| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 04/27/2005 | CN1610600A Tin-zinc lead-free solder and solder-joined part |
| 04/27/2005 | CN1610599A Tin-zinc lead-free solder, its mixture, and solder-joined part |
| 04/27/2005 | CN1610596A 激光加工方法 The laser processing method |
| 04/27/2005 | CN1610491A Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same |
| 04/27/2005 | CN1610490A Rotary angle frame type manufacturing tool |
| 04/27/2005 | CN1610489A Adjustable frame type apparatus for manufacturing printed circuit |
| 04/27/2005 | CN1610488A Manufacturing method of wiring circuit substrate |
| 04/27/2005 | CN1610487A Assembly for exposure of two sides of a printed circuit board and apparatus with the same exposure assembly |
| 04/27/2005 | CN1610486A Method for manufacturing wiring circuit substrate |
| 04/27/2005 | CN1610485A Inspecting method for testing point before printed circuit board layout chart coming out |
| 04/27/2005 | CN1610484A Wiring substrate, method for forming wiring pattern and organic EL panel |
| 04/27/2005 | CN1610483A Connecting apparatus and producing method thereof |
| 04/27/2005 | CN1610185A Press fit terminal and connection structure |
| 04/27/2005 | CN1610091A Semiconductor multi-layer wiring plate and forming method thereof |
| 04/27/2005 | CN1610025A Thin film dielectric body for capacitor and producing method thereof |
| 04/27/2005 | CN1609647A Lens barrel and imaging apparatus |
| 04/27/2005 | CN1609623A Electric checkup apparatus and method for thin film carrying belt for mounting electronic elements |
| 04/27/2005 | CN1609550A Apparatus for measuring convex shape and method thereof |
| 04/27/2005 | CN1609281A Method for electrolytic copper plating |
| 04/27/2005 | CN1608783A Pad spot welding method |
| 04/27/2005 | CN1199545C Electromagnetic interference rejection body of low electromagnetic penetrability and reflectivity and its electronic device |
| 04/27/2005 | CN1199537C Method for mfg. multilayer matrix and multilayer matrix made thereby |
| 04/27/2005 | CN1199536C Multilayer printed wiring board and method of producing multilayer printed wiring board |
| 04/27/2005 | CN1199535C Soldering apparatus, and separating agent and method for separating solder and solder oxides |
| 04/27/2005 | CN1199534C Tellite and display apparatus and electronic equipment using the same |
| 04/27/2005 | CN1199533C Tellite and its producing method, and display apparatus and electronic equipment using the same circuit board |
| 04/27/2005 | CN1199532C Process for forming metallic contact electronic circuit |
| 04/27/2005 | CN1199529C Method for checking soft printing circuit |
| 04/27/2005 | CN1199528C Printed circuit board and assembly thereof |
| 04/27/2005 | CN1199324C Spring connector for electrically connection of display screen channel and circuit |
| 04/27/2005 | CN1199250C Device and method for aligning pipe core and hole mask layer on flexible substrate |
| 04/27/2005 | CN1199133C Chip card equipped with loop antenna, and assiciated micromodule |
| 04/27/2005 | CN1199132C Non-conductive substrate forming band or panel, on which are formed plurality of support elements |
| 04/27/2005 | CN1198966C Quasi-azeotropic mixture based on 1,1,1,3,3-pentafluorobutane, methylene choride and methanol for treatment of solid surfaces |
| 04/27/2005 | CN1198875C Printing circuit board constituted by assembling process |
| 04/27/2005 | CN1198692C Multilayer metalized composite on polymer film product and producing process thereof |
| 04/26/2005 | US6886154 Multiple-exposure drawing apparatus and method thereof |
| 04/26/2005 | US6886151 Design method for multilayer wiring board |
| 04/26/2005 | US6885905 Electric-circuit fabricating system and method, and electric-circuit fabricating program |
| 04/26/2005 | US6885788 Light-reception/emission device built-in module with optical and electrical wiring combined therein, method for producing the module and assembling member of the module |
| 04/26/2005 | US6885538 Capacitor mounting structure |
| 04/26/2005 | US6885426 Liquid crystal display device and the manufacturing method thereof with an anisotropic conductive adhesive |
| 04/26/2005 | US6885354 Non-contact communication medium |
| 04/26/2005 | US6885278 Microconverter and laminated magnetic-core inductor |
| 04/26/2005 | US6885109 Comprises exposed chips; packaging |
| 04/26/2005 | US6885104 Semiconductor copper bond pad surface protection |
| 04/26/2005 | US6885090 Inductively coupled electrical connectors |
| 04/26/2005 | US6885089 Battery powerable apparatus, radio frequency communication device, and electric circuit |
| 04/26/2005 | US6884945 Multi-layer printed circuit board and a BGA semiconductor package using the multi-layer printed circuit board |
| 04/26/2005 | US6884944 Multi-layer printed wiring boards having blind vias |
| 04/26/2005 | US6884943 I/C package/ thermal-solution retention mechanism with spring effect |
| 04/26/2005 | US6884939 Constructing of an electronic assembly having a decoupling capacitor |
| 04/26/2005 | US6884833 Devices, compositions, and methods incorporating adhesives whose performance is enhanced by organophilic clay constituents |
| 04/26/2005 | US6884709 Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate |
| 04/26/2005 | US6884707 Interconnections |
| 04/26/2005 | US6884655 Semiconductor package, method of manufacturing the same, and semiconductor device |
| 04/26/2005 | US6884389 For mounting an electronic part to a printed wiring substrate |
| 04/26/2005 | US6884313 Method and system for joining and an ultra-high density interconnect |
| 04/26/2005 | US6884278 Monodisperse spherical metal particles and manufacturing method therefor |
| 04/26/2005 | US6883977 Optical device package for flip-chip mounting |
| 04/26/2005 | US6883714 Methods of optical filament scribing of circuit patterns with planar and non-planar portions |
| 04/26/2005 | US6883698 Planting device for planting solder balls onto a chip |
| 04/26/2005 | US6883213 Apparatus for producing non-woven fabric |
| 04/21/2005 | WO2005036940A1 Telescoping blind via in three-layer core |
| 04/21/2005 | WO2005036644A2 Electronic device and carrier substrate |
| 04/21/2005 | WO2005036587A2 Electronic component, circuit carrier assembly and electronic unit comprising a heat accumulator |
| 04/21/2005 | WO2005036188A1 Circuit board inspection device |
| 04/21/2005 | WO2005035617A1 Latent curing agent and composition |
| 04/21/2005 | WO2005035605A1 Process for producing resin-coated metal powder, resin-coated metal powder and circuit forming toner |
| 04/21/2005 | WO2005035257A1 Elastomeric stamp, patterning method using such a stamp and method for producing such a stamp |
| 04/21/2005 | WO2005035240A1 Peelable circuit board foil |
| 04/21/2005 | WO2005035180A1 Lead-free solder ball |
| 04/21/2005 | WO2005035147A1 Holder for very thin substrates |
| 04/21/2005 | WO2005021862A3 A flexible flat cable termination structure for a clockspring |
| 04/21/2005 | WO2005006412A3 A method of forming an integrated circuit substrate |
| 04/21/2005 | WO2004109860A3 Board-to-board power connector for a projection device |
| 04/21/2005 | WO2004109719A3 Polymer thick film resistor, layout cell, and method |
| 04/21/2005 | WO2004082345A3 Method and device for aligning a substrate and a printing screen during solder paste printing |
| 04/21/2005 | US20050086616 Method for printed circuit board panelization |
| 04/21/2005 | US20050085564 Method and structure for self healing cracks in underfill material between an I/C chip and a substrate bonded together with solder balls |
| 04/21/2005 | US20050085109 Connector |
| 04/21/2005 | US20050085105 Arrangement for producing an electrical connection between a BGA package and a signal source, and method for producing such a connection |
| 04/21/2005 | US20050085101 Filter insert for an electrical connector assembly |
| 04/21/2005 | US20050085067 Robust interlocking via |
| 04/21/2005 | US20050085065 Parallel multi-layer printed circuit board having improved interconnection and method for manufacturing the same |
| 04/21/2005 | US20050085063 Method for forming metal contacts on a substrate |
| 04/21/2005 | US20050085013 Ball grid array resistor network |
| 04/21/2005 | US20050085011 Thermally enhanced packaging structure and fabrication method thereof |
| 04/21/2005 | US20050085007 Joining material stencil and method of use |
| 04/21/2005 | US20050084684 Release film |
| 04/21/2005 | US20050084661 immersion of conductors in lead-free liquid containing metals, group 1B and acyclic oxy acid and salts, then precipitating the metals on the surfaces and coating in electroless plating solutions; supports for semiconductors, capacitors or resistors |
| 04/21/2005 | US20050083742 Packaging structure of a driving circuit for a liquid crystal display device and packaging method of a driving circuit for a liquid crystal display device |
| 04/21/2005 | US20050083665 Power conversion module device and power unit using the same |
| 04/21/2005 | US20050083590 Lens barrel and imaging apparatus |
| 04/21/2005 | US20050083510 Assembly for exposing a double-sided printed circuit panel to light and installation comprising at least one such exposure assembly |
| 04/21/2005 | US20050083502 Exposure device |
| 04/21/2005 | US20050083473 Liquid crystal display module |
| 04/21/2005 | US20050083036 Apparatus for testing substrates |
| 04/21/2005 | US20050082686 Circuitized substrate for fixing solder beads on pads |
| 04/21/2005 | US20050082683 Semiconductor device and a method of manufacturing the same |