Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2005
03/09/2005CN1192694C Multilayer printed wiring board
03/09/2005CN1192693C Method of mounting electric connector of printed circuit board and mounting device
03/09/2005CN1192692C Multiple printed circuitboard for electronic components esp. acoustic surface wave elements, and method for constructing bumps, soldering frames, spaces on said multiple printed circuitboard
03/09/2005CN1192691C Process for integrating metal electrodes to diamond stock
03/09/2005CN1192690C Copper clad laminated sheet and its mfg. method
03/09/2005CN1192480C Electronic packaged assembly and prodn. method thereof
03/09/2005CN1192464C Electrical connecting box
03/09/2005CN1192463C Connector for printed wiring board
03/09/2005CN1192456C Battery connector
03/09/2005CN1192429C 线路 Line
03/09/2005CN1192424C Method for preparing multiple layer inner connection circuit
03/09/2005CN1192421C Substrate element and soft substrate
03/09/2005CN1192401C Through-hole interconnect device with isolated wire-leads and component barriers
03/09/2005CN1192283C Photosensitive insulation paste and thick film multilayer circuit substrate
03/09/2005CN1192241C Method and device for testing printed circuit board
03/09/2005CN1192088C Azeotrope-like compositions and their use
03/09/2005CN1192071C Connection material for sticking and connecting elements
03/09/2005CN1192053C Method for improving adhesion of metal films to polyphenylene ether resins
03/09/2005CN1191910C Method and apparatus for working ceramic printed-circuit board
03/09/2005CA2478906A1 Techniques for pin arrangements in circuit chips
03/08/2005US6865087 Wire management system
03/08/2005US6865074 Method of producing electronic unit of radio system and electronic unit
03/08/2005US6864941 Display apparatus characterized by wiring structure
03/08/2005US6864776 Coupling adjusting structure for double-tuned circuit
03/08/2005US6864620 Matrix type actuator
03/08/2005US6864586 Padless high density circuit board
03/08/2005US6864577 Via plug adapter
03/08/2005US6864576 Large line conductive pads for interconnection of stackable circuitry
03/08/2005US6864460 Method of ablating an opening in a hard, non-metallic substrate
03/08/2005US6864458 Iced film substrate cleaning
03/08/2005US6864435 Electrical contacts for flexible displays
03/08/2005US6864434 Warpage-preventive circuit board and method for fabricating the same
03/08/2005US6864153 Methods employing hybrid adhesive materials to secure components of semiconductor device assemblies and packages to one another
03/08/2005US6864121 Method of manufacturing circuit device
03/08/2005US6864119 COF semiconductor device and a manufacturing method for the same
03/08/2005US6863992 Composite reactive multilayer foil
03/08/2005US6863962 Sheet for a thermal conductive substrate, a method for manufacturing the same, a thermal conductive substrate using the sheet and a method for manufacturing the same
03/08/2005US6863936 Applying a strippable coating to the substrate, selective laser ablation to activate an underlying region of the substrate surface, immersing in solution of seeding particles to adhere them to activated region, plating; printed circuits
03/08/2005US6863793 Using pulsation reverse current
03/08/2005US6863578 Holding element for holding a carrier board
03/08/2005US6863370 Method of generating ejection pattern data, and head motion pattern data; apparatus for generating ejection pattern data; apparatus for ejecting functional liquid droplet; drawing system; method of manufacturing organic el device, electron emitting device, pdp device, electrophoresis display device, color filter, and organic el; and method of forming spacer, metal wiring, lens, resist, and light diffuser
03/08/2005US6863211 Omega-hydrofluoroalkyl ethers, precursor carboxylic acids and derivatives thereof, and their preparation and application
03/08/2005US6862806 Method for fabricating an ink-jet printer head
03/08/2005US6862804 Method of mounting camera module on wiring board
03/08/2005US6862784 Method of fabricating a wound capacitor
03/03/2005WO2005020652A1 Support element for a second printed circuit board arranged on a first circuit board
03/03/2005WO2005020651A1 Method for manufacturing an electronic module, and an electronic module
03/03/2005WO2005020649A2 Apparatus and method for use in printed circuit board drilling applications
03/03/2005WO2005020648A2 Copper-faced modules, imprinted copper circuits, and their application to suptercomputers
03/03/2005WO2005020647A2 Method for assembling at least one substrate-integrating component by surface mounting, a corresponding support and component
03/03/2005WO2005020385A1 Connector having a built-in electronic part
03/03/2005WO2005020377A1 Connection system
03/03/2005WO2005020295A2 Filling vias with thick film paste using contact printing
03/03/2005WO2005020254A2 Ultra-thin flexible inductor
03/03/2005WO2005020253A2 Printed circuit board with integrated inductor
03/03/2005WO2005020249A2 Fabrication of thick film electrical components
03/03/2005WO2005020215A1 Electrical connection and component assembly for constitution of a hard disk drive
03/03/2005WO2005019504A1 Method of preparing printed or daubed image and printed or daubed image element by it
03/03/2005WO2005018935A1 Screen printer
03/03/2005WO2004111287A3 Electroless gold plating solution
03/03/2005WO2004100179A8 Insulated conductive ball for anisotropic conductive connection, method of preparing the same, and product using the same
03/03/2005WO2004093506A3 Electomagnetic interference shielding for a printed circuit board
03/03/2005WO2004036969A8 Method and device for joining at least two parts
03/03/2005WO2003075625A3 Certification method for manufacturing process
03/03/2005US20050049385 Thermosetting resin
03/03/2005US20050048851 Electrical terminal and method for manufacturing same
03/03/2005US20050048825 Soldering structure between a tab of a bus bar and a printed substrate
03/03/2005US20050048821 Clockspring flat cable termination
03/03/2005US20050048812 Attachment plate for directly mating circuit boards
03/03/2005US20050048809 Flexible flat cable termination structure for a clockspring
03/03/2005US20050048807 Electrical contact and connector and method of manufacture
03/03/2005US20050048806 Electrical contact and connector and method of manufacture
03/03/2005US20050048770 Process for manufacturing a wiring board having a via
03/03/2005US20050048756 Ball film for integrated circuit fabrication and testing
03/03/2005US20050048748 Method of making a circuitized substrate
03/03/2005US20050048697 Self-assembled nanometer conductive bumps and method for fabricating
03/03/2005US20050048683 Light emitting diode and method for producing it
03/03/2005US20050048680 Printing one or more electrically conductive bonding lines to provide electrical conductivity in a circuit
03/03/2005US20050048415 Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet
03/03/2005US20050048414 Forming a photolithographic patterned nanoparticle film into integrated electronic circuits, chemical or gas sensor device, light emitting device; using water-soluble CaO mask
03/03/2005US20050048408 Composite laminate circuit structure
03/03/2005US20050048406 Method of patterning an electroconductive layer on a support
03/03/2005US20050048405 Photopatterning of conductive electrode layers containing electrically-conductive polymer particles
03/03/2005US20050048306 Method of producing ultra-thin copper foil with carrier, ultra-thin copper foil with carrier produced by the same, printed circuit board, multilayer printed circuit board and chip on film circuit board
03/03/2005US20050048298 Chromium-free antitarnish adhesion promoting treatment composition
03/03/2005US20050048259 Substrate frame
03/03/2005US20050048228 Patterning of electrically conductive layers by ink printing methods
03/03/2005US20050047776 Camera
03/03/2005US20050047730 Optoelectronic packaging assembly
03/03/2005US20050047101 Electronic part mounting substrate and method for producing same
03/03/2005US20050047032 Electronic control apparatus
03/03/2005US20050047022 Integrated lead suspension and method of construction
03/03/2005US20050047020 Integrated lead suspension and method of construction
03/03/2005US20050047009 Integrated lead suspension and method of construction
03/03/2005US20050046664 Direct writeTM system
03/03/2005US20050046573 Selective metal removal process for metallized retro-reflective and holographic films and radio frequency devices made therewith
03/03/2005US20050046544 Ball grid array resistor network having a ground plane
03/03/2005US20050046510 Embedded RF vertical interconnect for flexible conformal antenna
03/03/2005US20050046431 Probe card for use with microelectronic components,and methods for making same
03/03/2005US20050046288 Actuator
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