| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/19/2005 | US6881366 Process of fabricating a precision microcontact printing stamp |
| 04/19/2005 | US6881319 Comprises disodium bis(3-sulfopropyl)disulfide; for use on printed wiring board or semiconductor wafer |
| 04/19/2005 | US6881294 Method of conductively interconnecting electronic components, battery powerable apparatus, radio frequency communication device, and electric circuit |
| 04/19/2005 | US6881293 Process for producing a multi-layer printer wiring board |
| 04/19/2005 | US6881291 Using laser beams |
| 04/19/2005 | US6881278 Mixture of ester decomposition catalyst, organohalogen compound, reducing agent and resin; storage stability |
| 04/19/2005 | US6881274 Test carrier for temporarily packaging bumped semiconductor components in which contact balls on the components are protected during test procedures; made of wear resistant material |
| 04/19/2005 | US6881264 Configuration and a method for reducing contamination with particles on a substrate in a process tool |
| 04/19/2005 | US6881074 Electrical circuit assembly with micro-socket |
| 04/19/2005 | US6881072 Membrane probe with anchored elements |
| 04/19/2005 | US6881071 Power semiconductor module with pressure contact means |
| 04/19/2005 | US6880955 Lamp on sheet and manufacturing method thereof |
| 04/19/2005 | US6880441 Precision punch and die design and construction |
| 04/19/2005 | US6880245 Method for fabricating a structure for making contact with an IC device |
| 04/19/2005 | US6880244 Circuit board having simultaneously and unitarily formed wiring patterns and protrusions |
| 04/19/2005 | US6880241 Method for connecting coaxial cables to a printed circuit board |
| 04/14/2005 | WO2005034598A1 High reliability multilayer circuit substrates and methods for their formation |
| 04/14/2005 | WO2005034597A1 Pad structure of wiring board and wiring board |
| 04/14/2005 | WO2005034596A2 Improved method for micro-roughening treatment of copper and mixed-metal circuitry |
| 04/14/2005 | WO2005034595A1 Method of forming via hole in resin layer |
| 04/14/2005 | WO2005034594A1 Method of forming through hole in photosensitive glass substrate |
| 04/14/2005 | WO2005034592A1 Multilayer ceramic substrate and its manufacturing method |
| 04/14/2005 | WO2005034591A1 Connection sheet |
| 04/14/2005 | WO2005034578A1 Hearing aid with printed circuit board and microphone suspension |
| 04/14/2005 | WO2005034294A1 An electrical circuit assembly with micro-socket |
| 04/14/2005 | WO2005034293A1 Electrical connection component |
| 04/14/2005 | WO2005034280A1 Dielectric resonator, oscillator and transmitter/receiver |
| 04/14/2005 | WO2005034214A2 Protective layer during scribing |
| 04/14/2005 | WO2005034153A2 Method of producing a composite multilayer |
| 04/14/2005 | WO2005034146A1 Cable and production method therefor |
| 04/14/2005 | WO2005033799A2 Spin-printing of electronic and display components |
| 04/14/2005 | WO2005033798A2 Electrochemical micromanufacturing system and method |
| 04/14/2005 | WO2005033787A1 Device and method of making a device having a flexible layer structure |
| 04/14/2005 | WO2005033376A2 Plating method and apparatus |
| 04/14/2005 | WO2005033375A2 Electrochemical fabrication methods with enhanced post deposition processing |
| 04/14/2005 | WO2005033352A2 Deposition and patterning process |
| 04/14/2005 | WO2005033173A1 Latent hardener |
| 04/14/2005 | WO2005033033A1 Glass component having through hole and production method therefor |
| 04/14/2005 | WO2005032752A1 Metal heating apparatus, metal heating method, and light source device |
| 04/14/2005 | WO2005020253A3 Printed circuit board with integrated inductor |
| 04/14/2005 | WO2005012445A3 Conducting inks |
| 04/14/2005 | WO2005006821A3 Component for a printed circuit board and method for fitting a printed circuit board with this component |
| 04/14/2005 | WO2005004182A3 Method of layering green sheet and method of producing laminated ceramic electronic component |
| 04/14/2005 | WO2005001157A3 Device and method for coating roll substrates in vacuum |
| 04/14/2005 | WO2004107394A3 Plasma processing apparatus, method for producing reaction vessel for plasma generation, and plasma processing method |
| 04/14/2005 | WO2004084265A3 Led symbol signal |
| 04/14/2005 | WO2004070768A3 Direct mount led lamp |
| 04/14/2005 | US20050081049 Mobile terminal, circuit board, circuit board design aiding apparatus and method, design aiding program, and storage medium having stored therein design aiding program |
| 04/14/2005 | US20050079763 High density connector and method of manufacture |
| 04/14/2005 | US20050079748 Structures for coupling and grounding a circuit board in a plasma display device |
| 04/14/2005 | US20050079747 Plug contact for a printed circuit board |
| 04/14/2005 | US20050079746 Circuit board assembly, main and connector boards, and connector pins for same |
| 04/14/2005 | US20050079745 Socket connector |
| 04/14/2005 | US20050079719 Interconnect structures with engineered dielectrics with nanocolumnar porosity |
| 04/14/2005 | US20050079707 Interconnection substrate and fabrication method thereof |
| 04/14/2005 | US20050079652 Method of producing multilayer wired circuit board |
| 04/14/2005 | US20050079450 Method for manufacturing ceramic green sheet and method for manufacturing electronic part using that ceramic green sheet |
| 04/14/2005 | US20050079442 An acrylic, low glass transition temperature, graft copolymer binder component, having an alkali resistant backbone-segment and a pendant arm segment comprising hydrophilic moieties, and a thiophene-type adhesion promoter; flexible, aqueous processible |
| 04/14/2005 | US20050079375 Peelable circuit board foil |
| 04/14/2005 | US20050079338 Method of heat treatment, method for forming wiring pattern, method for manufacturing electro-optic device, and electro-optic device and electronic apparatus |
| 04/14/2005 | US20050079329 Metal/ceramic bonding substrate and method for producing same |
| 04/14/2005 | US20050079289 does not use an oven; a plastic film is produced and it has a component that reacts by heating itself when it is invested by a wave-emitting source |
| 04/14/2005 | US20050079280 Electroless copper plating solution, electroless copper plating process and production process of circuit board |
| 04/14/2005 | US20050078467 Power distribution system |
| 04/14/2005 | US20050078459 Flexible printed circuit board and liquid crystal display having the same |
| 04/14/2005 | US20050078458 Operating circuit for a lamp with a heat sink |
| 04/14/2005 | US20050078416 Suspension, head gimbal assembly and disk drive apparatus with head gimbal assembly |
| 04/14/2005 | US20050078415 Integrated lead suspension and method of construction |
| 04/14/2005 | US20050078158 Ink-jet inks containing metal nanoparticles |
| 04/14/2005 | US20050078152 Circuit board and liquid discharging apparatus |
| 04/14/2005 | US20050078035 Method for forming radio frequency antenna |
| 04/14/2005 | US20050077912 Method and probe structure for implementing a single probe location for multiple signals |
| 04/14/2005 | US20050077634 Optimization of routing layers and board space requirements for a ball grid array package |
| 04/14/2005 | US20050077625 Optimization of routing layers and board space requirements for a ball grid array land pattern |
| 04/14/2005 | US20050077610 Ball grid array package with external leads |
| 04/14/2005 | US20050077609 Circuit package and method of plating the same |
| 04/14/2005 | US20050077502 Surface reactive preservative for use with solder preforms |
| 04/14/2005 | US20050077451 Optical device and production method thereof |
| 04/14/2005 | US20050077362 Stacked small memory card |
| 04/14/2005 | US20050077185 Conveyorized plating line and method for electrolytically metal plating a workpiece |
| 04/14/2005 | US20050077083 Telescoping blind via in three-layer core |
| 04/14/2005 | US20050077080 Ball grid array (BGA) package having corner or edge tab supports |
| 04/14/2005 | US20050077079 Printed circuit board unit with detachment mechanism for electronic component |
| 04/14/2005 | US20050077077 Chip package with degassing holes |
| 04/14/2005 | US20050077025 Method and apparatus for rapid cooling of metal screening masks |
| 04/14/2005 | US20050077001 Machine for continuously producing plastic laminates in a cold press |
| 04/14/2005 | US20050076934 Method of cleaning substrate |
| 04/14/2005 | US20050076837 Conveyorized horizontal processing line and method of wet-processing a workpiece |
| 04/14/2005 | US20050076499 Method for producing an electrical conductor element |
| 04/14/2005 | DE4142436B4 Lötanlage mit einer Schutzgasatmosphäre über dem Lötband Soldering with a protective gas atmosphere above the solder ribbon |
| 04/14/2005 | DE202004020378U1 Conductive set for use in vehicle, designed in order to use insulated surface of vehicle component as replacement for insulating layer |
| 04/14/2005 | DE10392312T5 Multichipmodul mit einem Substrat, das eine Gruppierung von Verbindungsanordnungen aufweist Multichip module having a substrate having an array of connector assemblies |
| 04/14/2005 | DE10344745A1 Mechanical equipment unit e.g. for construction of circuit board, drills holes into circuit board with contact pad surrounding drilled hole and allows for component fixing |
| 04/14/2005 | DE10342899A1 Fabric comprises at least one electrically conductive thread and at least one thread of magnetic material surrounded by the electrically conductive thread as a result of braiding or mesh formation |
| 04/14/2005 | DE10341404A1 Switch carrier e.g. for electrical switching assemblies, has substrate made from steel, having two sides and recess with dielectric applied to both sides of substrate and into recess |
| 04/14/2005 | DE10341206A1 Appliance for improving reliability of BGA (ball grid array) solder connections between BGA component substrate, whose contact pads are fitted with solder balls or bumps |
| 04/14/2005 | DE10340438A1 Sendemodul mit verbesserter Wärmeabführung Transmitter module with improved heat dissipation |
| 04/14/2005 | DE10224817B4 Verfahren und Vorrichtung zum vertikalen Eintauchen von folienartigem Behandlungsgut in Bädern von Galvanisier- und Ätzanlagen Method and apparatus for vertical dipping sheet-treated in baths of electroplating and etching equipment |
| 04/14/2005 | DE10223360B4 Elektronische Schaltung mit SMD-Bauelementen Electronic circuit with SMD components |
| 04/14/2005 | DE102004043478A1 Shielding case for use with printed circuit board in vehicle-mounted apparatus, has opening for application of moisture-proof coating agent on upper region of integrated circuit mounted on circuit board |