 Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same |
| 02/17/2005 | US20050037543 Method of manufacturing heat conductive substrate |
| 02/17/2005 | US20050037281 for preparation of a printed circuit board; pattern with high resolution and a tough tenting film |
| 02/17/2005 | US20050037278 Blck paste on radiation transparent glass substrate; exposure to actinic radiation; development |
| 02/17/2005 | US20050037275 Pattern forming method and wiring pattern forming method, and electro-optic device and electronic equipment |
| 02/17/2005 | US20050037213 Polyimide layer improves thermopress-bonding property, solubility in solvents and heat resistance, and exhibits low dielectric constant; for application to high-frequency printed wiring boards |
| 02/17/2005 | US20050037182 Compressing multilayers stacked between copper foils and antiadhesive layers |
| 02/17/2005 | US20050037138 board is stepwise lowered in such a manner that construction components of various vertical dimensions can remain in contact with the liquid level for short drip-times, in order to use the surface tension forces existing in a coating fluid in order to accelerate the running off of excess |
| 02/17/2005 | US20050036783 Pattern production system, exposure system, and exposure method |
| 02/17/2005 | US20050035941 Retroreflective electrophoretic displaya and materials for making the same |
| 02/17/2005 | US20050035896 Electromagnetic wave absorption material and an associated device |
| 02/17/2005 | US20050035845 Fabrication of thick film electrical components |
| 02/17/2005 | US20050035843 Fuel tank resistor card having improved corrosion resistance |
| 02/17/2005 | US20050035518 Workpiece clamp with two alternately applicable compression rings |
| 02/17/2005 | US20050035464 [electrical package and manufacturing method thereof] |
| 02/17/2005 | US20050035462 Selective application of conductive material to circuit boards by pick and place |
| 02/17/2005 | US20050035453 Bump transfer fixture |
| 02/17/2005 | US20050035450 Ball grid array package having testing capability after mounting |
| 02/17/2005 | US20050035443 Device for connecting the terminal pins of a package for an optical transmitting and/or receiving device to a printed circuit board and conductor arrangement for such a device |
| 02/17/2005 | US20050035434 Module for EPAS/EHPAS applications |
| 02/17/2005 | US20050035347 Probe card assembly |
| 02/17/2005 | US20050035304 System and method for attenuating the effect of ambient light on an optical sensor |
| 02/17/2005 | US20050035213 Ultrasonic spray coating system |
| 02/17/2005 | US20050035184 Method of soldering semiconductor part and mounted structure of semiconductor part |
| 02/17/2005 | US20050035182 Circuit board transferring apparatus and method and solder ball mounting method |
| 02/17/2005 | US20050035102 Laser processing method, laser welding method, and laser processing apparatus |
| 02/17/2005 | US20050035098 Operating method for a laser machining system |
| 02/17/2005 | US20050034995 Process for producing a structured metal layer on a substrate body, and substrate body having a structured metal layer |
| 02/17/2005 | US20050034893 Circuit board design |
| 02/17/2005 | US20050034791 Composite metal matrix castings and solder compositions, and methods |
| 02/17/2005 | US20050034780 Filling equipment and method for filling fluidized material |
| 02/17/2005 | US20050034622 Method for fabricating pattern, apparatus for fabricating pattern, conductive film wiring, method for fabricating device, electro-optical apparatus, and electronic apparatus |
| 02/17/2005 | US20050034560 Silver, copper alloy overcoated with acid; smooth surface |