H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2004
12/30/2004	US20040265608 Biaxially oriented polyester film and laminates thereof with copper
12/30/2004	US20040265601 Adhesion, heat resistance; bonding polyimide to copper foils
12/30/2004	US20040265551 Laminate of a resin or a composite obtained by mixing a resin and a powdery functional material that is reduced in thickness and size, improved in packaging density and having an improved accuracy of patterning, use for an inductive element
12/30/2004	US20040265549 Adhesiveless transfer lamination method and materials for producing electronic circuits
12/30/2004	US20040265537 Supported greensheet structure and method in mlc processing
12/30/2004	US20040265506 Process of surface treatment, surface treating device, surface treated plate, and electro-optic device, and electronic equipment
12/30/2004	US20040265499 Method of forming patterns on articles
12/30/2004	US20040265492 Applying a release polymer to a substrate in a desired pattern, applying an adherent polymer over the pattern and substrate, and mechanically removing the adherent polymer from the pattern without requiring solvent, especially by applying adhesive tape and peeling or abrading the polymer from the pattern
12/30/2004	US20040265482 Wiring substrate manufacturing method
12/30/2004	US20040264884 Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection
12/30/2004	US20040264882 Optical transmission module
12/30/2004	US20040264837 Hybrid circuit substrate with optical and electrical interconnects, hybrid circuit module with optical and electrical interconnects and manufacturing methods thereof
12/30/2004	US20040264153 Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization, attenuation and impedance mismatch characteristics
12/30/2004	US20040264141 Dissipating heat in an array of circuit components
12/30/2004	US20040264140 Power electronics component
12/30/2004	US20040264139 Process for manufacturing a cover
12/30/2004	US20040264114 Electronic apparatus including printed wiring board provided with heat generating component
12/30/2004	US20040264109 Capacitor
12/30/2004	US20040264106 Thin-laminate panels for capacitive printed-circuit boards and methods for making the same
12/30/2004	US20040263582 Method of manufacturing liquid delivery apparatus
12/30/2004	US20040263564 Droplet jetting device and method of manufacturing pattern
12/30/2004	US20040263547 Droplet ejection device
12/30/2004	US20040263505 Display device
12/30/2004	US20040263290 Coaxial waveguide microstructures and methods of formation thereof
12/30/2004	US20040263181 Methods for minimizing the impedance discontinuity between a conductive trace and a component and structures formed thereby
12/30/2004	US20040262785 Terminal structure of multi-layer substrate and method for forming the same
12/30/2004	US20040262778 Electromigration barrier layers for solder joints
12/30/2004	US20040262777 Components, methods and assemblies for multi-chip packages
12/30/2004	US20040262742 Semiconductor package with heat sink
12/30/2004	US20040262736 Tape carrier package
12/30/2004	US20040262735 Semiconductor device and production method thereof
12/30/2004	US20040262726 Electromigration barrier layers for solder joints
12/30/2004	US20040262644 Hybrid integrated circuit device
12/30/2004	US20040262582 Conducting inks
12/30/2004	US20040262373 Solder ball mounting method and apparatus therefor
12/30/2004	US20040262370 High reliability solder joint with multilayer structure
12/30/2004	US20040262368 Ball grid array solder joint reliability
12/30/2004	US20040262367 Forming a desired fillet on the peripheral portion of a metal circuit; brazing
12/30/2004	US20040262278 Soldering method and apparatus
12/30/2004	US20040262165 Plating method
12/30/2004	US20040262040 Printed-wiring board and electronic device
12/30/2004	US20040262038 Perimeter matrix ball grid array circuit package with a populated center
12/30/2004	US20040262035 Electronic component mounting structure
12/30/2004	US20040262034 Printed board and electronic apparatus
12/30/2004	US20040262033 Printed circuit board and method for fabricating the same
12/30/2004	US20040262032 Multilayer composite and method for preparing the same
12/30/2004	US20040262031 Enhancement of performance of a conductive wire in a multilayered substrate
12/30/2004	US20040262030 Conductive printed board, multicore cable and ultrasonic probe using the same
12/30/2004	US20040262029 Method and apparatus for forming printed circuit boards using imprinting and grinding
12/30/2004	US20040262028 Quadrax to Twinax conversion apparatus and method
12/30/2004	US20040261941 Method of vacuum-laminating adhesive film
12/30/2004	US20040261700 Industrial microdeposition system for polymer light emitting diode displays , printed circuit boards and the like
12/30/2004	US20040261636 Coated stencil with reduced surface tension
12/30/2004	US20040261594 Stamping device for generally flat articles
12/30/2004	US20040261263 Systems and methods for fabricating printed circuit boards
12/30/2004	US20040261251 Ultrasonic printed circuit board transducer
12/30/2004	DE202004017377U1 Multilayer flexible circuit board, has opposing flexible conducting structures forming electrical contact region, and upper/lower threads connecting opposing conducting structures in shape-locking manner
12/30/2004	DE10325883A1 Verfahren zur Kontaktierung von leitfähigen Fasern A method for contacting conductive fibers
12/30/2004	DE10325101A1 Verfahren zum Auffüllen von µ-Blind-Vias (µ-BVs) Method for filling μ-blind vias (μ-BVs)
12/30/2004	DE10324737A1 Adhesive film for bonding polyimide, especially in flexible printed circuit boards, contains thermoplastic polymer and-or thermoplastic elastomer, at least one resin and organically-modified layer silicate or bentonite
12/30/2004	DE102004017984A1 Electrical board manufacture used in power electronics, involves setting conductive strips and heat sinks on conductive layers on both sides of non-conducting base material and fixing heat-dissipating components on conductive strips
12/30/2004	DE102004008897A1 Integration von Motorraumelektronik Integration of the engine compartment electronics
12/29/2004	WO2004114737A1 Dissipating heat in an array of circuit components
12/29/2004	WO2004114734A1 Circuit assembly and method of its manufacture
12/29/2004	WO2004114733A1 Printed circuit board for high speed, high density electrical connector with improved cross-talk minimization
12/29/2004	WO2004114730A2 Metal foil composite structure for producing clad laminate
12/29/2004	WO2004114404A1 Device comprising at least one heat source formed by a functional element that is to be cooled, at least one heat sink, and at least one intermediate layer located between the heat source and the heat sink and made of a thermally conducting material, and thermally conducting material, especially for use in such a device
12/29/2004	WO2004114374A2 Method of using pre-applied underfill encapsulant
12/29/2004	WO2004114339A1 Stretchable fabric switch
12/29/2004	WO2004114217A2 Inspection system for and method of inspecting deposits printed on workpieces
12/29/2004	WO2004114029A1 Ground connection of a printed circuit board placed in a wristwatch type electronic device
12/29/2004	WO2004114021A1 Photosensitive composition and process for production of printed wiring boards with the same
12/29/2004	WO2004113594A2 Metal plating of conductive loaded resin-based materials for low cost manufacturing of conductive articles
12/29/2004	WO2004113466A1 Adhesive composition for semiconductor device and cover lay film, adhesive sheet, and copper-clad polyimide film each made with the same
12/29/2004	WO2004113427A2 Nanoporous laminates
12/29/2004	WO2004113065A1 Electrically conductive sheet whose electrically conductive layers on front and back surfaces are electrically connected to each other through through-holes
12/29/2004	WO2004113041A2 Method for producing a ceramic/metal substrate
12/29/2004	WO2004113023A1 Chemical-solution supplying apparatus
12/29/2004	WO2004113008A1 Jet type soldering device
12/29/2004	WO2002022915A3 Removable modular cell for electro-chemical plating
12/29/2004	EP1492396A2 A thermal management device and method of making such a device
12/29/2004	EP1492164A1 Method of manufacturing heat conductive substrate
12/29/2004	EP1491927A1 Ic chip mounting substrate, ic chip mounting substrate manufacturing method, optical communication device, and optical communication device manufacturing method
12/29/2004	EP1491078A1 Multi-layer integrated circuit package
12/29/2004	EP1491077A1 Control device
12/29/2004	EP1490530A1 Methods and compositions for oxide production on copper
12/29/2004	EP1490450A1 Cationic polymerizable adhesive composition and anisotropically electroconductive adhesive composition
12/29/2004	CN2667666Y Undirectional IC inert proof protector
12/29/2004	CN1559162A Multi-layer wiring board, IC package, and method of manufacturing multi-layer wiring board
12/29/2004	CN1559085A Semiconductor device and method of manufacturing the device
12/29/2004	CN1558831A Connection module
12/29/2004	CN1558819A Cushioning material for hot pressing and process for producing the same
12/29/2004	CN1558714A Radio frequency device
12/29/2004	CN1558713A Multilayer substrate module and wireless portable terminal
12/29/2004	CN1558712A Multilayer substrate module and wireless portable terminal
12/29/2004	CN1558710A Circuit board having deformation interrupting section and circuit board forming method
12/29/2004	CN1558409A Optical head device, optical disk apparatus using optical head device, and heat radiation mechanism
12/29/2004	CN1182767C Multilayer printed patch board and method of manufacture
12/29/2004	CN1182766C Electro-deposition copper foil through surface-processing, its mfg. method and use thereof
12/29/2004	CN1182765C Soldering device

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