Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
03/2005
03/16/2005EP1515366A2 Techniques for pad arrangements on circuit chips
03/16/2005EP1515365A2 Electronic assembly comprising substrate with embedded capacitors and methods of manufacture
03/16/2005EP1514957A1 Method for manufacturing plated film, cathode roll for plating, and method for manufacturing circuit board
03/16/2005EP1514956A1 Tin or tin alloy Electroplating on composite substrates
03/16/2005EP1514459A1 Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate
03/16/2005EP1514302A2 Method and device for producing an electronic component having external contact surfaces
03/16/2005EP1513965A1 Process for metallising support media made from plastic material
03/16/2005EP1513621A2 Method for patterning carbon nanotube coating and carbon nanotube wiring
03/16/2005EP1470207A4 Aqueous stripping and cleaning composition
03/16/2005EP1449415B1 Method and device for through-hole plating of substrates and printed circuit boards
03/16/2005EP0932328B1 Substrate for mounting electronic part and process for manufacturing the same
03/16/2005CN2686278Y Test protection apparatus combination
03/16/2005CN2686277Y Circuit board ripple welding tool
03/16/2005CN2686276Y Metal plate for producing printed wiring board and multisection printed wiring board
03/16/2005CN2686094Y 电子元件 Electronic component
03/16/2005CN1596569A System and method for rapid alignment and accurate placement of electronic components on a printed circuit board
03/16/2005CN1596485A Waveguide in a printed circuit board
03/16/2005CN1596172A Method of laser milling using constant tool path algorithm
03/16/2005CN1596069A Package assembly of electronic apparatus and assembling method thereof
03/16/2005CN1596064A Conductive sheet having conductive layer with improved adhesion and product including the same
03/16/2005CN1596063A Pattern forming method, conductive film, electro-optics device and electronic machine
03/16/2005CN1596062A Process for producing wiring circuit board
03/16/2005CN1595649A Electronic element and manufacturing method thereof
03/16/2005CN1595627A Packaging base plate with no plating bar and making method for same
03/16/2005CN1595626A Tin-ball forming method for electronic component
03/16/2005CN1595560A Manufacturing method of ceramic raw sheet and manufacturing method of electronic member using the ceramic raw sheet
03/16/2005CN1595297A Photosensitive resin composition, photosensitive element, resist pattern, method for producing resist pattern, and substrate having the resist pattern laminated thereon
03/16/2005CN1594658A Inhibitor and manufacturing process thereof
03/16/2005CN1593839A Novel purpose of 4-(4-methyl-n-amyl)-cyclohexane-1, 2-dicarboxylic acid
03/16/2005CN1593838A Novel purpose of 4-(4-methyl-3-pentenyl)-4-cyclohexene-1, 2-dicarboxylic acid
03/16/2005CN1593837A Novel purpose of 4-(4-methyl-3-pentenyl)-4-cyclohexene-1, 2-diacid anhydride
03/16/2005CN1593827A Solder ball bonding method and bonding device
03/16/2005CN1593824A Array method for drill spindles of printed circuit board drilling machine or forming machine
03/16/2005CN1193652C Method for manufacturing multilayer printed circuit board and composite foil used therein
03/16/2005CN1193651C 印刷线路板 Printed circuit boards
03/16/2005CN1193650C A method for making circuit board sealing glue
03/16/2005CN1193649C Method and device for producing electrical connecting elementf
03/16/2005CN1193648C Method for manufacturing built-in resistor of printed circuit board
03/16/2005CN1193646C Printed circuit boards and their manufacture
03/16/2005CN1193645C Base plate connecting device
03/16/2005CN1193462C Electric connector and chip soldered dot leveling method
03/16/2005CN1193425C Multilayer substrate for semiconductor device
03/16/2005CN1193416C Electronic device and method of manufacturing the electronic device
03/16/2005CN1193381C Arrangement for enabling trimming on substrate and method of producing substrate that enables trimming
03/16/2005CN1193348C Circuit base plate for preventing destruction by electrostatic field and magnetic head using said circuit base plate
03/16/2005CN1193277C Display of electronic device
03/16/2005CN1193259C Liquid crystal apparatus, its making method and electronic apparatus
03/16/2005CN1193056C Polynuclear epoxy compound, resin obtained therefrom curable with actinic energy ray, and photocurable/thermosetting resin composition containing the same
03/16/2005CN1192844C 焊接装置 Welding equipment
03/15/2005US6867983 sheet, a web, or a plate that is embedded with tiny electronic elements
03/15/2005US6867758 Liquid crystal display device
03/15/2005US6867668 High frequency signal transmission from the surface of a circuit substrate to a flexible interconnect cable
03/15/2005US6867554 Ballast control card
03/15/2005US6867505 Semiconductor device, a method for making the same, and an LCD monitor comprising the same
03/15/2005US6867504 Method and apparatus for printed circuit board pads with registering feature for component leads
03/15/2005US6867485 Semiconductor package using terminals formed on a conductive layer of a circuit board
03/15/2005US6867484 Semiconductor device adhered well to a heat sink, reducible in size and allowing an easy modification of the design of an external terminal.
03/15/2005US6867378 Solder paste and terminal-to-terminal connection structure
03/15/2005US6867132 Large line conductive pads for interconnection of stackable circuitry
03/15/2005US6867121 Method of apparatus for interconnecting a relatively fine pitch circuit layer and adjacent power plane(s) in a laminated construction
03/15/2005US6867068 Semiconductor device, method of making the same, circuit board, and film carrier tape
03/15/2005US6867066 Method for production of a semiconductor device with package that includes an insulator frame on a metal member
03/15/2005US6866989 Exposing a photosensitive paste provided on the substrate through masks of a predetermined pattern, developing and firing
03/15/2005US6866919 Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereof
03/15/2005US6866892 Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board
03/15/2005US6866764 Electroless deposition using organometallic polymer and organosilicon polymer; forming copper film
03/15/2005US6866741 Dispensing a liquid polymeric material between a conducting surface on a first substrate and a conducting surface on a second substrate, pressing the liquid polymeric material so that it flows towards edges of both substrates, curing
03/15/2005US6866739 Film with metal foil
03/15/2005US6866552 Electrical connector with a terminal pin alignment plate
03/15/2005US6866524 Connector mounting structure and connector mounting method
03/15/2005US6866523 Construction for mounting a terminal, a circuit board connector and method of mounting it
03/15/2005US6866450 Entry sheet for drilling and method for drilling hole
03/15/2005US6866368 Flexible circuit board
03/15/2005US6866255 Sputtered spring films with low stress anisotropy
03/15/2005US6866182 Apparatus and method to prevent oxidation of electronic devices
03/15/2005US6865801 Apparatus for manufacturing a wiring board
03/10/2005WO2005022970A1 Method for manufacturing printed wiring board and printed wiring board
03/10/2005WO2005022969A2 Method and system for creating fine lines using ink jet technology
03/10/2005WO2005022968A1 Patterning an electroconductive layer on a support
03/10/2005WO2005022967A1 Electronic part manufacturing method
03/10/2005WO2005022966A2 A method for pattern metalization of substrates
03/10/2005WO2005022704A1 Clockspring flat cable termination
03/10/2005WO2005022684A2 Low cost rfid antenna manufactured from conductive loaded resin-based materials
03/10/2005WO2005022665A1 Forming electrically conductive layers by ink printing
03/10/2005WO2005022632A1 Surface-mounted device with leads
03/10/2005WO2005022576A2 Lamp base for a high-pressure discharge lamp, and corresponding high-pressure discharge lamp
03/10/2005WO2005022559A1 Conductive film for transfer, method for forming transparent conductive film using same, and transparent conductive film
03/10/2005WO2005022260A1 Photosensitive resin composition, photosensitive element using same, method for forming resist pattern, method for producing printed wiring board, and method for removing photocured product
03/10/2005WO2005021862A2 A flexible flat cable termination structure for a clockspring
03/10/2005WO2005021836A2 Chromium-free antitarnish adhesion promoting treatment composition
03/10/2005WO2005021700A1 Cleaning agent for removing solder flux and method for cleaning solder flux
03/10/2005WO2005021597A1 Photopatterning conductive electrode layers with electrically-conductive polymer
03/10/2005WO2005021276A1 Method and device for further printing with electrical conductivity
03/10/2005WO2004087336A9 Ultrasonic spray coating system
03/10/2005WO2004068918A3 Method for producing thin silver layers
03/10/2005US20050054776 superior thermal-stress-reducing effects; adhesive for printed circuit manufacture; cured film obtained from a modified polyamideimide resin, a thermosetting resin and an organic phosphorus-based compound
03/10/2005US20050054756 Curable resins and curable resin compositions containing the same
03/10/2005US20050054548 Using mixture of hydroxylamine, hydroxide, antifoam agents,cleaner, precipitation inhibitor and water; printed circuits
03/10/2005US20050054200 Fast firing flattening method and apparatus for sintered multilayer ceramic electronic substrates
03/10/2005US20050054187 Method for forming ball pads of BGA substrate
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