| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/02/2004 | WO2004077527A3 Area-array device assembly with pre-applied underfill layers on printed wiring board |
| 12/02/2004 | WO2004072330A3 Electro-plating method and apparatus |
| 12/02/2004 | WO2004061347A3 Method and apparatus for transferring material to a substrate |
| 12/02/2004 | WO2004052547A3 Coated and magnetic particles and applications thereof |
| 12/02/2004 | WO2003085697A9 Solder-bearing articles and method of retaining a solder mass thereon |
| 12/02/2004 | US20040244016 Optical pickup head, optical pickup head manufacturing method, and optical pickup device |
| 12/02/2004 | US20040243345 Tester and testing method |
| 12/02/2004 | US20040242086 Bus bar structure plate and producing method of circuit structure body by using of the same |
| 12/02/2004 | US20040242082 Terminal |
| 12/02/2004 | US20040242028 Electronic assembly having a socket with a support plane |
| 12/02/2004 | US20040241904 Method for manufacturing printed circuit board |
| 12/02/2004 | US20040241903 Wiring board, method of manufacturing the same, semiconductor device, and electronic instrument |
| 12/02/2004 | US20040241887 Sensor for inspection instrument and inspection instrument |
| 12/02/2004 | US20040241586 Pattern forming method, pattern forming apparatus, method of manufacturing device, conductive film wiring, electro-optical device, and electronic apparatus |
| 12/02/2004 | US20040241585 Method for forming image on object surface including circuit substrate |
| 12/02/2004 | US20040241487 Electrodeposited copper foil with carrier foil |
| 12/02/2004 | US20040241465 Laminate for electronic circuit |
| 12/02/2004 | US20040241422 depositing a layer of metal nuclei on an electrically non-conductive support using electromagnetic radiation to reduce electrically non-conductive metal oxides dispersed in the support material; spinel-based inorganic oxides are heat resistant and remain stable at soldering temperatures |
| 12/02/2004 | US20040241405 Piece having a portion of its visible surface galvanized, wherein the non-galvanized portion of its visible surface is covered in a film of non-galvanizable material that adheres strongly to the galvanized material; radio communication terminal, such as a mobile telephone or a personal assistant |
| 12/02/2004 | US20040241402 Batch electrically connecting sheet |
| 12/02/2004 | US20040241395 Method of modifying a surface of a substrate and articles therefrom |
| 12/02/2004 | US20040241338 Heating a substrate coated with a curable polymer and a glass transition suppression modifier to greater than the glass transition temperature but less than the curing temperature; and heat curing the layer to form a substrate with percent planarization at 100 micrometers of greater than fifty percent. |
| 12/02/2004 | US20040241323 Confining a liquid adhesive to a region of a substrate surface by first forming a fixed coating on a substrate with a boundary enclosing a region of the substrate surface and an average receding contact angle with water at least 30 degrees higher than the average receding contact angle of the enclosure |
| 12/02/2004 | US20040240865 Device and method for soldering contacts on semiconductor chips |
| 12/02/2004 | US20040240773 Optical communication module |
| 12/02/2004 | US20040240724 Tester and testing method |
| 12/02/2004 | US20040240323 Multifunctional timepiece module with application specific printed circuit boards |
| 12/02/2004 | US20040240191 Electromagnetic interference shielding for a printed circuit board |
| 12/02/2004 | US20040240187 Electronic component |
| 12/02/2004 | US20040240183 Electronic component mounting board, electronic component module, method of manufacturing electronic component mounting board, and communications equipment |
| 12/02/2004 | US20040240146 Multilayer ceramic electronic component and mounting structure and method for the same |
| 12/02/2004 | US20040239730 Method for forming pattern and method for forming multilayer wiring structure by droplet discharge system |
| 12/02/2004 | US20040239578 Low cost electromagnetic field absorbing devices manufactured from conductive loaded resin-based materials |
| 12/02/2004 | US20040239474 Polymer thick film resistor, layout cell, and method |
| 12/02/2004 | US20040239469 Embedded 3D coil inductors in a low temperature, co-fired ceramic substrate |
| 12/02/2004 | US20040239360 Method and apparatus for evaluating a set of electronic components |
| 12/02/2004 | US20040238970 Electronic pckage with conductive pad capable of withstanding significant loads and information handling system utilizing same |
| 12/02/2004 | US20040238956 Using a supporting structure to control collapse of a die towards a die pad during a reflow process for coupling the die to the die pad |
| 12/02/2004 | US20040238953 Built-up bump pad structure and method for same |
| 12/02/2004 | US20040238952 Asymmetric plating |
| 12/02/2004 | US20040238949 Semiconductor package and method of production thereof |
| 12/02/2004 | US20040238942 Electronic assembly comprising ceramic/organic hybrid substrate with embedded capacitors and methods of manufacture |
| 12/02/2004 | US20040238941 Semiconductor connection substrate |
| 12/02/2004 | US20040238940 Electronic device and pressure sensor |
| 12/02/2004 | US20040238932 Array printed circuit board |
| 12/02/2004 | US20040238925 Pre-applied thermoplastic reinforcement for electronic components |
| 12/02/2004 | US20040238923 Surface-mount-enhanced lead frame and method for fabricating semiconductor package with the same |
| 12/02/2004 | US20040238922 Connection components with frangible leads and bus |
| 12/02/2004 | US20040238910 Transparent touch panel |
| 12/02/2004 | US20040238834 LED display apparatus |
| 12/02/2004 | US20040238603 Method of mounting electronic component, structure for mounting electronic component, electronic component module, and electronic apparatus |
| 12/02/2004 | US20040238602 Bump forming method, presoldering treatment method, soldering method, bump forming apparatus, presoldering treatment device and soldering apparatus |
| 12/02/2004 | US20040238595 Substrate holder |
| 12/02/2004 | US20040238522 Temperature controlled vacuum chuck |
| 12/02/2004 | US20040238483 Reducing corrugated edge pattern range and skirt spreading length variation; can employ aluminum metal or alloy and brazing filler bonding; utilizing acid free ferric chloride and water |
| 12/02/2004 | US20040238370 Producing high density device; electroless copper deposition of etchable seed insulating layer, photolithographically producing resist pattern and electrolytically plating etch resistant copper layer |
| 12/02/2004 | US20040238216 Via shielding for power/ground layers on printed circuit board |
| 12/02/2004 | US20040238215 Circuit board and fabricating process thereof |
| 12/02/2004 | US20040238214 [substrate and process for fabricating the same] |
| 12/02/2004 | US20040238212 Electronic circuit comprising conductive bridges and method for making such bridges |
| 12/02/2004 | US20040238211 Circuit board, circuit board mounting method, and electronic device using the circuit board |
| 12/02/2004 | US20040238210 Electronic module with protective bump |
| 12/02/2004 | US20040238209 Multilayer wiring board, method of manufacturing the wiring board and substrate material for the wiring board |
| 12/02/2004 | US20040238208 Standoff/mask structure for electrical interconnect |
| 12/02/2004 | US20040238207 Conductive paste and ceramic multilayer substrate |
| 12/02/2004 | US20040238205 Printed circuit board with controlled solder shunts |
| 12/02/2004 | US20040238115 Circuit device mounting method and press |
| 12/02/2004 | US20040238111 UV LED control loop and controller for UV curing |
| 12/02/2004 | US20040238099 Eliminates conventional grinding and ultrasonic machining |
| 12/02/2004 | US20040238003 Stencil cleaner for use in the solder paste print operation |
| 12/02/2004 | US20040237999 Electrically conductive material printing apparatus, printing mask cleaning method, and printing mask cleaning program |
| 12/02/2004 | US20040237813 Screen printing apparatus and screen printing method |
| 12/02/2004 | US20040237717 Precious metal recovery |
| 12/02/2004 | US20040237298 Surface mounted electrical components and method for mounting and retaining same |
| 12/02/2004 | US20040237296 Wiring board, method of manufacturing the same, semiconductor device, and electronic instrument |
| 12/02/2004 | US20040237295 Multilayer circuit board and resin base material, and its production method |
| 12/02/2004 | DE202004015013U1 Housing for a component to be soldered to a circuit board esp. a contact sleeve including a spacer for positioning on the surface of the circuit board |
| 12/02/2004 | DE10392185T5 Verfahren zur Laserbearbeitung eines Werkstücks mit Laserpunktvergrösserung A method of laser processing a workpiece with laser spot enlargement |
| 12/02/2004 | DE10323660A1 Einrichtung zur Behandlung von Gegenständen, insbesondere Galvanisierung für Leiterplatten Device for treating objects, particularly plating for circuit boards |
| 12/02/2004 | DE10323658A1 Verfahren und Vorrichtung zur Beschichtung eines Substrats Method and apparatus for coating a substrate |
| 12/02/2004 | DE10321889A1 Surface treatment method e.g. for flat substrates and circuit-boards, involves treating surface with air-ionization by electrical discharge at high-voltage |
| 12/02/2004 | DE10321583A1 Solder substance for soldering components to a circuit board and containing reflective or phosphorescent particles for observing areas which have not been covered |
| 12/02/2004 | DE10321184A1 Kontaktierungsvorrichtung für flexible Flachbandleiter Contacting for flexible flat conductor |
| 12/02/2004 | DE10320838A1 Verbundwerkstoff sowie elektrischer Schaltkreis oder elektrisches Modul Composite and electrical circuit or electrical module |
| 12/02/2004 | DE10320483A1 Process for treating a polymer matrix composite comprises subjecting the composite to a large flow of oxygen radicals, removing the surface polymers, increasing the surface roughness, and activating the composite |
| 12/02/2004 | DE10311693B3 Breaking unit for separating ceramic circuit boards, supports board on pivoted plates and has positioner aligning breaker bar with lines of weakness |
| 12/02/2004 | DE102004019877A1 Klebeschicht zum Kleben von Harz auf eine Kupferoberfläche Adhesive layer for bonding resin on a copper surface |
| 12/02/2004 | DE10136571B4 Verfahren zum partiellen Schutzbeschichten von Leiterplatten und Lackieranlage zur Durchführung des Verfahrens A method for partial protection coating printed circuit boards and paint shop for performing the method |
| 12/02/2004 | DE10035990B4 Verfahren zur Herstellung elektronischer Bauelemente aus Keramik A process for the production of electronic components made of ceramic |
| 12/01/2004 | EP1482773A1 Perimeter matrix ball grid array circuit package with a populated center |
| 12/01/2004 | EP1482772A2 Wiring substrate, process for manufacturing the wiring substrate, and carrier sheet for green sheet used in the manufacturing process |
| 12/01/2004 | EP1482771A2 Metal/ceramic circuit board and method for producing same |
| 12/01/2004 | EP1482594A1 A terminal |
| 12/01/2004 | EP1482556A2 Method for fabricating thin film pattern and corresponding devices. |
| 12/01/2004 | EP1482547A2 Standoff/mask structure for electrical interconnect |
| 12/01/2004 | EP1482543A2 Transfer material, method for producing the same and wiring substrate produced by using the same |
| 12/01/2004 | EP1482314A1 Microelectronic spring contact element |
| 12/01/2004 | EP1482291A1 Electronic device and pressure sensor |
| 12/01/2004 | EP1481796A1 Metal foil with resin and metal-clad laminate, and printed wiring board using the same and method for production thereof |
| 12/01/2004 | EP1481577A2 Method and devices for qualifying substrate-processing production processes |