| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/03/2005 | US20050046037 Buried solder bumps for AC-coupled microelectronic interconnects |
| 03/03/2005 | US20050046033 Tape circuit substrate and semiconductor chip package using the same |
| 03/03/2005 | US20050046032 Lead free solder containing bismuth and silver; cracking and short circuiting prevention |
| 03/03/2005 | US20050046026 Adhesive film and tacking pads for printed wiring assemblies |
| 03/03/2005 | US20050045701 Solder ball supplying method and supplying device |
| 03/03/2005 | US20050045698 Solder-fill application for mounting semiconductor chip on PCB |
| 03/03/2005 | US20050045697 Wafer-level chip scale package |
| 03/03/2005 | US20050045696 Method of securing a flat cable to a circuit board |
| 03/03/2005 | US20050045585 Method of electrochemically fabricating multilayer structures having improved interlayer adhesion |
| 03/03/2005 | US20050045582 Orifices and ink chambers are made on a photosensitive polymer substrate by photolithography; integrated conductive trace interconnectors are formed by combined photolithography and electroformation |
| 03/03/2005 | US20050045486 Plating method and plating solution |
| 03/03/2005 | US20050045485 Reducing or avoiding pitting; utilizing such as amine based polyalkylene oxide; reliable interconnect formation for ultra large scale integration microcircuits |
| 03/03/2005 | US20050045471 Process for producing transparent conductive laminate |
| 03/03/2005 | US20050045379 Circuit board and method of manufacturing the same |
| 03/03/2005 | US20050045377 Potting crack shield and related method |
| 03/03/2005 | US20050045376 High frequency multilayer circuit structure and method for the manufacture thereof |
| 03/03/2005 | US20050045370 Printed board and method of displaying an identification mark on the same |
| 03/03/2005 | US20050045369 Circuit component built-in module and method for manufacturing the same |
| 03/03/2005 | US20050045268 Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet |
| 03/03/2005 | US20050045205 Small, fast operating inline washing and drying system; lower manufacturing cost, fewer wearable parts |
| 03/03/2005 | US20050044703 Method of producing an led rope light |
| 03/03/2005 | US20050044702 Printed circuit board having solder bridges for electronically connecting conducting pads and method of fabricating solder bridges |
| 03/03/2005 | US20050044677 Apparatus for producing non-woven fabric |
| 03/03/2005 | DE202004020191U1 Push in contact using an insulation displacement contact terminal whereby an secure electric connection is ensured by bending back the clamp tongue |
| 03/03/2005 | DE10335153A1 Schaltungsanordnung auf einem Substrat und Verfahren zum Herstellen der Schaltungsanordnung auf dem Substrat A circuit arrangement on a substrate and methods for producing the circuitry on the substrate |
| 03/03/2005 | DE10334391A1 Verfahren zur Erzeugung von Verbindungen in der Mikroelektronik A process for the production of compounds in microelectronics |
| 03/03/2005 | DE10320441B3 Component carrier, e.g. for motor vehicle door lock, has casting tub defined by housing walls on floor with holders for electrical devices as openings, bounding walls with complementary grooves, protrusions in holders/on devices |
| 03/03/2005 | DE10125397B4 Verfahren zum Bohren von Mikrolöchern mit einem Laserstrahl A method of drilling microvia holes using a laser beam |
| 03/03/2005 | CA2532569A1 Electrical connector |
| 03/02/2005 | EP1511367A2 Manufacturing a wiring board |
| 03/02/2005 | EP1511366A2 Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board |
| 03/02/2005 | EP1511075A2 Electronic part mounting substrate and method for producing same |
| 03/02/2005 | EP1510861A1 Method for patterning organic materials or combinations of organic and inorganic materials |
| 03/02/2005 | EP1510825A1 Sensor package |
| 03/02/2005 | EP1510111A1 Method and device for treating flat and flexible work pieces |
| 03/02/2005 | EP1509992A1 Circuit arrangement for controlling electromotive driving means of a mobile working machine, particularly of an industrial truck |
| 03/02/2005 | EP1509397A1 Screen printing machine having a replaceable ink jet printing unit |
| 03/02/2005 | EP1509358A1 Solder paste flux system |
| 03/02/2005 | EP1399519B1 Devices, compositions and methods incorporating adhesives whose preformance is enhanced by organophilic clay constitutents |
| 03/02/2005 | CN2682646Y Electric connector with fetching-laying board |
| 03/02/2005 | CN1589093A Method for improving fine enamelled wire spot welding strengh in spot welding |
| 03/02/2005 | CN1589090A Printing circuit layout method, printing circuit board and electronic device |
| 03/02/2005 | CN1588632A Package element with heat insulation protective structure and re-welding method |
| 03/02/2005 | CN1191748C Method for producing printed circuit board with multiple layers and mfg tool thereof |
| 03/02/2005 | CN1191747C Electronic element assembling examining method |
| 03/02/2005 | CN1191746C Production Process of film-like flexible circuit board |
| 03/02/2005 | CN1191745C Bad area eliminating and filling method suitable for various printed circuit board |
| 03/02/2005 | CN1191744C Printed circuit board with built-in resistor and its making method |
| 03/02/2005 | CN1191743C Flexible microsystem and building techniques and micro photoelectric motor |
| 03/02/2005 | CN1191742C Heat transfer substrate and method for mfg. same |
| 03/02/2005 | CN1191619C Circuit device and its producing method |
| 03/02/2005 | CN1191550C Information recording label |
| 03/02/2005 | CN1191175C Thermal transfer element. product composed of it and their producing method |
| 03/01/2005 | US6862436 High frequency circuit board and antenna switch module for high frequency using the same |
| 03/01/2005 | US6862192 Wiring layout of auxiliary wiring package and printed circuit wiring board |
| 03/01/2005 | US6862191 Volumetrically efficient electronic circuit module |
| 03/01/2005 | US6862190 Adapter for plastic-leaded chip carrier (PLCC) and other surface mount technology (SMT) chip carriers |
| 03/01/2005 | US6862189 Electronic component, circuit device, method for manufacturing the circuit device, and semiconductor device |
| 03/01/2005 | US6862185 Systems and methods that use at least one component to remove the heat generated by at least one other component |
| 03/01/2005 | US6861764 Wiring substrate having position information |
| 03/01/2005 | US6861763 Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same |
| 03/01/2005 | US6861757 Interconnecting substrate for carrying semiconductor device, method of producing thereof and package of semiconductor device |
| 03/01/2005 | US6861746 Electrical circuit apparatus and methods for assembling same |
| 03/01/2005 | US6861744 Multilayer ceramic substrate utilizing an intaglio plate with a plurality of grooves having different depths |
| 03/01/2005 | US6861734 External terminals are arranged/exposed in lines on the package bottom with no resin residue left on; the inclined land electrode is forced into and strongly adheres to the seal sheet when pressure is applied through dies |
| 03/01/2005 | US6861655 Non-destructive method for testing curing level of cured product of curable adhesive composition and manufacturing method of electronic devices |
| 03/01/2005 | US6861591 Printed circuit board with wiring pattern formed thereon by screen printing and process for manufacturing the same |
| 03/01/2005 | US6861588 Laminated ceramic electronic component and method of producing the same |
| 03/01/2005 | US6861500 Resins curable with actinic energy ray, process for the production thereof, and photocurable and thermosetting resin composition |
| 03/01/2005 | US6861345 Method of disposing conductive bumps onto a semiconductor device |
| 03/01/2005 | US6861290 Flip-chip adaptor package for bare die |
| 03/01/2005 | US6861284 Semiconductor device and production method thereof |
| 03/01/2005 | US6861282 Semiconductor package and semiconductor package mounting method |
| 03/01/2005 | US6861269 Electric-circuit fabricating method and system, and electric-circuit fabricating program |
| 03/01/2005 | US6861201 Near IR sensitive photoimageable/photopolymerizable compositions, media, and associated processes |
| 03/01/2005 | US6861138 Electrically conductive, thermoplastic, heat-activated adhesive film |
| 03/01/2005 | US6861097 Electroless plating processes |
| 03/01/2005 | US6861092 Low signal loss bonding ply for multilayer circuit boards |
| 03/01/2005 | US6861008 Method and device for laser drilling organic materials |
| 03/01/2005 | US6860925 For tarnish-resistant and solderable coating |
| 03/01/2005 | US6860592 Inkjet cartridge and method of identifying color of ink thereof by flexible printed circuit board |
| 03/01/2005 | US6860418 Method for making a bonding tool |
| 03/01/2005 | US6860007 Method of producing an LED rope light |
| 03/01/2005 | US6860006 Method for manufacturing a monolithic ceramic electronic component |
| 03/01/2005 | US6860005 Method of fabricating printed circuit board |
| 03/01/2005 | US6860004 Method of manufacturing a thermally conductive circuit board with a ground pattern connected to a heat sink |
| 03/01/2005 | US6860003 I-channel surface-mount connector |
| 03/01/2005 | US6860000 Method to embed thick film components |
| 03/01/2005 | US6859990 Characteristics evaluation method of intermediate layer circuit |
| 02/24/2005 | WO2005026279A1 Multilayer anisotropic, conductive adhesive and joining structure using this |
| 02/24/2005 | WO2005018294A1 Device for fixing a module to a printed circuit board |
| 02/24/2005 | WO2005018293A2 Circuit board design |
| 02/24/2005 | WO2005018292A2 Selective application of conductive material to circuit boards by pick and place |
| 02/24/2005 | WO2005017970A2 Module for epas/ehpas applications |
| 02/24/2005 | WO2005017923A1 Insulation-coated electroconductive particles |
| 02/24/2005 | WO2005017510A1 Generation of test patterns for subsequent inspection |
| 02/24/2005 | WO2005017229A1 Adhesion promotion in printed circuit boards |
| 02/24/2005 | WO2005016587A1 Method for determining the position of the surface of a workpiece inside a laser machining unit |
| 02/24/2005 | WO2005016580A2 Composite metal matrix castings, solder compositions, and methods |
| 02/24/2005 | WO2005016563A1 Methods of thinning a silicon wafer using hf and ozone |