| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/13/2005 | US20050006744 Package for semiconductor devices |
| 01/13/2005 | US20050006736 Selective consolidation processes for electrically connecting contacts of semiconductor device components |
| 01/13/2005 | US20050006721 Configuration and method for manufacturing filters comprising LC circuit |
| 01/13/2005 | US20050006650 Connection structure and method of plasma display panel |
| 01/13/2005 | US20050006548 Bezel design for surface mount display modules |
| 01/13/2005 | US20050006442 Electronic package having controlled height stand-off solder joint |
| 01/13/2005 | US20050006342 Solder mask removal method |
| 01/13/2005 | US20050006339 Electroless deposition methods and systems |
| 01/13/2005 | US20050006335 Method of forming high resolution electronic circuits on a substrate |
| 01/13/2005 | US20050006205 Transporting device for a vertical-type thin circuit board etching machine |
| 01/13/2005 | US20050006142 Circuit board with in-built electronic component and method for manufacturing the same |
| 01/13/2005 | US20050006141 Circuit assembly having compliant substrate structures for mounting circuit devices |
| 01/13/2005 | US20050006140 Circuit board with at least one electronic component |
| 01/13/2005 | US20050006139 Circuit board and process for producing the same |
| 01/13/2005 | US20050006138 Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof |
| 01/13/2005 | US20050006136 Laser-based technique for producing and embedding electrochemical cells and electronic components directly into circuit board materials |
| 01/13/2005 | US20050006126 Low cost shielded cable manufactured from conductive loaded resin-based materials |
| 01/13/2005 | US20050006026 Transfer apparatus, cleaning apparatus, chemical processing apparatus, and method for manufacturing circuit substrate |
| 01/13/2005 | US20050005996 Liquid droplet ejection apparatus, method of ejecting liquid droplet, method of manufacturing electrooptic device, electrooptic device, electronic device, and substrate |
| 01/13/2005 | US20050005856 Method and system for forming RF reflective pathways |
| 01/13/2005 | US20050005843 Dual-layer compliant polymeric nozzle |
| 01/13/2005 | US20050005820 Ink jetting; palladium, aliphatic amine complexes capable of being reduced by heating; forming palladium metal in pattern; electronics |
| 01/13/2005 | US20050005748 Using laser ; electronics covered with protective coating of potting compound |
| 01/13/2005 | US20050005439 Coupling of conductive vias to complex power-signal substructures |
| 01/13/2005 | US20050005438 Method of testing printed circuit board opening spacings |
| 01/13/2005 | US20050005437 Adhesive film for use in multilayer printed wiring board and method of producing multilayer printed wiring board |
| 01/13/2005 | US20050005436 Method for preparing thin integrated circuits with multiple circuit layers |
| 01/13/2005 | US20050005434 Method, system, and apparatus for high volume transfer of dies |
| 01/13/2005 | US20050005424 Method of manufacturing planar inductors |
| 01/13/2005 | US20050005420 Circuit component, circuit component package, circuit component built-in module, circuit component package production and circuit component built-in module production |
| 01/13/2005 | DE4343706B4 Hitzeempfindlicher Kondensator Heat-sensitive capacitor |
| 01/13/2005 | DE20023606U1 Electrical or electronic device, e.g. voltage adapter for lamp, has circuit board carrying conductor to be protected with reduced cross-section burn-through region |
| 01/13/2005 | DE10329018A1 Releasable electrical contact for electrical components has end of flat electrical cable bent in U-shape round end of L-shaped contact member on end of electrical component and held by spring clamp |
| 01/13/2005 | DE10326086A1 Computer-controlled positioning method for measuring head relative to circuit board for automatic testing, uses search movement to detect alignment marking coordinates used for subsequent positioning |
| 01/13/2005 | DE10313622B3 Verfahren zur elektrischen und mechanischen Verbindung zweier Leiterplatten A method for electrical and mechanical connection of two printed circuit boards |
| 01/13/2005 | DE102004028067A1 Verfahren zum Anbringen einer Steckverbindung auf einem Substrat und Steckverbindung aufgebracht nach dem Verfahren A method of mounting a connector on a substrate and connector is applied according to the method |
| 01/13/2005 | DE102004021156A1 Flüssigkristalldisplay und Verfahren zu dessen Herstellung Liquid crystal display and method for its production |
| 01/12/2005 | EP1496733A2 Electronic package having controlled height stand-off solder joint |
| 01/12/2005 | EP1496732A2 Housing for electrical or electronic devices |
| 01/12/2005 | EP1496731A1 Fast production method for printed board |
| 01/12/2005 | EP1496729A2 Method of assembling a printed circuit to a support |
| 01/12/2005 | EP1496728A1 Circuit assemby having compliant substrate stuctures for mounting circuit devices |
| 01/12/2005 | EP1496563A2 Circuit board bonded to ground, "T" branching circuit, waveguide-microstrip transition |
| 01/12/2005 | EP1496544A1 Resist film removing apparatus, method of removing resist film, organic matter removing apparatus and method of removing organic matter |
| 01/12/2005 | EP1496537A2 Connection structure and method of plasma display panel |
| 01/12/2005 | EP1496141A1 Transporting device for a vertical-type thin circuit board etching machine |
| 01/12/2005 | EP1496078A1 Polyamideimide resin, method for producing polyamideimide resin, polyamideimide resin composition containing the same, film-forming material and adhesive for electronic parts made thereof |
| 01/12/2005 | EP1496061A2 Copper compound and method for producing copper thin film using the same |
| 01/12/2005 | EP1495830A1 Solder alloy and soldered joint |
| 01/12/2005 | EP1495815A1 Method for cleaning a metallic surface |
| 01/12/2005 | EP1495501A2 Hermetic encapsulation of organic electro-optical elements |
| 01/12/2005 | EP1495493A2 Method for producing a copy protection for an electronic circuit |
| 01/12/2005 | EP1495491A2 Method for connecting substrates and composite element |
| 01/12/2005 | EP1495487A2 Support clip |
| 01/12/2005 | EP1495476A1 Self-leaded surface mount component holder |
| 01/12/2005 | EP1495154A1 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby |
| 01/12/2005 | EP1495153A1 Method for coating metal surfaces and substrate having a coated metal surface |
| 01/12/2005 | EP1494965A2 Method for producing a product having a structured surface |
| 01/12/2005 | EP1332654B1 Methods of positioning components using liquid prime movers and related structures |
| 01/12/2005 | EP1266922B1 Photocurable/thermosetting composition for forming matte film |
| 01/12/2005 | EP1129605B1 Edge connectors for printed circuit boards comprising conductive ink |
| 01/12/2005 | EP1123643B1 Printed board assembly and method of its manufacture |
| 01/12/2005 | EP1112673B1 Printed conductors made of polyalkylene dioxythiophene |
| 01/12/2005 | CN1565152A Thermally enhanced interposer and method |
| 01/12/2005 | CN1565150A Interlayer connection structure and its building method |
| 01/12/2005 | CN1565149A Nickel coated copper as electrodes for embedded passive devices |
| 01/12/2005 | CN1565056A Method of manufacturing heat conductive substrate |
| 01/12/2005 | CN1564929A Three-dimensional measuring apparatus, filter lattice moire plate and illuminating means |
| 01/12/2005 | CN1564924A Quartz glass single hole nozzle and quartz glass multi-hole burner head for feeding fluid |
| 01/12/2005 | CN1564755A Printing plate, circuit board and method of printing circuit board |
| 01/12/2005 | CN1564726A Joining material and joining method |
| 01/12/2005 | CN1564721A Highly filled composites of powdered fillers and polymer matrix |
| 01/12/2005 | CN1564650A Brownized treatment liquid for increasing adhesion of internal copper surface of circuit board and polymer material |
| 01/12/2005 | CN1564649A Soft circuit board structure and electronic device for preventing soft circuit board from centralized stress when bending |
| 01/12/2005 | CN1564648A Process for producing resonant tag and resonant tag |
| 01/12/2005 | CN1564647A Method of making circuit board assembly from splitting boards of printed circuit board |
| 01/12/2005 | CN1562543A Technique for manufacturing modified reproduced milling cutter for circuit board |
| 01/12/2005 | CN1184869C Integrated manufacturing packaging process |
| 01/12/2005 | CN1184868C Method for producing multi-layer circuit board |
| 01/12/2005 | CN1184866C Thermal management device and method of making such device |
| 01/12/2005 | CN1184865C Multilayer printed circuit board and manufacture thereof |
| 01/12/2005 | CN1184686C Electronic package for electronic element and manufacturing method thereof |
| 01/12/2005 | CN1184634C Flexible printed circuitboard mounting structure and recording reproducing device adopting said structure |
| 01/12/2005 | CN1184508C Liquid crystal display device with flexible circuit board |
| 01/12/2005 | CN1184487C Method for removing micro short circuit and its apparatus |
| 01/12/2005 | CN1184349C Formation of metal interconnection structure |
| 01/12/2005 | CN1184347C Method and apparatus for mfg. thin film |
| 01/12/2005 | CN1184338C Copper alloy foil for laminated board |
| 01/12/2005 | CN1184266C Photocureable conductive paste |
| 01/12/2005 | CN1184073C Cleaning apparatus and cleaning method |
| 01/12/2005 | CN1184072C Screen printing method and its appts. |
| 01/12/2005 | CN1184071C Method of controlling screen printing machine |
| 01/12/2005 | CN1184057C Cutting blade |
| 01/11/2005 | US6842585 Camera |
| 01/11/2005 | US6842343 Device for anchoring components on circuit board |
| 01/11/2005 | US6842341 Electrical circuit apparatus and method for assembling same |
| 01/11/2005 | US6842336 Portable electronic device with carrier plate |
| 01/11/2005 | US6842093 Radio frequency circuit module on multi-layer substrate |
| 01/11/2005 | US6841887 Comprising corners spaced respectively from four corners of bottom surface, and escapes between; controller for rotating electrical machine comprising cylindrical open ended casing body |
| 01/11/2005 | US6841885 High melting metal on insulator; lead-free electroless plated metal coating covering Group 1B precipitated metal |