| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/23/2005 | CN1194522C Mounting structure of telephone mouthpiece |
| 03/23/2005 | CN1194409C Circuit board and its manufacturing method and high output module |
| 03/23/2005 | CN1194328C Method and device for forming picture on baseplate |
| 03/23/2005 | CA2482113A1 Process for the purification of thiophenes |
| 03/22/2005 | US6871339 Electronic apparatus which uses a liquid drop discharge device to form, mixed upon a substrate, patterns which have mutually differing formats; able to form patterns at desired accuracy, and can shorten time required for manufacture |
| 03/22/2005 | US6870952 Positioning apparatus used in a process for producing multi-layered printed circuit board and method of using the same |
| 03/22/2005 | US6870741 System for reducing apparent height of a board system |
| 03/22/2005 | US6870738 Power semiconductor module |
| 03/22/2005 | US6870590 Electrooptical unit with a flexible board and electronic apparatus |
| 03/22/2005 | US6870589 Liquid crystal display element |
| 03/22/2005 | US6870516 Low cost antennas using conductive plastics or conductive composites |
| 03/22/2005 | US6870436 Method and apparatus to attenuate power plane noise on a printed circuit board using high ESR capacitors |
| 03/22/2005 | US6870276 Apparatus for supporting microelectronic substrates |
| 03/22/2005 | US6870272 Methods of making microelectronic assemblies including compliant interfaces |
| 03/22/2005 | US6870267 Off-center solder ball attach assembly |
| 03/22/2005 | US6870264 Multi-level circuit substrate, method for manufacturing same and method for adjusting a characteristic impedance therefor |
| 03/22/2005 | US6870260 Semiconductor module |
| 03/22/2005 | US6870247 Interposer with a lateral recess in a slot to facilitate connection of intermediate conductive elements to bond pads of a semiconductor die with which the interposer is assembled |
| 03/22/2005 | US6870244 Lead frame and production process thereof and production process of thermally conductive substrate |
| 03/22/2005 | US6869750 Structure and method for forming a multilayered structure |
| 03/22/2005 | US6869665 Wiring board with core layer containing inorganic filler |
| 03/22/2005 | US6869664 Lightweight circuit board with conductive constraining cores |
| 03/22/2005 | US6869637 Copper inhibitors additionally permit to positively influence the appearance of the surface by leveling the layer of copper that had been roughened by the etching process |
| 03/22/2005 | US6869515 Providing substrate with electroconductive surface; providing electrochemical deposition cell; immersing substrate in electrolyte; providing uniform powerful turbulent agitation; providing electroplating current for filling openings |
| 03/22/2005 | US6869491 Bonding method |
| 03/22/2005 | US6869487 Process and apparatus for treating a workpiece such as a semiconductor wafer |
| 03/22/2005 | US6869311 Receptacle |
| 03/22/2005 | US6869293 Electronic device having integrated connector |
| 03/22/2005 | US6869291 Electrical connector having improved elastomeric contact pressure pad |
| 03/22/2005 | US6869290 Circuitized connector for land grid array |
| 03/22/2005 | US6869203 LED symbol signal |
| 03/22/2005 | US6869008 Method of forming bumps |
| 03/22/2005 | US6868885 Apparatus for manufacturing laminated member |
| 03/22/2005 | US6868861 Level control system for sheet casting process |
| 03/22/2005 | US6868780 Screen printing method including variable speed plate separating operation |
| 03/22/2005 | US6868604 Method for forming an electrical structure |
| 03/17/2005 | WO2005025284A1 Arrangement for co-planar vertical surface mounting of subassemblies on a mother board |
| 03/17/2005 | WO2005025283A1 Soldering method and liquid applying unit therefor |
| 03/17/2005 | WO2005025282A1 Thin-film assembly and method for producing said assembly |
| 03/17/2005 | WO2005025042A1 Power conversion module device and power source device using the same |
| 03/17/2005 | WO2005025006A1 Connector for surface mounting subassemblies vertically on a mother board and assemblies comprising the same |
| 03/17/2005 | WO2005025001A1 Embedded rf vertical interconnect for flexible conformal antenna |
| 03/17/2005 | WO2005024946A1 Semiconductor device and method for manufacturing same |
| 03/17/2005 | WO2005024945A1 Integrated circuit component and mounting method |
| 03/17/2005 | WO2005024944A1 Lead frame and method of manufacturing the lead frame |
| 03/17/2005 | WO2005023954A1 Adhesive agent and method for production thereof |
| 03/17/2005 | WO2005023702A1 Metal nanoparticle and method for producing same, liquid dispersion of metal nanoparticle and method for producing same, metal thin line, metal film and method for producing same |
| 03/17/2005 | WO2005023523A2 Method and device for the production of a three-dimensional multi-material component by means of ink-jet-type printing |
| 03/17/2005 | WO2005002308A3 Pieces for passive electronic components and method for production thereof |
| 03/17/2005 | WO2004086831A3 Method and device for electrically and mechanically connecting two printed boards |
| 03/17/2005 | WO2004016055A8 An electronic product, a body and a method of manufacturing |
| 03/17/2005 | US20050060732 Actuator employing a bobbin incorporating a winding coil and a manufacturing method thereof |
| 03/17/2005 | US20050059276 Connector with solder-bearing contact |
| 03/17/2005 | US20050059269 Connector and image sensor module using the same |
| 03/17/2005 | US20050058951 photolithography technique to form an organic mono-molecular film pattern, then thin film is selectively grown on the organic monomolecular film pattern, transcribed onto a second substrate to form a micro pattern made of the thin film on the second substrate |
| 03/17/2005 | US20050058945 Reduces the tendency of the copper etch step from under-cutting the nickel/gold to cause slivers that cause short circuiting by providing a conforming nickel/gold layer that extends down the side of the traces |
| 03/17/2005 | US20050058840 Bank forming method, wiring pattern forming method, electro-optical device, and electronic apparatus |
| 03/17/2005 | US20050058771 Rolling contact screening method and apparatus |
| 03/17/2005 | US20050058175 Dynamic beam splitter outputting a selectable number of beams |
| 03/17/2005 | US20050057908 Multi-layered interconnect structure using liquid crystalline polymer dielectric |
| 03/17/2005 | US20050057906 Connector sheet and wiring board, and production processes of the same |
| 03/17/2005 | US20050057902 Mold-type electronic control unit |
| 03/17/2005 | US20050057865 Shunt connection to a PCB of an energy management system employed in an automotive vehicle |
| 03/17/2005 | US20050057610 Micro-electromechanical fluid ejection device having a buckle-resistant actuator |
| 03/17/2005 | US20050057338 Surface-mounted thermistor and manufacturing method thereof |
| 03/17/2005 | US20050057334 Chip coil and printed circuit board for the same |
| 03/17/2005 | US20050057330 Flexible circuit piezoelectric relay |
| 03/17/2005 | US20050057327 Transmission line of coaxial-type using dielectric film and manufacturing method and packaging method thereof |
| 03/17/2005 | US20050057326 Microstrip line and method for producing of a microstrip line |
| 03/17/2005 | US20050056946 Electrical circuit assembly with improved shock resistance |
| 03/17/2005 | US20050056939 Multilayer; electrodes, dielectrics containing alumina and tantalum oxidemultilayer |
| 03/17/2005 | US20050056931 High frequency circuit block unit, method for producing same, high frequency module device and method for producing same |
| 03/17/2005 | US20050056925 High-frequency module and method for manufacturing the same |
| 03/17/2005 | US20050056923 Apparatus and method for stacking integrated circuits |
| 03/17/2005 | US20050056916 Circuit device and manufacturing method of circuit device |
| 03/17/2005 | US20050056915 Film carrier tape for mounting electronic devices thereon |
| 03/17/2005 | US20050056913 Stereolithographic method for forming insulative coatings for via holes in semiconductor devices, insulative coatings so formed, systems for forming the insulative coatings, and semiconductor devices including via holes with the insulative coatings |
| 03/17/2005 | US20050056797 Defect detector and defect detection method |
| 03/17/2005 | US20050056793 Process for precise arrangement of micro-bodies |
| 03/17/2005 | US20050056687 Thermosetting flux and solder paste |
| 03/17/2005 | US20050056684 Method and device to elongate a solder joint |
| 03/17/2005 | US20050056682 Method of locating conductive spheres utilizing screen and hopper of solder balls |
| 03/17/2005 | US20050056681 Method of locating conductive spheres utilizing screen and hopper of solder balls |
| 03/17/2005 | US20050056627 Micro-machining employing multiple independently focused and independently steered beams |
| 03/17/2005 | US20050056626 Multiple beam micro-machining system and method |
| 03/17/2005 | US20050056458 Mounting pad, package, device, and method of fabricating the device |
| 03/17/2005 | US20050056445 Junction structure and junction method for conductive projection |
| 03/17/2005 | US20050055829 Method of fabricating a micro-electromechanical fluid ejection device having enhanced actuator strength |
| 03/17/2005 | DE19823615B4 Lötflussmittel Soldering flux |
| 03/17/2005 | DE19605846B4 Reinigungsvorrichtung Cleaning device |
| 03/17/2005 | DE10337640A1 Power semiconductor module for fitting on a heat sink has a casing, power semiconductor components and an insulating substrate with metal layers on both sides |
| 03/17/2005 | DE10335805A1 Circuit board with metal base forming potential reference plane and heat sink for power-dissipating components, includes both electrical and thermal vias for heat dissipation |
| 03/17/2005 | DE10249569B4 Werkzeugkopf zum Befestigen eines elektrischen Leiters auf der Kontaktfläche eines Substrates und Verfahren zum Durchführen der Befestigung A tool head for securing an electrical conductor on the contact surface of a substrate and methods for performing the fastening |
| 03/17/2005 | DE10241643B4 Einrichtung zur elektrischen Verbindung durch Lötung der Leiter von Flachkabeln in ihren abisolierten Bereichen Means for electrical connection by soldering the conductor of flat cables in their stripped areas |
| 03/17/2005 | DE102004039530A1 Plug-in contact for a printed circuit board (PCB) has a first pin to hold on the PCB and parallel contact plates molded on the pin to limit a contact area for retaining and contacting a contact pin |
| 03/17/2005 | DE10045534B4 Elektronisches Bauteil mit Außenanschlußelementen ausgebildet als Kapillarelement, Verfahren zur Herstellung und Anordnung An electronic part having external connection elements formed as capillary element, methods of making and arrangement |
| 03/17/2005 | CA2729740A1 Embedded rf vertical interconnect for flexible conformal antenna |
| 03/17/2005 | CA2537998A1 Thin-film assembly and method for producing said assembly |
| 03/16/2005 | EP1515595A2 Circuit support |
| 03/16/2005 | EP1515389A1 Multilayer high frequency device with planar antenna thereon and manufacturing method thereof |