Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
04/2005
04/05/2005US6876008 Mount for semiconductor light emitting device
04/05/2005US6876004 Circuit interconnect for optoelectronic device for controlled impedance at high frequencies
04/05/2005US6875962 Electric heating system for a motor vehicle
04/05/2005US6875952 Substrate having repaired metallic pattern and method and device for repairing metallic pattern on substrate
04/05/2005US6875931 Retainer for circuit board assembly and method for using the same
04/05/2005US6875920 Semiconductor device and design support method of electronic device using the same
04/05/2005US6875704 Method for forming pattern using printing process
04/05/2005US6875637 Semiconductor package insulation film and manufacturing method thereof
04/05/2005US6875632 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography
04/05/2005US6875526 Magnetic ceramic body overcoated with dielectric, circuit pattern; shrinkage inhibition; noncracking
04/05/2005US6875519 Two-layer copper polyimide substrate
04/05/2005US6875475 Methods for producing submicron metal line and island arrays
04/05/2005US6875367 Using mixture of polymer and magnetic material; curing, solidification; coupling to undercoating of integrated circuit
04/05/2005US6875297 Process for manufacturing highly stressed composite parts
04/05/2005US6875105 Lottery ticket validation system
04/05/2005US6875056 Fiber optic transceiver package with integral EMI gasket
04/05/2005US6875054 Contamination prevention between two electrical components
04/05/2005US6875029 Electrical control unit
04/05/2005US6874959 Keyboard assembly
04/05/2005US6874911 Light irradiating unit, lighting unit and method for manufacturing lighting unit
04/05/2005US6874895 Vehicle mirror system with vehicle heading sensor assembly
04/05/2005US6874677 Bonding pad of suspension circuit
04/05/2005US6874675 Method for manufacturing printed circuit board
04/05/2005US6874395 Punching device and workpiece processing method
04/05/2005US6874227 Method for packaging an image sensor
03/2005
03/31/2005WO2005029935A1 Potting shell
03/31/2005WO2005029934A1 Printed board and method for manufacturing same
03/31/2005WO2005029933A1 Multilayer printed wiring board and method for manufacturing same
03/31/2005WO2005029932A1 Electronic component, and arrangement comprising an electronic component
03/31/2005WO2005029929A2 Component and method for manufacturing printed circuit boards
03/31/2005WO2005029928A2 Closed loop backdrilling system
03/31/2005WO2005029714A1 Transmitting module with improved heat dissipation
03/31/2005WO2005029634A2 Dielectric loading of distributed printed circuits
03/31/2005WO2005029581A1 Interposer and multilayer printed wiring board
03/31/2005WO2005029519A1 Capacitor unit
03/31/2005WO2005029177A1 Liquid photo solder resist composition and photo solder resist film thereof
03/31/2005WO2005029126A1 Alignment method and apparatus for pixilated detector
03/31/2005WO2005028834A1 Adjusting device, especially for the throttle valve of an internal combustion engine
03/31/2005WO2005028176A2 Process for forming a patterned thin film structure for in-mold decoration
03/31/2005WO2004103619A3 Rotary tool holder assemblies
03/31/2005WO2004088425A3 Contact masks and lithographic patterning methods using said masks
03/31/2005US20050071799 Routing for reducing impedance distortions
03/31/2005US20050071102 Method, apparatus, system, program and medium for inspecting a circuit board and an apparatus incorporating the circuit board
03/31/2005US20050070136 Electrical device for interconnecting two printed circuit boards at a large distance
03/31/2005US20050070133 Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate
03/31/2005US20050070131 Electrical circuit assembly with micro-socket
03/31/2005US20050070095 Protective layer during scribing
03/31/2005US20050070084 Substrate for pre-soldering material and fabrication method thereof
03/31/2005US20050070074 Method for dicing semiconductor wafer
03/31/2005US20050070046 Method of manufacturing electronic device and method of manufacturing electro-optical device
03/31/2005US20050069725 Comprising tin and silver as well as an additive having a low coefficient of thermal expansion such as fused silica or zirconium oxide to combat thermal shock; for soldering to glass or ceramic substrates such as automobile windows
03/31/2005US20050069722 Low signal loss bonding ply for multilayer circuit boards
03/31/2005US20050069689 A multilayer, monoaxially polyester film of thickness 5-500 mu m including a metal compound which on irradiation with electromagnetic radiation liberates a metal within a layer; elasticity modulus longitudinally and/or transverse of > 500 N/mm2; printed circuit boards; ribbon cables; smart cards; labels
03/31/2005US20050069688 Single-layer, oriented thermoplastic polyester film capable of structuring by means of electromagnetic radiation, for producing selectively metallized films
03/31/2005US20050069645 Method of electrolytically depositing materials in a pattern directed by surfactant distribution
03/31/2005US20050068757 Stress compensation layer systems for improved second level solder joint reliability
03/31/2005US20050068748 Thin film circuit board device and method for manufacturing the same
03/31/2005US20050068374 Ink jet head and method and manufacturing method thereof
03/31/2005US20050068235 Antenna structure
03/31/2005US20050068054 Standardized layout patterns and routing structures for integrated circuit wafer probe card assemblies
03/31/2005US20050067739 Method of making liquid crystal polymer films
03/31/2005US20050067715 Electronic parts built-in substrate and method of manufacturing the same
03/31/2005US20050067703 Electronic member, method for making the same, and semiconductor device
03/31/2005US20050067699 Diffusion barrier layer for lead free package substrate
03/31/2005US20050067687 Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate
03/31/2005US20050067686 Semiconductor device containing stacked semiconductor chips and manufacturing method thereof
03/31/2005US20050067683 Memory expansion and chip scale stacking system and method
03/31/2005US20050067679 Stitched micro-via to enhance adhesion and mechanical strength
03/31/2005US20050067666 Device for electrical connection between two wafers and fabrication process of a microelectronic component comprising such a device
03/31/2005US20050067635 Method of manufacturing electronic component, method of manufacturing electro-optical device, electronic component, and electro-optical device
03/31/2005US20050067472 Method for connecting connection members to board
03/31/2005US20050067471 Method for producing a soldered joint between a substrate and a contact element of a fuel cell unit
03/31/2005US20050067470 Solder deposition method
03/31/2005US20050067395 Solder bonding method and solder bonding device
03/31/2005US20050067378 Method for micro-roughening treatment of copper and mixed-metal circuitry
03/31/2005US20050067297 Copper bath for electroplating fine circuitry on semiconductor chips
03/31/2005US20050067293 Producing method of flexible wired circuit board
03/31/2005US20050067189 joining electronic terminals plated with lead-free metals; semiconductors; printed circuits
03/31/2005US20050067188 Thin film circuit integrating thick film resistors thereon and method of fabricating the same
03/31/2005US20050067187 Printed circuit board and interleaving routing scenario thereof
03/31/2005US20050067186 Hybrid integrated circuit device and method of manufacturing the same
03/31/2005US20050067178 Electronic assembly with thermally separated support
03/31/2005US20050067177 Module and method of manufacturing module
03/31/2005US20050067113 Pressure laminator apparatus
03/31/2005US20050066827 Stencil and apparatus for supporting and tensioning the stencil
03/31/2005US20050066523 Method of making an interposer with contact structures
03/31/2005US20050066522 For integrating display panel by bonding electronic part; adhesive tapes; efficiency
03/31/2005DE19739073B4 Verfahren zur Herstellung von Metall-Bumps auf einer elektronischen Vorrichtung A process for the production of metal bumps on an electronic device
03/31/2005DE10341453A1 Schaltungsträger Circuit board
03/31/2005DE10341186A1 Verfahren und Vorrichtung zum Kontaktieren von Halbleiterchips Method and apparatus for bonding semiconductor chips
03/31/2005DE10340866A1 Method for fixing element-group on carrier layer e.g. for miniaturization of communication devices, involves joining first and second elements together at an initial temperature, so that a mutual mechanical force is exerted
03/31/2005DE10340297A1 Circuit for active and passive electric and electronic components for modular construction of a circuit having a pressure element for pressing a spring element
03/31/2005DE10132567B4 Verfahren und Vorrichtung zum Aufbringen eines Lötmittels auf ein Substrat Method and apparatus for applying a solder to a substrate
03/30/2005EP1519642A1 Electronic component mounting method and electronic component mounting structure
03/30/2005EP1519641A2 Module and method of manufacturing module
03/30/2005EP1519640A1 Producing method of flexible wired circuit board
03/30/2005EP1519441A1 Antenna structure
03/30/2005EP1519415A2 Electronic parts built-in substrate and method of manufacturing the same
03/30/2005EP1519414A1 Multilayer wiring circuit module and method for fabricating the same
03/30/2005EP1518890A1 Curable reactive resin system
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