| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 01/11/2005 | US6841882 Elastomer interposer for grid array packages and method of manufacturing the same |
| 01/11/2005 | US6841868 Memory modules including capacity for additional memory |
| 01/11/2005 | US6841862 Semiconductor package board using a metal base |
| 01/11/2005 | US6841855 Electronic package having a flexible substrate with ends connected to one another |
| 01/11/2005 | US6841740 Printed-wiring substrate and method for fabricating the same |
| 01/11/2005 | US6841738 Printed wiring board having rigid portion and flexible portion, and method of fabricating the board |
| 01/11/2005 | US6841737 Wired circuit board |
| 01/11/2005 | US6841735 Flat cable and modular rotary anvil to make same |
| 01/11/2005 | US6841732 Protection structure of a circuit board and method for manufacturing the same |
| 01/11/2005 | US6841628 Polyhydroxy polyether resin comprising glycerol, bisphenol, and 4,4*-dihydroxybiphenyl comonomers; and three-dimensionally curable resin; |
| 01/11/2005 | US6841605 Adhesive composition for metal foil, and adhesive-coated metal foil, metal-clad laminate and related materials using the same |
| 01/11/2005 | US6841422 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| 01/11/2005 | US6841420 Semiconductor device and method of manufacturing the same |
| 01/11/2005 | US6841416 Chip scale package and method of fabricating the same |
| 01/11/2005 | US6841263 Method of adhering a solid polymer to a substrate and resulting article |
| 01/11/2005 | US6841228 Structure having embedded flush circuitry features and method of fabricating |
| 01/11/2005 | US6841225 Touch screen with an applied edge electrode pattern |
| 01/11/2005 | US6841189 Forming a plating base on the surfaces and introducing a modifying agent to the recess and which absorbs into the surface regions not covered by the plating base |
| 01/11/2005 | US6841094 Mixtures of electroconductive nickel and gold plated plastic grains, and polymers as binders |
| 01/11/2005 | US6841084 Etching solution for forming an embedded resistor |
| 01/11/2005 | US6841022 Adhesive-coated electronic parts on a connection sheet |
| 01/11/2005 | US6840810 Grouped element transmission channel link termination assemblies |
| 01/11/2005 | US6840783 Press-fit bus bar distributing power |
| 01/11/2005 | US6840781 Structure for mounting connector on board |
| 01/11/2005 | US6840777 Solderless electronics packaging |
| 01/11/2005 | US6840776 Adapter for a light source |
| 01/11/2005 | US6840430 Board pieces, flexible wiring boards and processes for manufacturing flexible wiring boards |
| 01/11/2005 | US6840428 Self-adhesive flexible repair circuit |
| 01/11/2005 | US6840425 Scavenging system |
| 01/11/2005 | US6840169 Methods for manufacturing printed circuit boards using a partial printing process and apparatus |
| 01/11/2005 | US6839965 Method of manufacturing a resistor connector |
| 01/11/2005 | US6839964 Method for manufacturing a multi-layer printed circuit board |
| 01/11/2005 | US6839961 Methods of bonding solder balls to bond pads on a substrate, and bonding frames |
| 01/11/2005 | CA2306786C Multilayer metalized composite on polymer film product and process |
| 01/11/2005 | CA2296890C Category 5/25-pair protector |
| 01/11/2005 | CA2197965C Surface treating agent for copper or copper alloy |
| 01/11/2005 | CA2187653C Sealed electronic packaging for environmental protection of active electronics |
| 01/06/2005 | WO2005002308A2 Pieces for passive electronic components and method for production thereof |
| 01/06/2005 | WO2005002306A1 Inverter device and its manufacturing method |
| 01/06/2005 | WO2005002304A1 Method of manufacturing electronic part and electronic part |
| 01/06/2005 | WO2005002303A1 Printed wiring board |
| 01/06/2005 | WO2005002302A1 Flexi-rigid printed circuit board with integral flexible heat sink area |
| 01/06/2005 | WO2005002299A2 Component and method for manufacturing printed circuit boards |
| 01/06/2005 | WO2005002002A1 Circuit connecting material, film-like circuit connecting material using the same, circuit member connecting structure, and method of producing the same |
| 01/06/2005 | WO2005001943A1 Light-emitting diode thermal management system |
| 01/06/2005 | WO2005001932A1 Dielectric composite material comprising benzocyclobutene which contains a filler in order to decrease the coefficient of thermal expansion |
| 01/06/2005 | WO2005001927A2 Stackable integrated circuit package and method therefor |
| 01/06/2005 | WO2005001335A1 Illumination device, power supply device for light- emitting diodes, and conductive board used for the power supply device |
| 01/06/2005 | WO2005001166A1 Process for producing metal plating film, process for producing electronic part and plating film forming apparatus |
| 01/06/2005 | WO2005001157A2 Device and method for coating roll substrates in vacuum |
| 01/06/2005 | WO2005000593A1 Method for preparing a patterned coating |
| 01/06/2005 | WO2005000579A1 Multilayer body and method for producing same |
| 01/06/2005 | WO2005000562A1 Method for producing flexible metal foil-polyimide laminate |
| 01/06/2005 | WO2005000514A2 Method for soldering electrical connector pins on a support by means of hot gas |
| 01/06/2005 | WO2005000513A1 Reflow device |
| 01/06/2005 | WO2005000485A1 Structure for mounting multi-featured vibration actuator on circuit board |
| 01/06/2005 | WO2003100854A3 Electronic component module and method for the production thereof |
| 01/06/2005 | US20050004288 Resin composition, composition for solder resist, and cured article obtained therefrom |
| 01/06/2005 | US20050003687 Press-fitting head, apparatus and method for press-fitting |
| 01/06/2005 | US20050003683 Electrical connector assembly with pick up cap |
| 01/06/2005 | US20050003677 Activation plate for electroless and immersion plating of integrated circuits |
| 01/06/2005 | US20050003645 Forming process of thin film pattern and manufacturing process of device, electro-optical apparatus and electronic apparatus |
| 01/06/2005 | US20050003640 Method for fabricating thin film pattern, device and fabricating method therefor, method for fabricating liquid crystal display, liquid crystal display, method for fabricating active matrix substrate, electro-optical apparatus, and electrical apparatus |
| 01/06/2005 | US20050003607 Methods of forming circuit traces and contact pads for interposers utilized in semiconductor packages |
| 01/06/2005 | US20050003582 Semiconductor device and method of manufacturing the device |
| 01/06/2005 | US20050003317 Quartz glass single hole nozzle and quartz glass multi-hole burner head for feeding fluid |
| 01/06/2005 | US20050003242 Coating a photocatalytic compound unto sybstrate; exposur eto light; electroconductive metal patterns |
| 01/06/2005 | US20050003228 Brazing, soldering, pressing bodies against foil; controlling pressure; self-supporting, multilayer ; exothermic reactions |
| 01/06/2005 | US20050003199 Resin composition, cured resin, sheet-like cured resin, laminated body, prepreg, electronic parts and multilayer boards |
| 01/06/2005 | US20050003171 Plated via interposer |
| 01/06/2005 | US20050003169 Lubricant sheet for drilling and method of drilling |
| 01/06/2005 | US20050003166 Pattern and fabricating method therefor, device and fabricating method therefor, electro-optical apparatus, electronic apparatus, and method for fabricating active matrix substrate |
| 01/06/2005 | US20050003153 Flexible substrate and a connection method thereof that can achieve reliable connection |
| 01/06/2005 | US20050003101 Overcoating substrate using catalyst; overlapping multilayer; sealing |
| 01/06/2005 | US20050003086 Copper compound and method for producing copper thin film using the same |
| 01/06/2005 | US20050003076 Method of producing a multi-layered wiring board |
| 01/06/2005 | US20050002168 Integrated electromechanical arrangement and method of production |
| 01/06/2005 | US20050002167 Microelectronic package |
| 01/06/2005 | US20050002070 Image forming apparatus and image forming method |
| 01/06/2005 | US20050001869 Viscous material noncontact jetting system |
| 01/06/2005 | US20050001780 Low cost electromagnetic energy absorbers manufactured from conductive loaded resin-based materials |
| 01/06/2005 | US20050001640 Apparatus for scan testing printed circuit boards |
| 01/06/2005 | US20050001351 Nonswelling; low molecular weight rubber surface laminated to poous, heat resistant film; multilayer; |
| 01/06/2005 | US20050001331 Module with a built-in semiconductor and method for producing the same |
| 01/06/2005 | US20050001315 Method for assembling integral type electronic device, and integral type electronic device |
| 01/06/2005 | US20050001310 Supporting a circuit package including a substrate having a solder column array |
| 01/06/2005 | US20050001309 Printed wiring board for mounting semiconductor |
| 01/06/2005 | US20050001308 Integrated circuit carrier |
| 01/06/2005 | US20050001304 Chip scale package and method of fabricating the same |
| 01/06/2005 | US20050001299 Substrate for semiconductor package wire bonding method using thereof |
| 01/06/2005 | US20050001278 Chip package substrate having soft circuit board and method for fabricating the same |
| 01/06/2005 | US20050001019 Vector transient reflow of lead free solder for controlling substrate warpage |
| 01/06/2005 | US20050001017 Water soluble protective paste for manufacturing printed circuit boards |
| 01/06/2005 | US20050001014 Method of mounting electronic part and flux-fill |
| 01/06/2005 | US20050000816 Multilater; dielectric and electroconductive layers |
| 01/06/2005 | US20050000730 Printed wiring board, electronic component mounting method, and electronic apparatus |
| 01/06/2005 | US20050000729 Multilayer wiring board for an electronic device |
| 01/06/2005 | US20050000728 Wiring board provided with a resistor and process for manufacturing the same |
| 01/06/2005 | US20050000726 Resin encapsulated electronic component unit and method of manufacturing the same |
| 01/06/2005 | US20050000725 Manufacturing method for a printed circuit board |