| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/24/2005 | US20050064648 Method for forming wiring pattern, method for manufacturing semiconductor device, electro-optic device and electronic equipment |
| 03/24/2005 | US20050064633 Film pattern formation method, device and method for manufacturing the same, electro-optical device, electronic device, and method for manufacturing active matrix substrate |
| 03/24/2005 | US20050064630 Method for producing a protection for chip edges and system for the protection of chip edges |
| 03/24/2005 | US20050064627 Method for manufacturing an electronic circuit device and electronic circuit device |
| 03/24/2005 | US20050064342 as the main substrate can be separated from the sub substrate along the thin portion, the separation line will not be located at an unintended position or will not be in an unintended shape. As a result, reliability of the pattern formed on the main substrate is improved |
| 03/24/2005 | US20050064336 Unsaturated group-containing multi-branched compounds, curable compositions containing the same, and cured products thereof |
| 03/24/2005 | US20050064222 Component and method for manufacturing printed circuit boards |
| 03/24/2005 | US20050064200 Polycarbodiimides; for electronic parts and lamination treatments; improved storage stability, adhesive strength, and high elastic modulus at high temperatures; for adhesion of copper foil onto glass fiber reinforced epoxy resin substrate |
| 03/24/2005 | US20050064159 Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof |
| 03/24/2005 | US20050064139 Sheet material having metal points and method for the production thereof |
| 03/24/2005 | US20050064108 Method of forming metal fine particle pattern and method of forming electroconductive pattern |
| 03/24/2005 | US20050063635 Wiring board and a semiconductor device using the same |
| 03/24/2005 | US20050063166 Method and apparatus for providing an integrated printed circuit board registration coupon |
| 03/24/2005 | US20050063165 Placement of sacrificial solder balls underneath the PBGA substrate |
| 03/24/2005 | US20050063164 Integrated circuit die/package interconnect |
| 03/24/2005 | US20050063142 Orientation system for thin printed circuit board and method for orientating the board |
| 03/24/2005 | US20050063135 High tolerance embedded capacitors |
| 03/24/2005 | US20050063127 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 03/24/2005 | US20050063096 Integrated lead suspension and method of construction |
| 03/24/2005 | US20050062806 Inkjet head |
| 03/24/2005 | US20050062587 Method and structure of a substrate with built-in via hole resistors |
| 03/24/2005 | US20050062173 Microelectronic substrates with integrated devices |
| 03/24/2005 | US20050062168 Bonded structure using conductive adhesives, and a manufacturing method thereof |
| 03/24/2005 | US20050062160 Double-sided wiring circuit board and process for producing the same |
| 03/24/2005 | US20050062157 Substrate with terminal pads having respective single solder bumps formed thereon |
| 03/24/2005 | US20050062153 Mounting structure of electronic component, electro-optic device, electronic equipment, and method for mounting electronic component |
| 03/24/2005 | US20050062151 Semiconductor integrated circuit and electronic apparatus having the same |
| 03/24/2005 | US20050062145 Land pattern configuration |
| 03/24/2005 | US20050062144 Memory expansion and chip scale stacking system and method |
| 03/24/2005 | US20050061854 Method for mounting a semiconductor package onto PCB |
| 03/24/2005 | US20050061850 Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components |
| 03/24/2005 | US20050061661 Electrodeposition device and electrodeposition system for coating structures which have already been made conductive |
| 03/24/2005 | US20050061660 System and method for electrolytic plating |
| 03/24/2005 | US20050061544 Circuit board having metallic plate, printed circuit board and flexible circuit board |
| 03/24/2005 | US20050061543 Component lead system |
| 03/24/2005 | US20050061542 Suspension board with circuit and procuding method thereof |
| 03/24/2005 | US20050061540 Printed circuit board test access point structures and method for making the same |
| 03/24/2005 | US20050061423 Manufacturing method and manufacturing device of metal clad film |
| 03/24/2005 | US20050061202 Surface treatment agent for copper and copper alloy |
| 03/24/2005 | US20050060887 Method for producing metal/ceramic bonding circuit board |
| 03/24/2005 | US20050060886 opening for interlevel connection can be easily formed in an interlevel insulator layer made of resin by a build-up process; involves making a pillar-like member stand on the first conductive interconnection before applying the resin film |
| 03/24/2005 | US20050060884 Fabrication of nanoscale thermoelectric devices |
| 03/24/2005 | DE10340328A1 Sealing chill for a printed-board assembly has a wall structure to limit chill volume in a three-dimensional direction and in directions vertical to that |
| 03/24/2005 | DE10339591A1 Lampensockel für eine Hockdruckentladungslampe und Hochdruckentladungslampe Lamp base for a high pressure discharge lamp and high intensity discharge lamp |
| 03/24/2005 | DE10338732A1 Process for permanently joining two card layers of a multiple layer data carrier or data carrier semi-finished product comprises passing a laser beam through the first layer of a card layer arrangement to form an interlocking connection |
| 03/24/2005 | DE10337443A1 Circuit layout for a motor vehicle's passenger safety system has a main board (MB) with circuit components (CC) and an additional board to carry other CC and to fit on the MB with a support |
| 03/24/2005 | DE10337137A1 Verfahren zum partiellen Beschichten von Leiterplatten und Vorrichtung zur Durchführung des Verfahrens A process for the partial coating of printed circuit boards and device for carrying out the method |
| 03/24/2005 | DE10240105B4 Herstellung organischer elektronischer Schaltkreise durch Kontaktdrucktechniken Production of organic electronic circuits by contact printing techniques |
| 03/24/2005 | DE10211956B4 Vorrichtung zum Anbringen optoelektrischer Komponenten auf einer Leiterplatte Apparatus for applying optoelectric components on a printed circuit board |
| 03/24/2005 | CA2539463A1 Method and device for contacting vo semiconductor chips on a metallic substrate |
| 03/24/2005 | CA2538214A1 Coupler resource module |
| 03/23/2005 | EP1517599A1 A method of interconnecting opposite sides of an electronic component interconnection device |
| 03/23/2005 | EP1517598A1 Method for mounting an electronic component on a support |
| 03/23/2005 | EP1517597A2 Method for producing a moulded component comprising an integrated conductor strip and moulded component |
| 03/23/2005 | EP1517596A2 High tollerance embedded capacitors |
| 03/23/2005 | EP1517595A2 Resin composition, prepreg, laminate sheet and printed wiring board using the same and method for production thereof |
| 03/23/2005 | EP1517372A2 Electronic component, method for making the same, and lead frame and mold assembly for use therein |
| 03/23/2005 | EP1517371A2 Electronic component, method for making the same, and lead frame and mold assembly for use therein |
| 03/23/2005 | EP1517370A2 Method for producing metal/ceramic bonding circuit board |
| 03/23/2005 | EP1516891A1 A binder composition for lamination and an adhesive film using the same |
| 03/23/2005 | EP1516757A2 Actuator |
| 03/23/2005 | EP1516519A1 Metallised parts made from plastic material |
| 03/23/2005 | EP1516404A2 Integrated device providing overcurrent and overvoltage protection and common-mode filtering to data bus interface |
| 03/23/2005 | EP1516372A2 Surface-mountable miniature light-emitting diode and/or photodiode and method for the production thereof |
| 03/23/2005 | EP1515976A1 Dicopper(i)oxalate complexes for use as precursor substances in metallic copper deposition |
| 03/23/2005 | EP1368813A4 Method for patterning metal using nanoparticle containing precursors |
| 03/23/2005 | CN1599770A Heat-curable resin composition |
| 03/23/2005 | CN1599769A 树脂组合物 Resin composition |
| 03/23/2005 | CN1599742A Organic carboxylic acid salt composition, process for preparation thereof and additives for epoxy resins |
| 03/23/2005 | CN1599552A Electronic unit mounting device |
| 03/23/2005 | CN1599543A Signal transmission device with hole and tin ball |
| 03/23/2005 | CN1599542A Lamination process of flexible circuit board and auxiliary material for lamination |
| 03/23/2005 | CN1599541A Drive device of wiring board manufacturing machine |
| 03/23/2005 | CN1599540A Engraving machine for wiring board |
| 03/23/2005 | CN1599513A Ultra-thin copper foil with carrier and method of producing ultra-thin copper foil with carrier and printed circuit board, |
| 03/23/2005 | CN1599142A Connector and image sensor module using the same |
| 03/23/2005 | CN1599048A Method for manufacturing an electronic circuit device and electronic circuit device |
| 03/23/2005 | CN1599006A Connection member and driving device of plasma display panel |
| 03/23/2005 | CN1599005A Connection structure and method of plasma display panel |
| 03/23/2005 | CN1598976A Surface-mounted thermistor and manufacturing method thereof |
| 03/23/2005 | CN1598941A Actuator employing a bobbin incorporating a winding coil and a manufacturing method thereof |
| 03/23/2005 | CN1598649A Electrooptical device, flexible wiring substrate, manufacturing method of electrooptical device and electronic device |
| 03/23/2005 | CN1598483A Defect detector and defect detection method |
| 03/23/2005 | CN1597770A Resin composition, prepreg, laminate sheet and printed wiring board using the same |
| 03/23/2005 | CN1597333A Process for forming a patterned thin film structure for in-mold decoration |
| 03/23/2005 | CN1597235A New use of 4-(4-mothyl-n-amyl) cyclohexane-1, 2-diacid anhydride |
| 03/23/2005 | CN1194602C Element mounting method |
| 03/23/2005 | CN1194601C Element mounting method |
| 03/23/2005 | CN1194597C Production method for copper-clad laminated sheet |
| 03/23/2005 | CN1194596C Method for making multi-layer circuit board with internal inserted passive component |
| 03/23/2005 | CN1194595C Structure of high-density multi-layer circuit board and its manufacture method |
| 03/23/2005 | CN1194594C Soldering method and device |
| 03/23/2005 | CN1194593C Application method of outer lead pin joining backfold welding heat insulating material |
| 03/23/2005 | CN1194592C Process and device for generating test patterns when applying solder paste by a screen printing process on printed circuit boards |
| 03/23/2005 | CN1194591C Circuit board design method |
| 03/23/2005 | CN1194590C Method for manufacturing printed wiring board |
| 03/23/2005 | CN1194589C Testing device of tin wave contact time and its method |
| 03/23/2005 | CN1194588C Nano laminated film circuit material |
| 03/23/2005 | CN1194587C Production method of copper foil for fine line use |
| 03/23/2005 | CN1194586C Electronic apparatus |