| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 01/25/2005 | US6847527 Interconnect module with reduced power distribution impedance |
| 01/25/2005 | US6847355 High-reliability touch panel |
| 01/25/2005 | US6847276 Radio frequency circuit module on multi-layer substrate |
| 01/25/2005 | US6847120 Flip chip semiconductor device having signal pads arranged outside of power supply pads |
| 01/25/2005 | US6847118 Thin cap layer of tin on an outer surface of a lead rich ball attached to a semiconductor; lead and tin are diffused and intermixed after reflowing and annealing |
| 01/25/2005 | US6847116 Chip-type semiconductor light-emitting device |
| 01/25/2005 | US6846993 Multilayer printed wiring board and its manufacturing method |
| 01/25/2005 | US6846992 Power plane splitting using a contour method |
| 01/25/2005 | US6846699 Semiconductor device and method of manufacture thereof, circuit board, and electronic instrument |
| 01/25/2005 | US6846687 Process of packaging organic electroluminescent panel |
| 01/25/2005 | US6846549 Multilayer printed wiring board |
| 01/25/2005 | US6846375 Method of manufacturing multilayer ceramic wiring board and conductive paste for use |
| 01/25/2005 | US6846115 Methods, apparatus, and systems of fiber optic modules, elastomeric connections, and retention mechanisms therefor |
| 01/25/2005 | US6845901 Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece |
| 01/25/2005 | US6845557 Method for producing an electronic package possessing controlled impedance characteristics |
| 01/25/2005 | US6845556 Techniques for reworking circuit boards with ni/au finish |
| 01/25/2005 | US6845555 Component alignment methods |
| 01/25/2005 | US6845551 Multilayer; dielectric mica sheets; metal conductor; pressurized environment; hermetic sealing |
| 01/25/2005 | CA2436131A1 Connecting flexible circuitry by stitching |
| 01/25/2005 | CA2380126C Wire bonding surface |
| 01/20/2005 | WO2005006826A1 Thermosetting resin composition for multilayer printed wiring board, thermosetting adhesive film and multilayer printed board made by using them |
| 01/20/2005 | WO2005006825A1 Circuit board and process for producing the same |
| 01/20/2005 | WO2005006824A1 Method for minimizing the impedance discontinuity of a via |
| 01/20/2005 | WO2005006821A2 Component for a printed circuit board and method for fitting a printed circuit board with this component |
| 01/20/2005 | WO2005006499A1 Improved method for crimping at least one connector contact on a flexible electronic circuit |
| 01/20/2005 | WO2005006462A1 Method and device for structuring organic layers |
| 01/20/2005 | WO2005006430A1 Packaging method and system of electric component |
| 01/20/2005 | WO2005006423A1 Electroless and immersion plating of integrated circuits using an activation plate |
| 01/20/2005 | WO2005006412A2 A method of forming an integrated circuit substrate |
| 01/20/2005 | WO2005005088A2 Method and apparatus for flip chip attachment by post-collapse re-melt and re-solidification of bumps |
| 01/20/2005 | WO2004101863A3 Method and device for coating a substrate |
| 01/20/2005 | WO2004100316A3 Electronic system, printed circuit and radiocommunication module comprising a coaxial connector and corresponding assembly method |
| 01/20/2005 | WO2004097998A3 Interposed electrical connector which is intended to connect two stacked electronic circuits and to the method of mounting same |
| 01/20/2005 | WO2004094682A3 Improved coating for silver plated circuits |
| 01/20/2005 | WO2004066364A3 Binder diffusion patterning of a thick film paste layer |
| 01/20/2005 | WO2004021489A3 Fixtures and methods for facilitating the fabrication of devices having thin film materials |
| 01/20/2005 | WO2003100859A3 Method for producing a component comprising a conductor structure that is suitable for use at high frequencies and corresponding component |
| 01/20/2005 | US20050014437 Cushioning material for hot pressing and process for producing layered board |
| 01/20/2005 | US20050014421 System and methods for connecting electrical components |
| 01/20/2005 | US20050014419 Extension mechanism and method for assembling overhanging components |
| 01/20/2005 | US20050014396 Electrical contact assembly with insulative carrier, stapled contact attachment and fusible element |
| 01/20/2005 | US20050014395 System for making high-speed connections to board-mounted modules |
| 01/20/2005 | US20050014348 Method of making a semiconductor device having an opening in a solder mask |
| 01/20/2005 | US20050014301 Method and apparatus for processing semiconductor devices in a singulated form |
| 01/20/2005 | US20050014298 Memory card with raised portion |
| 01/20/2005 | US20050014091 Aqueous developable photoimageable thick film compositions for making photoimageable black electrodes |
| 01/20/2005 | US20050014035 Prepreg for printed wiring board, printed wiring board using the prepreg and method for manufacturing the printed wiring board, and multilayer printed wiring board and method for manufacturing the multilayer printed wiring board |
| 01/20/2005 | US20050014006 Surface treatment of dielectric substrate using plasma polymerization; pretreatment before copper plating; bonding strength |
| 01/20/2005 | US20050013989 Coating aluminum nitride sheet with tungsten powder; forming holes; filling holes with tungsten powder; sintering |
| 01/20/2005 | US20050013978 Printed wiring board and electronic apparatus |
| 01/20/2005 | US20050013928 Aqueous solution containing sulfonate compound |
| 01/20/2005 | US20050013124 Area array package with low inductance connecting device |
| 01/20/2005 | US20050013106 Peripheral card with hidden test pins |
| 01/20/2005 | US20050013088 Capacitor device and method of manufacturing the same |
| 01/20/2005 | US20050013082 Electronic component-built-in module |
| 01/20/2005 | US20050013055 Method of head stack assembly flexible circuit assembly attached to an actuator arm |
| 01/20/2005 | US20050012919 Photosensitive tabular member suction mechanism and image recording device |
| 01/20/2005 | US20050012729 Connection member and driving device of plasma display panel |
| 01/20/2005 | US20050012572 Microstrip line, resonator element, filter, high-frequency circuit and electronic device using the same |
| 01/20/2005 | US20050012566 High-frequency layered part and manufacturing method thereof |
| 01/20/2005 | US20050012221 Semiconductor interconnect having conductive spring contacts, method of fabrication, and test systems incorporating the interconnect |
| 01/20/2005 | US20050012217 Multilayer wiring board and manufacture method thereof |
| 01/20/2005 | US20050012216 Solder interface locking using unidirectional growth of an intermetallic compound |
| 01/20/2005 | US20050012213 Wiring board, stacked wiring board and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
| 01/20/2005 | US20050012208 Method of surface-mounting semiconductor chip on PCB |
| 01/20/2005 | US20050012192 Hybrid integrated circuit |
| 01/20/2005 | US20050012187 Semiconductor device and its manufacturing method |
| 01/20/2005 | US20050012117 Power MOSFET, power MOSFET packaged device, and method of manufacturing power MOSFET |
| 01/20/2005 | US20050011934 Apparatus and method for bonding electronic component, circuit board, and electronic component mounting apparatus |
| 01/20/2005 | US20050011857 Thin film dielectrics for capacitors and methods of making thereof |
| 01/20/2005 | US20050011856 Method for making a multilayer module with high-density printed circuits |
| 01/20/2005 | US20050011677 Multi-layer flexible printed circuit board, and method for fabricating it |
| 01/20/2005 | US20050011676 Alternating voided areas of anti-pads |
| 01/20/2005 | US20050011675 Partially voided anit-pads |
| 01/20/2005 | US20050011673 Methods for producing air bridges |
| 01/20/2005 | US20050011672 Overmolded MCM with increased surface mount component reliability |
| 01/20/2005 | US20050011671 Memory card with and without enclosure |
| 01/20/2005 | US20050011670 Circuitized substrate assembly and method of making same |
| 01/20/2005 | US20050011669 Low temperature bonding of multilayer substrates |
| 01/20/2005 | US20050011668 Thin printed circuit board for manufacturing chip scale package |
| 01/20/2005 | US20050011660 Electronic devices incorporating electrical interconnections with improved reliability and methods of fabricating same |
| 01/20/2005 | US20050011602 Heating multilayer compressed films; lamination; controlling temperature; miniaturized circuits |
| 01/20/2005 | US20050011551 Thin film solar cell electrical contacts |
| 01/20/2005 | US20050011400 Adhesion of copper electroconductive layer and dielectric materials; mixture of corrosion inhibitor, acid and alcohol |
| 01/20/2005 | US20050011254 Integration of atmospheric intrusion sensors in electronic component packages |
| 01/20/2005 | US20050011069 Methods for filling holes in printed wiring boards |
| 01/20/2005 | DE19930639B4 Vorrichtung zum Zertrennen eines plattenförmigen Gegenstands Means for dividing a plate-shaped object |
| 01/20/2005 | DE19614147B4 Verfahren zum bahnförmigen Aufbringen von Material auf einen keramischen Träger, insbesondere zur Herstellung von Elektroden von Abgassensoren, und Verwendung des Verfahrens, insbesondere zur Herstellung einer Lambdasonde A method of applying material in web form onto a ceramic carrier, in particular for the production of electrodes of exhaust gas sensors, and use of the method, in particular for the preparation of a lambda probe |
| 01/20/2005 | DE10330179A1 Verfahren zum Trennen flacher Werkstücke aus Keramik A method for separating flat ceramic workpieces |
| 01/20/2005 | DE10329143A1 Electronic module has an injection-molded wiring block or circuit support with contacts for externally mounted components and internal wiring for connecting the various components |
| 01/20/2005 | DE10327530A1 Vorrichtung mit wenigstens einer von einem zu kühlenden Funktionselement gebildeten Wärmequelle, mit wenigstens einer Wärmesenke und mit wenigstens einer Zwischenlage aus einer thermischen leitenden Masse zwischen der Wärmequelle und der Wärmesenke sowie thermische leitende Masse, insbesondere zur Verwendung bei einer solchen Vorrichtung Device with at least one formed by a to be cooled functional element heat source, with at least one heat sink and at least one intermediate layer of a thermal conductive ground between the heat source and the heat sink and thermal conductive ground, particularly for use in such a device |
| 01/20/2005 | DE10327500A1 Verfahren zur Herstellung von Elektrodenstrukturen sowie Elektrodenstruktur und deren Verwendung A process for the production of electrode structures and electrode structure and the use thereof |
| 01/19/2005 | EP1499172A1 Electromagnetically shielded circuit device and shielding method therefor |
| 01/19/2005 | EP1499169A1 Method for manufacturing substrate, release sheet, substrate manufacturing apparatus and method for manufacturing substrate using same |
| 01/19/2005 | EP1499168A2 Method and apparatus for manufacturing a system comprising a component placed at a predetermined place on the surface of a substrate |
| 01/19/2005 | EP1498946A1 Circuit board, process for producing the same and power module |
| 01/19/2005 | EP1498944A1 Method of making capacitors |
| 01/19/2005 | EP1498870A2 Connection member and driving device of plasma display panel |
| 01/19/2005 | EP1498208A1 Arrangement for attaching a component |
| 01/19/2005 | EP1498013A1 Flexible interconnect structures for electrical devices and light sources incorporating the same |