H05K 3 - Apparatus or processes for manufacturing printed circuits

Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2004
12/29/2004	CN1182764C Method for producing ceramic substrate
12/29/2004	CN1182763C Composite laminated circuit structure and its making method
12/29/2004	CN1182761C Printed circuit board and its mfg. method
12/29/2004	CN1182654C Electronic element and its mfg. method
12/29/2004	CN1182579C Substrate, displaying device, mounting of substrate and IC chip and mounting bonding method
12/29/2004	CN1182573C Process for preparing binding arrangement
12/29/2004	CN1182197C Size for filling through-hole and printing circuit board with the same size
12/29/2004	CN1181975C Silk-screen printing equipment and silk-screen printing method
12/29/2004	CN1181949C Solidifiable scaling powder, reinforced semiconductor package and semiconductor parts by the scaling powder and method for making the semiconductor package and semiconductor device
12/29/2004	CN1181948C Non-Pb flux composition and welding product
12/28/2004	US6836397 Electrostatic discharge protection apparatus for a circuit board
12/28/2004	US6836310 Liquid crystal display device
12/28/2004	US6836018 Thermal-stress-absorbing interface structure between a semiconductor integrated circuit chip and a surface-mount structure; includes polymer layers, each having a different modulus of elasticity
12/28/2004	US6836016 Electromagnetic coupler alignment
12/28/2004	US6836011 Semiconductor chip mounting structure with movable connection electrodes
12/28/2004	US6836003 Integrated circuit package alignment feature
12/28/2004	US6835898 Electrical contact structures formed by configuring a flexible wire to have a springable shape and overcoating the wire with at least one layer of a resilient conductive material, methods of mounting the contact structures to electronic components, and applications for employing the contact structures
12/28/2004	US6835897 Warpage preventing substrate
12/28/2004	US6835896 Packaging structure of a driving circuit for a liquid crystal display device and packaging method of a driving circuit for a liquid crystal display device
12/28/2004	US6835895 Printed wiring board and method for manufacturing the same
12/28/2004	US6835889 Passive element component and substrate with built-in passive element
12/28/2004	US6835651 Wiring forming method
12/28/2004	US6835601 Mother substrate, substrate element, and method for manufacturing the same
12/28/2004	US6835597 Semiconductor package
12/28/2004	US6835533 Photoimageable dielectric epoxy resin system film
12/28/2004	US6835442 Flexible printed wiring board
12/28/2004	US6835345 Molded object with better short-time deflection temperature under load properties
12/28/2004	US6835318 Method for forming a recognition mark on a substrate for a KGD
12/28/2004	US6835294 Dummy electrolysis corrects reduction in via-holes filling
12/28/2004	US6835274 Electrical connecting device and electrical connecting method
12/28/2004	US6835260 Method to produce pedestal features in constrained sintered substrates
12/28/2004	US6835241 Improved adhesion; for high-frequency-adaptable substrate
12/28/2004	US6835074 Jig for press-fitting terminals and a press-fitting apparatus
12/28/2004	US6834937 Printhead corrosion protection
12/28/2004	US6834791 Solder-bearing components and method of retaining a solder mass therein
12/28/2004	US6834429 Ablative method for forming RF ceramic block filters
12/28/2004	US6834426 Method of fabricating a laminate circuit structure
12/23/2004	WO2004112451A1 Land grid array connector
12/23/2004	WO2004112450A1 Board mounting method and mounting structure
12/23/2004	WO2004112449A1 Production method for electronic component and electronic component
12/23/2004	WO2004112358A1 Modular terminal device
12/23/2004	WO2004112210A1 Electric junction box and its assembling process
12/23/2004	WO2004112196A1 Press-fit terminal, printed board connection structure using the press-fit terminal, and electrical connection box
12/23/2004	WO2004112151A2 Transparent conducting structures and methods of production thereof
12/23/2004	WO2004112135A1 Substrate for semiconductor devices and semiconductor device
12/23/2004	WO2004112128A2 Low profile stacking system and method
12/23/2004	WO2004112096A2 Method and system for high volume transfer of dies to substrates
12/23/2004	WO2004111890A1 Printed circuit wiring board designing support device, printed circuit board designing method, and its program
12/23/2004	WO2004111312A2 Contact surfaces for electrical contacts and method for producing the same
12/23/2004	WO2004111299A2 Solution and method for ultra thin, non-porous and highly adhesive gold coating
12/23/2004	WO2004111287A2 Electroless gold plating solution
12/23/2004	WO2004110925A1 Metal hydride fine particle, method for producing same, liquid dispersion containing metal hydride fine particle, and metallic material
12/23/2004	WO2004110665A1 Device, die, and method of punching, and method of positioning and fixing punching die
12/23/2004	WO2004093153A3 Non-homogeneous multilayer circuit assemblies and method of manufacture
12/23/2004	WO2004023523A3 Apparatus and process for manufacturing solder balls
12/23/2004	WO2004001807A3 Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
12/23/2004	US20040259434 Flanged terminal pins for DC/DC converters
12/23/2004	US20040259391 Construction and connection technique in textile structures
12/23/2004	US20040259317 Process for manufacturing a substrate with embedded capacitor
12/23/2004	US20040259038 Display panel with multiple electrodes ; projecting image onto writing surface by photolithography; paste ink for printing; hermetic sealed container
12/23/2004	US20040259007 Electroconductive composition, electroconductive coating and method for forming electroconductive coating
12/23/2004	US20040258885 Etched dielectric film in microfluidic devices
12/23/2004	US20040258841 Depositing a first layer of thickfilm dielectric on the substrate, air drying the first layer to allow solvents to escape, increasing the porosity of the first layer, oven drying the layer
12/23/2004	US20040258556 Comprising tin, silver, copper and other additive element of Au, Ni, Pd, Fe, Co, Zn, Cr; able to form an intermetallic interface between the solder and a copper substrate without scallop formation and including Sn islands; forming a solder joints; alloying
12/23/2004	US20040258500 Circuit Board Threadplate
12/23/2004	US20040257815 Mounting arrangement for light emitting diodes
12/23/2004	US20040257782 Electronic unit as well as method for manufacturing an electronic unit
12/23/2004	US20040257781 Mounting power handling components on printed circuit boards near high density routing channels
12/23/2004	US20040257729 Flexible circuit with electrostatic damage limiting feature
12/23/2004	US20040257638 Microfluidic analytical apparatus
12/23/2004	US20040257516 Anisotropic conductive material body, display apparatus, method for producing the display apparatus, and conductive member
12/23/2004	US20040257509 Liquid crystal display device and method of fabricating the same
12/23/2004	US20040257406 Nozzle arrangement with an electrically heated actuator
12/23/2004	US20040257279 Dielectric substrate with selectively controlled effective permittivity and loss tangent
12/23/2004	US20040257194 Methods for making microwave circuits
12/23/2004	US20040257193 Resistive material
12/23/2004	US20040257102 Secure content protection for board connections
12/23/2004	US20040257096 Back side probing method and assembly
12/23/2004	US20040256742 Semiconductor module and method of manufacturing the same
12/23/2004	US20040256739 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument
12/23/2004	US20040256738 Battery protection circuit with integrated passive components
12/23/2004	US20040256731 Dielectric composite material
12/23/2004	US20040256720 Thermal interface apparatus, systems, and methods
12/23/2004	US20040256716 Jumper chip component and mounting structure therefor
12/23/2004	US20040256715 Wiring board, semiconductor device and process of fabricating wiring board
12/23/2004	US20040256714 Laminated electronic component
12/23/2004	US20040256711 Semiconductor device, semiconductor module and hard disk
12/23/2004	US20040256701 Film carrier tape for mounting electronic devices thereon and final defect marking method using the same
12/23/2004	US20040256467 Electronic unit, circuit design for the same, and production method
12/23/2004	US20040256466 Thin electronic label and method for making same
12/23/2004	US20040256352 Embossed mask lithography
12/23/2004	US20040256350 deposition of a conductive thickfilm on the dielectric, followed by a subsintering of the conductive thickfilm, patterning is done before/ after sintering, etching is then done to expose the conductor(s), and the conductor(s) are then fired
12/23/2004	US20040256239 Tin plating method
12/23/2004	US20040256222 Apparatus and method for highly controlled electrodeposition
12/23/2004	US20040256150 Nonconducting substrate, forming a strip or a panel, on which a multiplicity of carrier elements are formed
12/23/2004	US20040256148 Electronic circuit device having flexibility and reduced footprint
12/23/2004	US20040256146 Electrode structure and methods for producing and using the same
12/23/2004	US20040256133 Constructing of an electronic assembly having a decoupling capacitor
12/23/2004	US20040255974 Equipment cleaner
12/23/2004	US20040255458 Programmed material consolidation methods for fabricating semiconductor device components and conductive features thereof

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