Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2005
11/03/2005US20050242423 Stacked module systems and methods
11/03/2005US20050242421 Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging
11/03/2005US20050242394 Pattern formation substrate and method of pattern formation
11/03/2005US20050242161 Systems and methods for laser soldering flat flexible cable
11/03/2005US20050242160 Electrical circuits with button plated contacts and assembly methods
11/03/2005US20050241988 Manufacturing method for electronic or electric products such as flat-panel display devices and band-shaped package therefor
11/03/2005US20050241954 Electrolytic gold plating method of printed circuit board
11/03/2005US20050241951 Selective catalytic activation of non-conductive substrates
11/03/2005US20050241949 Selective catalytic activation of non-conductive substrates
11/03/2005US20050241852 Cross-connecting by permutations using configurable printed circuits
11/03/2005US20050241851 Pin grid array package carrier and process of mounting passive component thereon
11/03/2005US20050241850 Method and structures for implementing customizable dielectric printed circuit card traces
11/03/2005US20050241849 Circuit board
11/03/2005US20050241848 Design and Method for plating PCI express (PCIE) edge connector
11/03/2005US20050241758 Bonding method of flexible film and display bonded thereby
11/03/2005US20050241731 Flux composition and techniques for use thereof
11/03/2005US20050241692 Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module
11/03/2005US20050241678 Pattern forming method and apparatus, and device fabrication method and device
11/03/2005US20050241506 Method for printing an electronic circuit component on a substrate using a printing machine
11/03/2005US20050241144 Component rejection station
11/03/2005US20050241128 Method of laminating low temperature co-fired ceramic (LTCC) material and product formed thereby
11/03/2005DE19919716B4 Mikroelektronische Baugruppe Microelectronic assembly
11/03/2005DE10393581T5 Härtbare Schutzlackzusammensetzungen, daraus erhaltene gehärtete Produkte und Verfahren zu ihrer Herstellung The curable coating compositions, cured products obtained therefrom and processes for their preparation
11/03/2005DE10392947T5 Bleifreie Lötlegierung und bleifreier Anschluß Lead-free solder and lead-free connection
11/03/2005DE10356882A1 Verfahren zur Herstellung eines elektromechanischen Bauteils A process for producing an electromechanical component
11/03/2005DE10310797B4 Vorrichtung zur Bearbeitung von Substraten, insbesondere von elektrischen Schaltungssubstraten, mit Laser An apparatus for processing substrates, in particular of electric circuit substrates, with laser
11/03/2005DE102005016830A1 Halbleitervorrichtung und Verfahren zu ihrer Herstellung Semiconductor device and process for their preparation
11/03/2005DE102005014790A1 Elektrische Z-Achsen Verbindung und Verfahren zur elektrischen Verbindung für Ultraschalltransducer Electrical connection and Z axes method for the electrical connection for ultrasonic transducers
11/03/2005DE102005008491A1 Harzgekapselte Halbleitervorrichtung und Verfahren zu ihrer Herstellung Resin-encapsulated semiconductor device and process for their preparation
11/03/2005DE102004019412A1 Verfahren zum Drucken elektrischer und/oder elektronischer Strukturen und Folie zur Verwendung in einem solchen Verfahren A method for printing electrical and / or electronic structures and film for use in such a method
11/03/2005DE102004017772A1 Verfahren zum Reflow-Löten A method for reflow soldering
11/03/2005DE102004017440A1 Verfahren zur Behandlung von laserstrukturierten Kunststoffoberflächen A method for the treatment of laser-structured plastic surfaces
11/03/2005DE102004016480A1 Vollintegrierte hybride optisch-elektrische Leiterplatte Fully integrated hybrid optical-electrical circuit board
11/03/2005DE102004014438A1 Leiterplattennutzen mit einer Vielzahl an Schaltungsträgern, Schaltungsträger und Verfahren zum Vereinzeln von Schaltungsträgern aus einem Leiterplattennutzen Circuit board panel with a plurality of circuit boards, interconnect devices and methods for separating of circuit carriers from a circuit board panel
11/03/2005DE10164880B4 Wiring board e.g. for mobile communications device or computer, has insulating pattern formed on substrate, intersecting wiring pattern to define electrode
11/03/2005CA2505362A1 Change-over switching using configurable printed circuit boards
11/02/2005EP1592290A1 Wired circuit board and production method thereof
11/02/2005EP1592289A1 Method for fabricating embedded thin film resistors
11/02/2005EP1592288A1 Printed circuit board
11/02/2005EP1592063A2 Assembly in pressure contact with a power semiconductor module
11/02/2005EP1592061A2 Multilayer substrate including components therein
11/02/2005EP1592053A1 Wiring fabricating method
11/02/2005EP1592052A1 Method for manufacturing display
11/02/2005EP1590995A1 Heat dissipating arrangement for an electronic appliance
11/02/2005EP1590506A1 Stencil manufacture
11/02/2005EP1590500A2 Method of forming a conductive metal region on a substrate
11/02/2005EP1590416A1 Method for gluing fpcb's
11/02/2005EP1590415A1 Thermo-activated adhesive material for fpcb agglutinations
11/02/2005EP0776385B1 High fatigue ductility electrodeposited copper foil
11/02/2005CN2738525Y Wet plating surface cleaning and through hole water cutter for printed circuit board
11/02/2005CN1692687A Multichip module including substrate with an array of interconnect structures
11/02/2005CN1692685A Module comprising built-in electronic components
11/02/2005CN1692684A Method for forming printing inspection data
11/02/2005CN1692682A Land grid array fabrication using elastomer core and conducting metal shell or mesh
11/02/2005CN1692496A Electronic member, method for making the same, and semiconductor device
11/02/2005CN1692283A Sheet-form connector and production method and application therefor
11/02/2005CN1692248A 发光模块 Emitting module
11/02/2005CN1692149A Adhesive composition, adhesive composition for circuit connection, connected circuit structure, and semiconductor devices
11/02/2005CN1692090A Process for the manufacture of metal-ceramic compound material in particular metal-ceramic substrates and metal-ceramic compound material especially metal-ceramic substrate manufactured according to t
11/02/2005CN1692003A Sheet-cutting apparatus
11/02/2005CN1691877A Manufacturing method of laminated substrate, and semiconductor device for module and manufacturing apparatus
11/02/2005CN1691876A Electronic apparatus and circuit board thereof
11/02/2005CN1691875A Transplanted repair method for bad region of printed circuit board
11/02/2005CN1691874A Method for manufacturing embedded film resistor of printed circuit board
11/02/2005CN1691873A Method and device for manufacturing conductive patterns in a printed circuit board
11/02/2005CN1691872A Electronic circuit board
11/02/2005CN1691871A Multilayer substrate including components therein
11/02/2005CN1691492A Power module and electric transportation apparatus incorporating the same
11/02/2005CN1691416A Electronic part and surface treatment method of the same
11/02/2005CN1691313A Power module and method of manufacturing the same
11/02/2005CN1690813A Coupling structure of electronic components
11/02/2005CN1690778A Display device
11/02/2005CN1690138A Ink jet ink for printing
11/02/2005CN1690136A Ink jet printable thick film ink compositions and processes
11/02/2005CN1690119A Thermoset resin composition and multi-layer printed circuit board used thereof
11/02/2005CN1689813A Method of manufacturing electronic component
11/02/2005CN1689811A Method of filling liquid into function liquid droplet ejection head, and ejection apparatus, method of manufacturing photoelectricity unit
11/02/2005CN1225953C Multilayer printed wiring board
11/02/2005CN1225952C Printing circuit board pore filling methods and apparatus
11/02/2005CN1225951C Copper alloy foil for laminated plate
11/02/2005CN1225950C Circuit board
11/02/2005CN1225949C Printed circuit board
11/02/2005CN1225785C Wiring base board and method for producing belt type wiring base board
11/02/2005CN1225529C Base board cleaning liquid of electronic material
11/01/2005US6961245 High frequency module
11/01/2005US6961110 Display device
11/01/2005US6960822 Solder mask and structure of a substrate
11/01/2005US6960735 Multi-shot molded touch switch
11/01/2005US6960729 Upright-pin-joined resin substrate, method of producing the substrate, pins, and method of producing the pins
11/01/2005US6960636 Does not require solvent to provide viscosity for handling; low moisture uptake; for adhesives
11/01/2005US6960518 Buildup substrate pad pre-solder bump manufacturing
11/01/2005US6960396 semiconductor; plated layer of tin-bismuth solder alloy on the lead; nontoxic; sufficient bonding strength and wettability; reduced whisker formation
11/01/2005US6960391 Carrier-attached copper foil and printed board using the copper foil
11/01/2005US6960373 Continuous mode solder jet method
11/01/2005US6960366 Plated terminations
11/01/2005US6960282 Apparatus for cleaning residual material from an article
11/01/2005US6960094 Flat and thin connector for electrically connecting a flexible printed circuit board and a hard board
11/01/2005US6960050 Hole forming system with ganged spindle set
11/01/2005US6959856 Solder bump structure and method for forming a solder bump
10/2005
10/27/2005WO2005101937A1 Process for manufacturing a power electronic appliance by bending
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