Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
05/2005
05/03/2005US6886733 Conductive powder applying device immersing substrate into conductive powder by rotating tank including conductive powder and substrate at opposing positions
05/03/2005US6886284 Firearm microstamping and micromarking insert for stamping a firearm identification code and serial number into cartridge shell casings and projectiles
05/03/2005US6886248 Conductive material and method for filling via-hole
05/03/2005US6886247 Circuit board singulation methods
05/03/2005US6886246 Method for making an article having an embedded electronic device
05/03/2005US6886245 Method for manufacturing mobile electronic devices using a common engine assembly
04/2005
04/28/2005WO2005039263A1 Multi-layer ceramic substrate, method for manufacturng the same and electronic device using the same
04/28/2005WO2005039262A1 Method of producing module with embedded component and module with embedded component
04/28/2005WO2005039261A2 Solder structures for out of plane connections and related methods
04/28/2005WO2005039260A1 Electronic device and method of manufacturing thereof
04/28/2005WO2005039259A1 Ceramic substrates having integrated mechanical structures for direct capture of optical components
04/28/2005WO2005039258A1 Polyimide resin base material and wiring board therefrom
04/28/2005WO2005039257A1 Circuit board
04/28/2005WO2005039256A1 Printed circuit board including a fuse
04/28/2005WO2005039254A2 Electrical circuit apparatus and method for assembling same
04/28/2005WO2005038995A2 Memory link processing with picosecond lasers
04/28/2005WO2005038994A2 Laser-based system for memory link processing with picosecond lasers
04/28/2005WO2005038989A2 Fretting and whisker resistant coating system and method
04/28/2005WO2005038986A2 Electrical circuit apparatus and methods for assembling same
04/28/2005WO2005038825A1 Varnish for insulating film and insulating film
04/28/2005WO2005038702A2 Method for production of a card with a double interface and microcircuit card obtained thus
04/28/2005WO2005038088A1 Electroless copper plating liquid and method for manufacturing wiring board using same
04/28/2005WO2005038070A2 Surface reactive preservative for use with solder preforms
04/28/2005WO2005037538A1 Copper-clad laminate
04/28/2005WO2005037465A1 Fine metal particles and fine metal oxide particles in dry powder form, and use thereof
04/28/2005WO2005037418A2 Processes for fabricating conductive patterns using nanolithography as a patterning tool
04/28/2005WO2005010808A3 Memory card with raised portion
04/28/2005WO2004113427A3 Nanoporous laminates
04/28/2005WO2004107826A3 Multi functional timepiece module with application specific printed circuit boards
04/28/2005WO2004093252A3 Electrical connector and method for making
04/28/2005WO2004092713A3 System and method for attenuating the effect of ambient light on an optical sensor
04/28/2005WO2004082352A3 Method and device for controlling or influencing the printing process used for solder paste printing
04/28/2005WO2004071140A3 Underfill film for printed wiring assemblies
04/28/2005WO2004043130A3 Mechanically enhanced package and method of making same
04/28/2005WO2004027866A8 Method for creating a link in an integrated metal substrate
04/28/2005WO2004001904A3 Stabilized wire bonded electrical connections and method of making same
04/28/2005US20050090866 Method and system for non-vascular sensor implantation
04/28/2005US20050090155 Electrical contact
04/28/2005US20050090137 Printed circuit board with void between pins
04/28/2005US20050090136 Electrical connector assembly with pick up cap
04/28/2005US20050090135 Clockspring with flat cable
04/28/2005US20050090134 Electrical connector assembly with pick up cap
04/28/2005US20050090130 Electrical connector with elastomeric element and restrainer member to offset relaxation of the elastomer
04/28/2005US20050090043 Manufacturing method of ball grid array package
04/28/2005US20050090041 Constructing of an electronic assembly having a decoupling capacitor
04/28/2005US20050090040 Via-in-pad with off-center geometry and methods of manufacture
04/28/2005US20050090038 Card manufacturing technique and resulting card
04/28/2005US20050090028 Method of forming a mask on surface
04/28/2005US20050089709 Support layer for thin copper foil
04/28/2005US20050089679 Spin-printing of electronic and display components
04/28/2005US20050089635 Forming a wiring pattern for example by depositing a dispersion of fine metals by repeated ink jet and heating steps to form a multilayer film before processing at highest temperature; electronics, electrooptics e.g. liquid crystal displays, plasma displays
04/28/2005US20050088832 ESD protection structure and device utilizing the same
04/28/2005US20050088830 Electro-optical apparatus, flexible printed circuit board, manufacturing method for electro-optical apparatus, and electronic equipment
04/28/2005US20050088783 Method of making electromagnetic wave shielded write and read wires on a support for a magnetic media drive
04/28/2005US20050088610 Substrate and a liquid crystal display panel capable of being cut by using a laser and a method for manufacturing the same
04/28/2005US20050088260 Electronic component module and manufacturing method thereof
04/28/2005US20050088251 Crystal oscillator
04/28/2005US20050087909 Method for reducing warpage during application and curing of encapsulant materials on a printed circuit board
04/28/2005US20050087886 Method and apparatus for improving defective solder joint detection using x-ray inspection of printed assemblies
04/28/2005US20050087885 Semiconductor chip, mounting structure thereof, and methods for forming a semiconductor chip and printed circuit board for the mounting structure thereof
04/28/2005US20050087877 Differential signal traces coupled with high permittivity material
04/28/2005US20050087867 Ball grid array package and method thereof
04/28/2005US20050087860 Multilayered substrate for semiconductor device
04/28/2005US20050087857 Circuit device
04/28/2005US20050087850 Wiring board and semiconductor device
04/28/2005US20050087848 Chip scale package and method of fabricating the same
04/28/2005US20050087841 Multilayer electronic substrate, and the method of manufacturing multilayer electronic substrate
04/28/2005US20050087747 Optoelectronic semiconductor device and light signal input/output device
04/28/2005US20050087588 Vertical removal of excess solder from a circuit substrate
04/28/2005US20050087522 Laser processing of a locally heated target material
04/28/2005US20050087509 a metal layer having a metal oxide film laminated to an insulating layer is to be subjected to an etching processing to form a pattern; measuring concentration of oxygen and metal measured from the surface of the metal layer towards the inside of the metal layer in a time-elapsing manner
04/28/2005US20050087447 Addition of cyanine dye allows copper plating from trenches and vias having high aspect ratio which have been formed on surfaces of substrate; electromigration
04/28/2005US20050087366 Insertion of electrical component within a via of a printed circuit board
04/28/2005US20050087364 Multilayer wiring board
04/28/2005US20050087363 Wiring board and method of manufacturing the same
04/28/2005US20050087289 Method for forming film, method for forming wiring pattern, method for manufacturing semiconductor device, electro-optical device, and electronic device
04/28/2005US20050087284 Remelting block of solid rough material of corrosion resistant, martensitic chromium steel;making tube blank having axial bore hole; shaping, hot forming, extrusion, deformation and cutting from circular cross-sectional tube; quality
04/28/2005US20050086985 Forming intermediate insulating material provided with conductive paths fixed on opposite faces of intermediate element by mechanical constraint means; setting within a mold and injecting fluid
04/28/2005US20050086800 Method for improved traceability of components used in manufacturing of a printed circuit board (PCB)
04/28/2005CA2458742A1 Printed circuit board with void between pins
04/27/2005EP1526716A2 Lens barrel and imaging apparatus
04/27/2005EP1525783A1 Electronics housing with integrated thermal dissipater
04/27/2005EP1525496A1 Method for determining a minimum pulse width for a short pulse laser system
04/27/2005EP1525334A1 Method and array for processing carrier materials by means of heavy ion radiation and subsequent etching
04/27/2005EP1525268A1 Functional fluorescent dyes
04/27/2005EP1525247A2 Complexing agent for treating metallic and plastic surfaces
04/27/2005EP1525240A1 Dyed fluoropolymers
04/27/2005EP1525090A1 Method for producing a ceramic substrate
04/27/2005EP1525085A2 Method and device for forming a body having a three-dimensional structure
04/27/2005EP1525069A1 System and method of laser drilling using a continuously optimized depth of focus
04/27/2005EP1483722A4 Memory module assembly using partially defective chips
04/27/2005EP1337377B1 Solder material and electric or electronic device in which the same is used
04/27/2005EP1286577B1 Method of fixing electronic part
04/27/2005CN2696275Y Space post structure of circuit board
04/27/2005CN2696274Y Fixing device
04/27/2005CN2695687Y Improved fan device
04/27/2005CN2695122Y Film formig device, liquid drop projecting device, display device having colour filter
04/27/2005CN1611099A Tombstoning structures and methods of manufacture
04/27/2005CN1610970A Arrangement of vias in a substrate to support a ball grid array
04/27/2005CN1610614A Electronic-component alignment method and apparatus therefor
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