| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/21/2005 | US20050082682 Prevention of contamination on bonding pads of wafer during SMT |
| 04/21/2005 | US20050082680 Substrate with mesh |
| 04/21/2005 | US20050082672 Circuit barrier structure of semiconductor packaging substrate and method for fabricating the same |
| 04/21/2005 | US20050082671 Ball grid array resistor network |
| 04/21/2005 | US20050082669 Electronic circuit device and porduction method therefor |
| 04/21/2005 | US20050082661 Adapter for non-permanently connecting integrated circuit devices to multi-chip modules and method of using same |
| 04/21/2005 | US20050082648 Ceramic package and chip resistor, and method for manufacture thereof |
| 04/21/2005 | US20050082580 Structure of wafer level package with area bump |
| 04/21/2005 | US20050082377 Oven controlled crystal oscillator for high stability |
| 04/21/2005 | US20050082343 Brazing; soldering; pressing bodies against foil; controlling pressure |
| 04/21/2005 | US20050082280 Flexible electric circuit for heating comprising a metallised fabric |
| 04/21/2005 | US20050082257 applying a potential between cathode and a printed circuit that acts as an anode, immersed in electrolytes; electrolysis |
| 04/21/2005 | US20050082089 Stacked interconnect structure between copper lines of a semiconductor circuit |
| 04/21/2005 | US20050082087 Dielectric structure for printed circuit board traces |
| 04/21/2005 | US20050081987 Manufacturing method for laminated electronic components |
| 04/21/2005 | US20050081944 Display having addressable characters |
| 04/21/2005 | US20050081377 Method for forming an electronic assembly |
| 04/21/2005 | US20050081376 Robust interlocking via |
| 04/21/2005 | US20050081375 Printed circuit board assembly and method |
| 04/21/2005 | US20050081349 Embedded capacitor structure in circuit board and method for fabricating the same |
| 04/20/2005 | EP1524893A1 Electronic control unit, in particular for motor vehicles, with improved heat dissipation system |
| 04/20/2005 | EP1524892A2 Operating circuit with heat sink for lamp |
| 04/20/2005 | EP1524560A1 System for illuminating two sides of a printed circuit board and apparatus with at least one such system |
| 04/20/2005 | EP1524553A2 Pattern formation |
| 04/20/2005 | EP1524060A2 Methods of positioning components using liquid prime movers and related structures |
| 04/20/2005 | EP1523869A1 Process for creating vias for circuit assemblies |
| 04/20/2005 | EP1523868A1 Process for creating holes in polymeric substrates |
| 04/20/2005 | EP1523867A1 Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
| 04/20/2005 | EP1432526A4 Method and apparatus for detecting a liquid spray pattern |
| 04/20/2005 | EP1399519B8 Devices, compositions and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
| 04/20/2005 | EP1314172B1 Method for producing a large-mass ohmic resistor for protecting electronic assemblies from surges, and an electronic assembly |
| 04/20/2005 | EP1220876B1 Method of treating epoxy resin-cured product |
| 04/20/2005 | CN2694705Y Circuit board |
| 04/20/2005 | CN2694524Y 电连接器 The electrical connector |
| 04/20/2005 | CN2694520Y 电连接器 The electrical connector |
| 04/20/2005 | CN1608400A Chip scale stacking system and method |
| 04/20/2005 | CN1608399A Connection substrate, multilayer wiring board using the connection substrate, substrate for semiconductor package, semiconductor package, and methods for manufacturing them |
| 04/20/2005 | CN1608398A Method and device for through-hole plating of substrates and printed circuit boards |
| 04/20/2005 | CN1608397A An electronic assembly and a method for manufacturing the same |
| 04/20/2005 | CN1608316A High density area array solder microjoining interconnect structure and fabrication method |
| 04/20/2005 | CN1608296A Electro-conductive composition, electro-conductive coating and method for producing the coating |
| 04/20/2005 | CN1608231A UV curable powder suitable for use as a photoresist |
| 04/20/2005 | CN1607998A A method and related apparatus for cutting a product from a sheet material |
| 04/20/2005 | CN1607898A Circuit board fabrication method and circuit board |
| 04/20/2005 | CN1607897A Technique for interconnecting multilayer circuit boards |
| 04/20/2005 | CN1607896A An electromagnetic shielding circuit board and method for making same |
| 04/20/2005 | CN1607895A Flexible printed circuit board and liquid crystal display having the same |
| 04/20/2005 | CN1607894A Flexible base boards |
| 04/20/2005 | CN1607893A Method for making resistor on base plate |
| 04/20/2005 | CN1607892A Method for reinforcing the connection of flat cable member and method for manufacturing image display unit |
| 04/20/2005 | CN1607890A Printed circuit board without rough cutting edge |
| 04/20/2005 | CN1607662A Method and structure for self healing cracks in underfill material between an i/c chip and a substrate bonded together with solder balls |
| 04/20/2005 | CN1607653A Spiral contactor and manufacturing method for this apparatus, and a semiconductor inspecting equipment and electronical parts using this apparatus |
| 04/20/2005 | CN1607617A Manufacturing method for laminated electronic components |
| 04/20/2005 | CN1607466A Pattern formation |
| 04/20/2005 | CN1607058A Noise free highly effective electromagnetic pump soft soldered single/double peak generator |
| 04/20/2005 | CN1198498C Element mounting system and mounting method |
| 04/20/2005 | CN1198495C Multi-layer ceramic base plate producing method |
| 04/20/2005 | CN1198494C Process of thin core board for making multiple-layer circuit board |
| 04/20/2005 | CN1198493C Underfilling for semiconductor unit |
| 04/20/2005 | CN1198492C Method for manufacturing PC board and used substrate therein |
| 04/20/2005 | CN1198491C Printed wiring substrate structure and manufacturing method thereof |
| 04/20/2005 | CN1198490C Laser processing method and processing device |
| 04/20/2005 | CN1198489C Manufacturing method of high frequency assembly |
| 04/20/2005 | CN1198488C Electro-deposition copper foil through surface processing and its producing method and use |
| 04/20/2005 | CN1198487C Module substrate and its manufacturing method |
| 04/20/2005 | CN1198486C Printed-wiring board with cavity for mounting electronic component |
| 04/20/2005 | CN1198333C Circuit board and its making method and high-output module |
| 04/20/2005 | CN1198332C Wiring beard, semiconductor device, and method of mfg. wiring board |
| 04/20/2005 | CN1198296C Method for producing ceramic wafer and laminated ceramic electronic element |
| 04/20/2005 | CN1198003C Electrochemical catalyst electrode resulting in high endurance of the combination between coating and metal base |
| 04/20/2005 | CN1197993C Mfg. method of electronic part and the electronic part, electroless coating method |
| 04/20/2005 | CN1197928C Conductive adhesion agent, assembling structure and method for making said assembling structure |
| 04/20/2005 | CN1197822C Insulation ceramic press block |
| 04/19/2005 | US6883157 BWB transmission wiring design system |
| 04/19/2005 | US6882902 Method of and apparatus for thermal analysis, method of and apparatus for calculating thermal conditions, computer product |
| 04/19/2005 | US6882762 Waveguide in a printed circuit board and method of forming the same |
| 04/19/2005 | US6882544 Thin type printed circuit board with an enclosed capacitor of a large capacitance; |
| 04/19/2005 | US6882542 Electronic apparatus |
| 04/19/2005 | US6882541 IC card |
| 04/19/2005 | US6882539 Electronic circuit board case and method of producing electronic circuit unit |
| 04/19/2005 | US6882538 Intelligent power module |
| 04/19/2005 | US6882266 Ball grid array resistor network having a ground plane |
| 04/19/2005 | US6882247 RF filtered DC interconnect |
| 04/19/2005 | US6882169 Semiconductor testing device |
| 04/19/2005 | US6882091 Electromagnetic-wave shielding and light transmitting plate and manufacturing method thereof |
| 04/19/2005 | US6882049 Support ring for use with a contact pad and semiconductor device components including the same |
| 04/19/2005 | US6882046 Single package containing multiple integrated circuit devices |
| 04/19/2005 | US6882045 Multi-chip module and method for forming and method for deplating defective capacitors |
| 04/19/2005 | US6882044 High speed electronic interconnection using a detachable substrate |
| 04/19/2005 | US6882038 Plating tail design for IC packages |
| 04/19/2005 | US6882034 Routing element for use in multi-chip modules, multi-chip modules including the routing element, and methods |
| 04/19/2005 | US6881974 Probe card for testing microelectronic components |
| 04/19/2005 | US6881906 Printed circuit board comprising a contact sleeve that is mounted thereon |
| 04/19/2005 | US6881662 Pattern formation process for an integrated circuit substrate |
| 04/19/2005 | US6881609 Component connections using bumps and wells |
| 04/19/2005 | US6881607 Underfill and encapsulation of carrier substrate-mounted flip-chip components using stereolithography |
| 04/19/2005 | US6881595 Method of and apparatus for testing the quality of printed circuits |
| 04/19/2005 | US6881591 Underfilling material for semiconductor package |
| 04/19/2005 | US6881529 Positive photoresist transfer material and method for processing surface of substrate using the transfer material |