| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/14/2005 | DE102004043464A1 Schaltungsplatte mit einer Metallplatte, gedruckte Schaltungsplatte und flexible Schaltungsplatine Circuit board having a metal plate, printed circuit board and flexible circuit board |
| 04/14/2005 | CA2536836A1 Improved method for micro-roughening treatment of copper and mixed-metal circuitry |
| 04/14/2005 | CA2518631A1 Method of producing a composite multilayer |
| 04/14/2005 | CA2484471A1 Operating circuit for a lamp with a heat sink |
| 04/13/2005 | EP1523231A1 Method of producing multilayer wired circuit board |
| 04/13/2005 | EP1523230A1 Circuit board assembly main and connector boards and connector pins for same |
| 04/13/2005 | EP1523229A2 Assembly of an electronic component with spring packaging |
| 04/13/2005 | EP1523228A2 Mobile terminal, circuit board, circuit board design aiding apparatus and method, design aiding program, and storage medium having stored therein design aiding program |
| 04/13/2005 | EP1523042A2 Optical device and production method thereof |
| 04/13/2005 | EP1523037A2 Metal/ceramic bonding substrate and method for producing same |
| 04/13/2005 | EP1523018A2 Small coil and method of manufacturing the same |
| 04/13/2005 | EP1522609A2 Conductive sheet having a metal layer on at least one portion of an insulating substrate, product using the same, and manufacturing method thereof |
| 04/13/2005 | EP1521998A2 Machine for exposing printed circuit boards |
| 04/13/2005 | EP1521868A2 Device and method for monitoring an electrolytic process |
| 04/13/2005 | EP1521862A1 Immersion plating of silver |
| 04/13/2005 | EP1521811A1 A method for the production of conductive and transparent nano-coatings and nano-inks and nano-powder coatings and inks produced thereby |
| 04/13/2005 | EP1521713A1 Shatterproof ultra-thin glass and the handling thereof |
| 04/13/2005 | EP1490530A4 Methods and compositions for oxide production on copper |
| 04/13/2005 | EP1414895B1 Flame retardant molding compositions |
| 04/13/2005 | EP1256262B1 Package for microwave components |
| 04/13/2005 | EP1115924B1 Non-crimping polyester monofilament and process for producing same |
| 04/13/2005 | EP0805614B1 Multilayered wiring board, prefabricated material for multilayered wiring board, process of manufacturing multilayered wiring board, electronic parts package, and method for forming conductive pillar |
| 04/13/2005 | CN2692965Y Circuitboard wiring structure of information socket |
| 04/13/2005 | CN2692964Y Connector and circuitboard combination using the same |
| 04/13/2005 | CN2692628Y Tin Wave height detector |
| 04/13/2005 | CN1606805A Method for making a microcircuit card |
| 04/13/2005 | CN1606582A Planarized microelectronic substrates |
| 04/13/2005 | CN1606401A Method of producing multilayer wired circuit board |
| 04/13/2005 | CN1606400A Conductive sheet, product using the same, and manufacturing method thereof |
| 04/13/2005 | CN1606159A Optical device and production method thereof |
| 04/13/2005 | CN1606154A Semiconductor device and method for making same |
| 04/13/2005 | CN1606152A Semiconductor device and method of fabricating the same |
| 04/13/2005 | CN1606142A Electronic circuit device and its manufacturing method and device |
| 04/13/2005 | CN1606103A Small coil and method of manufacturing the same |
| 04/13/2005 | CN1605903A Anisotropic conductive material, display device, manufacturing method for the device, and conductive member |
| 04/13/2005 | CN1605587A Fluoro-aromatic organic tetracarboxylic dianhydride and its preparation method and use |
| 04/13/2005 | CN1605465A Drawing method, drawing apparatus and display apparatus |
| 04/13/2005 | CN1197445C Multi-layer ceramic substrate and its preparing process |
| 04/13/2005 | CN1197444C Soldering method between golden fingers on PCB and pins of flexible printed circuit |
| 04/13/2005 | CN1197443C Assembly of an electronic component with spring packaging |
| 04/13/2005 | CN1197442C 电子电路组件 Electronic circuit assembly |
| 04/13/2005 | CN1197441C Printed wiring baseboard and its manufacturing method |
| 04/13/2005 | CN1197440C Article having a circuit soldered with parts and method for recycling wastes of the same |
| 04/13/2005 | CN1197439C Printed circuit board and display device |
| 04/13/2005 | CN1197211C Ic插座 Ic Socket |
| 04/13/2005 | CN1197204C Anisotropic conductive connecting material |
| 04/13/2005 | CN1197152C Surface electrode structure on ceramic multilayer substrate and its mfg. method |
| 04/13/2005 | CN1197150C Semiconductor device, circuit board, method of mfg. circuit board, and electronic device |
| 04/13/2005 | CN1197139C Connecting construction body |
| 04/13/2005 | CN1197137C Semiconductor device and method for manufacture semiconductor equipment |
| 04/13/2005 | CN1197136C Lead wire frame and method for manufacturing lead wire frame |
| 04/13/2005 | CN1196957C LCD device |
| 04/13/2005 | CN1196809C Etching device, etching method and circuit board made using said method |
| 04/13/2005 | CN1196658C Isolation ceramic, multi-layer ceramic substrate and laminated electronic component |
| 04/13/2005 | CN1196602C Thermal transfer element for forming multi-layer devices |
| 04/13/2005 | CN1196561C Device for the laser processing of flat workpieces |
| 04/12/2005 | US6879494 Circuit package for electronic systems |
| 04/12/2005 | US6879493 Module component and method of manufacturing the same |
| 04/12/2005 | US6879492 Hyperbga buildup laminate |
| 04/12/2005 | US6879465 Integrated lead suspension and method of construction |
| 04/12/2005 | US6879378 Exposure apparatus and method of conveying mask and work |
| 04/12/2005 | US6879368 Display device and manufacturing method therefor |
| 04/12/2005 | US6879236 Noise suppressor unit |
| 04/12/2005 | US6879041 Semiconductor device with joint structure having lead-free solder layer over nickel layer |
| 04/12/2005 | US6879040 Electrical connections in recesses to allow solder to connect device to surface |
| 04/12/2005 | US6878901 Laser micromachining and electrical structures formed thereby |
| 04/12/2005 | US6878884 Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board |
| 04/12/2005 | US6878572 High capacitance package substrate |
| 04/12/2005 | US6878571 Panel stacking of BGA devices to form three-dimensional modules |
| 04/12/2005 | US6878470 Suitable for printing using aqueous ink; excellent coloring properties with respect to colorant; electroluminescence element that is excellent in sharpness of pixels and durability; can be subjected to uniform and local patterning |
| 04/12/2005 | US6878464 Glass-ceramic composite material and multilayered circuit substrate |
| 04/12/2005 | US6878435 Adapted for enhancing the adhesion strength of a typical single layer anisotropic conductive film in flip chip bonding; comprising epoxy resin-based film containing conductive particles |
| 04/12/2005 | US6878305 Attaching components to a printed circuit card |
| 04/12/2005 | US6878296 Method and apparatus for surface processing of printed wiring board |
| 04/12/2005 | US6878261 Surface treatment method of copper foil with silane coupling agent |
| 04/12/2005 | US6878260 An antiplating layer is formed on localized area of a plastic component; a portion of the anti-plating layer is etched using a low-power laser; electroplating to form a plated layer over the remaining area of the plastic component |
| 04/12/2005 | US6878259 Immersion in electrolytic cell |
| 04/12/2005 | US6878184 Reduction of metal oxides and transition metal complexes by an aldehyde in the presence of carboxylic acids and hydrocarbon solvent; range of particle size distributions; semiconductor films |
| 04/12/2005 | US6877990 Land grid array connector assembly with pick up cap |
| 04/12/2005 | US6877853 Pattern formation method and substrate manufacturing apparatus |
| 04/12/2005 | US6877653 Method of modifying tin to lead ratio in tin-lead bump |
| 04/12/2005 | US6877542 Systems and methods for bonding a heat sink to a printed circuit assembly |
| 04/12/2005 | US6877408 Press punching method and apparatus for forming a plurality of through holes by changing a travel distance of a punching mold |
| 04/12/2005 | US6877221 Copper ball insertion machine |
| 04/12/2005 | US6877204 Riveting method |
| 04/08/2005 | CA2484016A1 Circuit board assembly, main and connector boards, and connector pins for same |
| 04/07/2005 | WO2005032227A1 Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same |
| 04/07/2005 | WO2005032226A1 Multilayer laminated circuit board |
| 04/07/2005 | WO2005032225A1 Ceramic circuit board, method for making the same, and power module |
| 04/07/2005 | WO2005032224A1 Printed circuit board comprising a holding device for retaining wired electronic components, method for the production of such a printed circuit board, and use thereof in a soldering furnace |
| 04/07/2005 | WO2005032223A1 Integrated structure for a flexible printed circuit boards and manufacturing method for the same |
| 04/07/2005 | WO2005031847A1 Gripping method and device for removing balls from a bulk container |
| 04/07/2005 | WO2005031812A2 Improved copper bath for electroplating fine circuitry on semiconductor chips |
| 04/07/2005 | WO2005031759A1 Conductive particle and anisotropic conductive adhesive using same |
| 04/07/2005 | WO2005030896A1 Adhesive aid composition |
| 04/07/2005 | WO2005030491A1 Lamination through a mask |
| 04/07/2005 | WO2005030466A1 Multi-layer sheet |
| 04/07/2005 | WO2005020254A3 Ultra-thin flexible inductor |
| 04/07/2005 | WO2005011877A3 Method and device for filling areas situated in hollows or between tracks with a viscous product on a printed circuit board and equipment using said device |
| 04/07/2005 | WO2005000514A3 Method for soldering electrical connector pins on a support by means of hot gas |