| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 03/30/2005 | EP1518889A1 Curable reactive resin system |
| 03/30/2005 | EP1518886A1 Multi layered, oriented, with electromagnetic radiation patternable foil made of thermoplastic polyester for the production of selectively metallized foils |
| 03/30/2005 | EP1518885A1 Oriented, with electromagnetic radiation patternable and aminosilane coated foil made of thermoplastic polyester for the production of selectively metallized foils |
| 03/30/2005 | EP1518859A1 Process for the purification of thiophenes |
| 03/30/2005 | EP1518847A2 Aluminum/ceramic bonding substrate and method for producing same |
| 03/30/2005 | EP1518449A1 Releasable protective insulating layers for substrates |
| 03/30/2005 | EP1518448A1 Carriers for printed circuit board marking |
| 03/30/2005 | EP1518275A2 Method for producing a component comprising a conductor structure that is suitable for use at high frequencies and corresponding component |
| 03/30/2005 | EP1518145A2 Display cell, in particular liquid crystal, or photovoltaic cell comprising means for connection to an electronic control circuit |
| 03/30/2005 | EP1517939A1 Biaxially oriented polyester film and laminates thereof with copper |
| 03/30/2005 | EP1384263B1 Support for electrical circuit elements |
| 03/30/2005 | EP1075782B1 Adapted electrically conductive layer |
| 03/30/2005 | EP0843894B1 Encapsulant with fluxing properties and method of use |
| 03/30/2005 | CN2689652Y Gas preheater of rotary disk welding furnace |
| 03/30/2005 | CN2689651Y Multi-layer circuit board structure with separated column |
| 03/30/2005 | CN1602652A Substrate cleaner |
| 03/30/2005 | CN1602314A Copper deposition method using copper formate complexes |
| 03/30/2005 | CN1602145A Pressed-on appts |
| 03/30/2005 | CN1602143A Fixing method used between components |
| 03/30/2005 | CN1602142A Nozzle structure of local soft soldering appts. |
| 03/30/2005 | CN1602141A Single board able to realize live-wire insertion and its realizing method |
| 03/30/2005 | CN1602140A Method of auto actuating circuit distribution by software |
| 03/30/2005 | CN1602139A Hybrid integrated circuit device and method of manufacturing the same |
| 03/30/2005 | CN1602138A Printed circuit board test access point structures and method for making the same |
| 03/30/2005 | CN1602135A Printed circuit board and its wiring method |
| 03/30/2005 | CN1601739A Land pattern configuration |
| 03/30/2005 | CN1601736A Semiconductor integrated circuit and electronic apparatus having the same |
| 03/30/2005 | CN1601715A Assembling apparatus, assembling method and terminal cleaning apparatus |
| 03/30/2005 | CN1601712A Reinforced solder bump structure and method for forming a reinforced solder bump |
| 03/30/2005 | CN1601705A Method for dicing semiconductor wafer |
| 03/30/2005 | CN1601672A 固体电解电容器 The solid electrolytic capacitor |
| 03/30/2005 | CN1601611A Suspension board with circuit and procuding method thereof |
| 03/30/2005 | CN1195397C Electric circuit board production and its repairing method |
| 03/30/2005 | CN1195396C Flexible circuit board and its preparing process |
| 03/30/2005 | CN1195307C Stack-up type electronic component mfg. method, and mfg. apparatus |
| 03/30/2005 | CN1195169C Hot air removable nozzle |
| 03/29/2005 | US6873529 High frequency module |
| 03/29/2005 | US6873513 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 03/29/2005 | US6873145 Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card |
| 03/29/2005 | US6873056 Electrode-to-electrode bond structure |
| 03/29/2005 | US6873031 Shielding device used for various components mounted on circuit board aligned with selectively cut areas |
| 03/29/2005 | US6872962 Radio frequency (RF) filter within multilayered low temperature co-fired ceramic (LTCC) substrate |
| 03/29/2005 | US6872949 Connection inspecting apparatus, connection inspecting method, and recording medium for recording programs executing the method |
| 03/29/2005 | US6872894 Information handling system utilizing circuitized substrate |
| 03/29/2005 | US6872893 Wiring board provided with passive element and cone shaped bumps |
| 03/29/2005 | US6872650 Ball electrode forming method |
| 03/29/2005 | US6872646 Method for manufacturing conductive pattern substrate |
| 03/29/2005 | US6872600 Plastic lead frames for semiconductor devices, packages including same, and methods of fabrication |
| 03/29/2005 | US6872592 Methods for providing an integrated circuit package with an alignment mechanism |
| 03/29/2005 | US6872591 Method of making a semiconductor chip assembly with a conductive trace and a substrate |
| 03/29/2005 | US6872590 Package substrate for electrolytic leadless plating and manufacturing method thereof |
| 03/29/2005 | US6872579 Thin-film coil and method of forming same |
| 03/29/2005 | US6872500 Mixture of electroconductive polymer and electroconductivity intensifier; mixing; imagewise heating |
| 03/29/2005 | US6872468 Peelable circuit board foil |
| 03/29/2005 | US6872465 Solder |
| 03/29/2005 | US6872436 Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel |
| 03/29/2005 | US6872321 Direct positive image photo-resist transfer of substrate design |
| 03/29/2005 | US6872081 Electronic device, method of manufacturing the same and method of designing the same, and circuit board and electronic instrument |
| 03/29/2005 | US6871804 Disconnectable nozzle for hot air |
| 03/29/2005 | US6871777 Electrostatic methods and apparatus for mounting and demounting particles from a surface having an array of tacky and non-tacky areas |
| 03/29/2005 | US6871776 Manufacture of solid-solder-deposit PCB utilizing electrically heated wire mesh |
| 03/29/2005 | US6871775 Process for soldering and connecting structure |
| 03/29/2005 | US6871773 Improved dispersion stability; chemisorption |
| 03/29/2005 | US6871396 Transfer material for wiring substrate |
| 03/29/2005 | US6871395 Methods for manufacturing a tactile sensor using an electrically conductive elastomer |
| 03/29/2005 | US6871392 Method of constructing an integrated lead suspension |
| 03/24/2005 | WO2005027606A1 Method for manufacturing double-sided printed glass board |
| 03/24/2005 | WO2005027605A1 Method for manufacturing double-sided printed glass board |
| 03/24/2005 | WO2005027604A1 Method for mounting electronic component |
| 03/24/2005 | WO2005027603A1 Electronic component mounting module |
| 03/24/2005 | WO2005027602A1 Method for manufacturing an electronic module |
| 03/24/2005 | WO2005027601A1 Insulating pattern and method of forming the same |
| 03/24/2005 | WO2005027600A1 Substrate and method for manufacturing same |
| 03/24/2005 | WO2005027599A1 Methods and devices for manufacturing of electrical components and laminated structures |
| 03/24/2005 | WO2005027579A1 Heater and the method for producing the same using pcb |
| 03/24/2005 | WO2005027578A1 Warming apparatus with heater produced by pcb |
| 03/24/2005 | WO2005027221A1 Chip on flex tape with dimension retention pattern |
| 03/24/2005 | WO2005027200A2 Method and device for contacting vo semiconductor chips on a metallic substrate |
| 03/24/2005 | WO2005027197A2 Coupler resource module |
| 03/24/2005 | WO2005027020A1 Electric connector and marking method |
| 03/24/2005 | WO2005026761A1 A method of manufacturing an electronic device and an electronic device |
| 03/24/2005 | WO2005026310A1 Compositions based on fluorinated hydrocarbons and secondary butanol for defluxing electronic boards |
| 03/24/2005 | WO2005026309A1 Detergent composition and method of cleaning |
| 03/24/2005 | WO2005025787A1 Metal nano particle liquid dispersion capable of being sprayed in fine particle form and being applied in laminated state |
| 03/24/2005 | WO2005025717A1 Agitation/deaeration device |
| 03/24/2005 | WO2005025688A1 Exercise machine |
| 03/24/2005 | WO2005025362A1 Electrically conductive, conductive-polymer-based hook and pile fastener |
| 03/24/2005 | WO2005010930A9 Method for forming high resolution electronic circuits |
| 03/24/2005 | WO2004094314A3 Conductor-within-a-via microwave launch |
| 03/24/2005 | WO2004091809A3 Kinetic spray application of coatings onto covered materials |
| 03/24/2005 | US20050065352 Process for the purification of thiophenes |
| 03/24/2005 | US20050064745 Terminal for electrical connector |
| 03/24/2005 | US20050064740 Method of making an interposer sub-assembly in a printed wiring board |
| 03/24/2005 | US20050064732 Circuit carrier and production thereof |
| 03/24/2005 | US20050064711 Oriented, aminosilane-coated film capable of structuring by means of electromagnetic radiation and composed of thermoplastic polyester for the production of selectively metallized films |
| 03/24/2005 | US20050064704 Manufacturing method of electronic components embedded substrate |
| 03/24/2005 | US20050064697 Ultra-fine contact alignment |
| 03/24/2005 | US20050064696 Methods relating to forming interconnects and resulting assemblies |
| 03/24/2005 | US20050064694 Method and system for packaging ball grid arrays |
| 03/24/2005 | US20050064652 Circuit forming system and method |