| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/07/2005 | WO2004075248A3 Surface-coating method, production of microelectronic interconnections using said method and integrated circuits |
| 04/07/2005 | WO2004064198A3 Cover for ball-grid array connector |
| 04/07/2005 | WO2003100859A9 Method for producing a component comprising a conductor structure that is suitable for use at high frequencies and corresponding component |
| 04/07/2005 | WO2003073808A8 Passive transmission line equalization using circuit-board thru-holes |
| 04/07/2005 | US20050075820 Method for checking test points of printed circuit board layout text data before plotting the printed circuit board layout map |
| 04/07/2005 | US20050075459 Graft copolymer of flexible acrylic resin main chain and high glass transition temperature vinyl polymer; moisture resistant, insulating circuit board films; cracking and peeling resistance;does not apply excessive stress to lead pin |
| 04/07/2005 | US20050074955 Method and arrangement for reduced thermal stress between substrates |
| 04/07/2005 | US20050074924 Circuitized substrate, method of making same and information handling system using same |
| 04/07/2005 | US20050074923 Metallic dam and method of forming therefor |
| 04/07/2005 | US20050074920 Surface treatment for oxidation removal in integrated circuit package assemblies |
| 04/07/2005 | US20050074705 Method of forming a resist pattern, method of forming a wiring pattern, method of fabricating a semiconductor device, electro-optic device, and electronic apparatus |
| 04/07/2005 | US20050074638 having a defined curvature by positioning ceramic layers of different temperature coefficients of expansion on top of one another; and permanently bonding them; coefficients made by adding nuclei to the ceramic precursor; pressure sensors |
| 04/07/2005 | US20050074547 Method of using pre-applied underfill encapsulant |
| 04/07/2005 | US20050074243 Optical module |
| 04/07/2005 | US20050073818 Module incorporating a capacitor, method for manufacturing the same, and capacitor used therefor |
| 04/07/2005 | US20050073817 Circuit board assembly |
| 04/07/2005 | US20050073813 Circuit board assembly |
| 04/07/2005 | US20050073805 Integrated circuit package |
| 04/07/2005 | US20050073789 Solid state multi-pole switching device for plug-in switching units |
| 04/07/2005 | US20050073590 Three-dimensional measuring instrument, filter striped plate, and illuminating means |
| 04/07/2005 | US20050073386 Small coil and method of manufacturing the same |
| 04/07/2005 | US20050073334 Contact For Semiconductor Components |
| 04/07/2005 | US20050073049 Semiconductor device and method of fabricating the same |
| 04/07/2005 | US20050073047 Conductive sheet having metal layer formed on at least a portion of surface of insulating substrate, product using the same, and manufacturing method thereof |
| 04/07/2005 | US20050073044 Plastic packaging with high heat dissipation and method for the same |
| 04/07/2005 | US20050073041 Device for establishing non-permanent electrical connection between an integrated circuit device lead element and a substrate |
| 04/07/2005 | US20050073039 Semiconductor device and method of fabricating the same |
| 04/07/2005 | US20050073034 Package for semiconductor chip |
| 04/07/2005 | US20050072984 Light emitting device assembly |
| 04/07/2005 | US20050072834 Connection site coating method and solder joints |
| 04/07/2005 | US20050072828 Jet nozzle structure for soldering apparatus |
| 04/07/2005 | US20050072683 Containing two high molecular weight surfactants of different hydrophobicities and sulfur containing saturated organic compound electrocoating rate promoter; film uniformity and filling performance |
| 04/07/2005 | US20050072681 Making multi-layer structures from a structural material (e.g. nickel) configured to define a desired structure and from a sacrificial material (e.g. copper) that surrounds the structure; sacrificial material is removed by multi-stage etching |
| 04/07/2005 | US20050072597 Bonding pad structure for a display device and fabrication method thereof |
| 04/07/2005 | US20050072596 Printed circuit board for avoiding producing cutting burrs |
| 04/07/2005 | US20050072595 Method of manufacturing substrate for circuit board and smart label having the substrate |
| 04/07/2005 | US20050072547 Aluminum/ceramic bonding substrate and method for producing same |
| 04/07/2005 | US20050071996 Solder paste stencil manufacturing system |
| 04/07/2005 | US20050071990 Electronic-component alignment method and apparatus therefor |
| 04/07/2005 | DE10343065A1 Circuit board arrangement for mobile telephones and laptops comprises a circuit board layer, a component arranged on the circuit board layer, and a positioning element formed on the circuit board layer for fixing the component on the layer |
| 04/07/2005 | DE10343053A1 Elektronisches Bauelement und Anordnung mit einem elektronischen Bauelement And electronic component assembly having an electronic component |
| 04/07/2005 | DE102004043233A1 Verfahren zum Herstellen eines beweglichen Abschnitts einer Halbleitervorrichtung A method of manufacturing a movable portion of a semiconductor device |
| 04/07/2005 | CA2539481A1 Improved copper bath for electroplating fine circuitry on semiconductor chips |
| 04/06/2005 | EP1520872A1 Single layered, oriented, with electromagnetic radiation patternable foil made of thermoplastic polyester for the production of selectively metallized foils |
| 04/06/2005 | EP1520653A1 Device for realising a hole in a workpiece with two different lasers |
| 04/06/2005 | EP1520455A1 Multilayer stripline radio frequency circuits and interconnection methods |
| 04/06/2005 | EP1520454A1 Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof |
| 04/06/2005 | EP1520446A1 An acoustically active element formed in a multi-layer circuit-board structure, a method for forming acoustically active element in a multi-layer circuit-board structure, and a multi-layer circuit-board structure |
| 04/06/2005 | EP1520322A1 Connection device for flexible circuit |
| 04/06/2005 | EP1520253A2 Method for the production of electrically-conducting connections on chipcards |
| 04/06/2005 | EP1520209A1 Heat stable photocurable resin composition for dry film resist |
| 04/06/2005 | EP1520060A2 Metallisation |
| 04/06/2005 | EP1474811A4 Etching solution for forming an embedded resistor |
| 04/06/2005 | EP0988029B1 Device and methods for wound treatment |
| 04/06/2005 | CN2691210Y Positioner with vacuum suction effect |
| 04/06/2005 | CN1605230A Method of soldering the constituent layers of a multilayer printed circuit and the machine used for same |
| 04/06/2005 | CN1605229A Epoxy washer for retention of inverted SMT components |
| 04/06/2005 | CN1605118A Method for production of dielectric layers using polyfunctional carbosilanes |
| 04/06/2005 | CN1604846A Separating plate-composite component for producing printed circuit board components and method for producing a composite component of this type |
| 04/06/2005 | CN1604726A Interconnection substrate and fabrication method thereof |
| 04/06/2005 | CN1604725A An after-treatment fluid for copper surface black oxidation |
| 04/06/2005 | CN1604724A Solder ball supplying method and supplying device |
| 04/06/2005 | CN1604723A Producing method of flexible wired circuit board |
| 04/06/2005 | CN1604722A Discharge path forming structure of flexible printed circuit board |
| 04/06/2005 | CN1604721A Module and method of manufacturing module |
| 04/06/2005 | CN1604720A A base plate structure having built-in capacitor |
| 04/06/2005 | CN1604719A 电路装置 Circuit device |
| 04/06/2005 | CN1604391A 天线结构 The antenna structure |
| 04/06/2005 | CN1604347A Light emitting device assembly |
| 04/06/2005 | CN1604323A Circuit device and method for manufacturing same |
| 04/06/2005 | CN1604320A Semiconductor device containing stacked semiconductor chips and manufacturing method thereof |
| 04/06/2005 | CN1604312A Flip chip mounting circuit board, its manufacturing method and integrated circuit device |
| 04/06/2005 | CN1604311A Wiring substrate and method of manufacturing the same |
| 04/06/2005 | CN1604244A Electronic component mounting method and electronic component mounting structure |
| 04/06/2005 | CN1603679A Heat radiation structure of LED lamp |
| 04/06/2005 | CN1196393C Electronic control device |
| 04/06/2005 | CN1196391C Method for surface treatment of copper foil |
| 04/06/2005 | CN1196390C Vacuum laminating method for adhering film |
| 04/06/2005 | CN1196388C Method and device for drying materials and method of producing circuit boards using same |
| 04/06/2005 | CN1196387C Carrying strip for connecting integrated circuit to external circuit and making method thereof |
| 04/06/2005 | CN1196386C Flexible printed circuit board and mfg. method thereof |
| 04/06/2005 | CN1196232C Method for making an electro conductive joint |
| 04/06/2005 | CN1196224C RF ceramic block filters and antenna diplexer |
| 04/06/2005 | CN1196192C Method of mfg. carrying band and carrying band type semiconductor device |
| 04/06/2005 | CN1196151C Microelectronic Component carrier and method of its manufacture |
| 04/06/2005 | CN1196139C 介电组合物 Dielectric compositions |
| 04/06/2005 | CN1195988C Apparatus and method for detecting electric trace using photoelectric effect |
| 04/06/2005 | CN1195889C Electroless copper plating solution and method for electroless copper plating |
| 04/06/2005 | CN1195888C Conductor track structures arranged on nonconductive material, espectially fine conductor track structure, and method for producing the same |
| 04/06/2005 | CN1195603C Laser processor |
| 04/05/2005 | US6876555 Surface-mount type switching power-supply unit and mounting method for the same |
| 04/05/2005 | US6876554 Printing wiring board and method of producing the same and capacitor to be contained in printed wiring board |
| 04/05/2005 | US6876273 Front end module |
| 04/05/2005 | US6876091 Wiring board |
| 04/05/2005 | US6876089 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer |
| 04/05/2005 | US6876088 Flex-based IC package construction employing a balanced lamination |
| 04/05/2005 | US6876085 Signal layer interconnect using tapered traces |
| 04/05/2005 | US6876077 Semiconductor device and its manufacturing method |
| 04/05/2005 | US6876073 Semiconductor device and contractor for inspection |
| 04/05/2005 | US6876072 Semiconductor chip assembly with chip in substrate cavity |