| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 11/22/2005 | US6966784 Flexible cable interconnect assembly |
| 11/22/2005 | US6966551 Unloading apparatus for plate-like workpiece cutting machine |
| 11/22/2005 | US6966482 Connecting structure of printed circuit boards |
| 11/22/2005 | US6966110 Light emission device havingnozzle aperture; electrodes; rigid dielectric; pressurized liquid; ejection drops |
| 11/17/2005 | WO2005109980A1 Arrangement for cooling an electronic unit and production of such an arrangement |
| 11/17/2005 | WO2005109978A1 Releasable electrical contact of three-dimensional moulded interconnect devices |
| 11/17/2005 | WO2005109977A1 Method for production of electronic circuit board |
| 11/17/2005 | WO2005109976A1 Method for mechanically separating and isolating interconnect devices from a circuit board panel |
| 11/17/2005 | WO2005109974A2 Fusion bonded assembly with attached leads |
| 11/17/2005 | WO2005109973A1 Trimming of embedded passive components using pulsed heating |
| 11/17/2005 | WO2005109972A2 Design and method for plating pci express (pcie) edge connector |
| 11/17/2005 | WO2005109458A2 Method of laminating low temperature co-fired ceramic (ltcc) material and product formed thereby |
| 11/17/2005 | WO2005109448A1 Insulated conductive ball for anisotropic electric connection and its method of preparation and products using the same |
| 11/17/2005 | WO2005109447A1 Insulated conductive particles and anisotropic conductive adhesive film containing the particles |
| 11/17/2005 | WO2005109098A1 Pattern forming material, pattern forming apparatus, and pattern forming process |
| 11/17/2005 | WO2005109097A1 Lithographic method products obtained and use of said method |
| 11/17/2005 | WO2005108327A1 Method for producing multilayer dielectric body |
| 11/17/2005 | WO2005096367A8 Heater, reflow apparatus, and solder bump forming method and apparatus |
| 11/17/2005 | WO2005082624B1 Methods and apparatus for changing web material in a stencil printer |
| 11/17/2005 | WO2005020647A3 Method for assembling at least one substrate-integrating component by surface mounting, a corresponding support and component |
| 11/17/2005 | WO2005017970A3 Module for epas/ehpas applications |
| 11/17/2005 | US20050256523 Disposable surgical devices |
| 11/17/2005 | US20050256241 Metal filler particles dispersed in solvent-free hybrid epoxy polymer matrix; electronics; semiconductors; heat sinks |
| 11/17/2005 | US20050255744 Method and apparatus for inspecting printed circuit boards |
| 11/17/2005 | US20050255725 Board mounted electrical connector |
| 11/17/2005 | US20050255636 Microtools for package substrate patterning |
| 11/17/2005 | US20050255312 Conductive material and manufacturing method thereof |
| 11/17/2005 | US20050255303 Multilayer substrate including components therein |
| 11/17/2005 | US20050255302 Printed circuit board |
| 11/17/2005 | US20050255270 Flame retardancy although it is halogen-free, with good bonding strength, soldering heat resistance and coefficient of thermal expansion; novolak epoxy resin, carboxylic acid-modified acrylonitrile butadiene rubber particles, a triazine ring-containing cresol novolak, phenolic phosphorus compound, filler |
| 11/17/2005 | US20050255232 Method, system, and apparatus for protective coating a flexible circuit |
| 11/17/2005 | US20050254699 Apparatus and method for detecting defect and apparatus and method for extracting wire area |
| 11/17/2005 | US20050254224 Method for attaching a shield can to a pcb and a shield can therefor |
| 11/17/2005 | US20050254218 Printed circuit board with improved heat dissipation efficiency, electronic apparatus having printed circuit board with improved heat dissipation efficiency, CRT display device having printed circuit board with improved heat dissipation efficiency, and recording/reproducing device or video display device incorporating recording/reproducing device having printed circuit board with improved heat dissipation efficiency |
| 11/17/2005 | US20050254207 Cooling means for a driver semiconductor |
| 11/17/2005 | US20050254176 Disc drive integral actuator pins |
| 11/17/2005 | US20050254175 Method for making noble metal conductive leads for suspension assemblies |
| 11/17/2005 | US20050254032 Exposure device |
| 11/17/2005 | US20050253992 LCD device having external terminals |
| 11/17/2005 | US20050253772 Method for forming radio frequency antenna |
| 11/17/2005 | US20050253681 Surface mounting chip network component |
| 11/17/2005 | US20050253620 Method for testing using a universal wafer carrier for wafer level die burn-in |
| 11/17/2005 | US20050253619 Method for testing using a universal wafer carrier for wafer level die burn-in |
| 11/17/2005 | US20050253610 Test method for semiconductor components using anisotropic conductive polymer contact system |
| 11/17/2005 | US20050253275 Flip chip package and process of forming the same |
| 11/17/2005 | US20050253263 Wiring substrate and process for manufacturing the same |
| 11/17/2005 | US20050253258 Solder flow stops for semiconductor die substrates |
| 11/17/2005 | US20050253248 Multilayer wiring substrate and method of manufacturing multilayer wiring substrate |
| 11/17/2005 | US20050253233 Power module and electric transportation apparatus incorporating the same |
| 11/17/2005 | US20050253231 Semiconductor package with encapsulated passive component |
| 11/17/2005 | US20050252978 IC card module |
| 11/17/2005 | US20050252948 Lead wire bonding method |
| 11/17/2005 | US20050252828 Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape |
| 11/17/2005 | US20050252684 Electroless copper plating machine thereof, and multi-layer printed wiring board |
| 11/17/2005 | US20050252683 Circuit substrate and method of manufacturing plated through slot thereon |
| 11/17/2005 | US20050252682 Wiring board and semiconductor package using the same |
| 11/17/2005 | US20050252681 Microelectronic assembly having variable thickness solder joint |
| 11/17/2005 | US20050252605 RFID label technique |
| 11/17/2005 | US20050252598 Viscous adhesive material for fastening electronic components |
| 11/17/2005 | US20050252398 Pattern form object and a manufacturing method thereof |
| 11/17/2005 | US20050252395 Screen printing apparatus and screen printing method |
| 11/17/2005 | US20050251997 Method for forming printed circuit board |
| 11/17/2005 | DE202005014705U1 Circuit board system consisting of dielectric support plate(s) with circuit pattern at least at one side, containing metallised through and/or blind bores, with metallising forming element of circuit pattern |
| 11/17/2005 | DE202005010914U1 Cutting or drilling apparatus for circuit board panel yielding multiple circuit boards, has suction orifice below link of panel to be cut out, and wall parts for immovably holding slots of panel |
| 11/17/2005 | DE19649454B4 Platine für integrierte elektronische Schaltungen und Verfahren zur Herstellung einer Platine Board for integrated electronic circuits and methods for producing a circuit board |
| 11/17/2005 | DE102005017331A1 Schaltungsplatine Circuit board |
| 11/17/2005 | DE102004021747A1 Strip conductor structure used in the production of circuit boards comprises a metal layer arranged on metal cores produced by breaking up electrically non-conducting metal compounds by electromagnetic radiation |
| 11/17/2005 | DE102004020580A1 Verfahren zur Herstellung eines BGA-Chipmoduls und BGA-Chipmodul Process for the preparation of a BGA chip module and BGA-chip module |
| 11/17/2005 | DE102004019610A1 Soldering process for electronic components uses a solder vapour phase process |
| 11/17/2005 | DE102004019568A1 Substrate for a power semiconductor module has electronic components and connections on metal conductor on an isolation layer and recesses beneath or next to these |
| 11/17/2005 | DE102004018483A1 Vorrichtung und Verfahren zum Aufbringen von Beschichtungen auf bandförmigen Strukturen in der Halbleiterbauteilefertigung Apparatus and method for applying coatings to the band-shaped structures in the semiconductor devices fabrication |
| 11/17/2005 | CA2564714A1 Fusion bonded assembly with attached leads |
| 11/16/2005 | EP1596641A2 Printed circuit board with improved heat dissipation efficiency |
| 11/16/2005 | EP1596640A1 Cross-connection by permutations using configurable printed circuit boards |
| 11/16/2005 | EP1596435A2 A pattern form object and a manufacturing method thereof |
| 11/16/2005 | EP1596369A1 Suspension board with circuit |
| 11/16/2005 | EP1596326A2 IC card module |
| 11/16/2005 | EP1595138A1 Image recognition apparatus and image recognition method |
| 11/16/2005 | EP1594651A1 Device and method for processing electric circuit substrates by laser |
| 11/16/2005 | EP1112392B1 Method for printing a catalyst on substrates for electroless deposition |
| 11/16/2005 | EP0879465B1 Data processing of a bitstream signal |
| 11/16/2005 | CN2741320Y Drum regulating structure of grinder |
| 11/16/2005 | CN1698403A Method for manufacturing substrate, release sheet, substrate manufacturing apparatus and method for manufacturing substrate using same |
| 11/16/2005 | CN1698144A Solid-state electrolytic capacitor and mounting method therefor |
| 11/16/2005 | CN1698138A Conductive paste, method for producing same, circuit board using such conductive paste and method for producing same |
| 11/16/2005 | CN1697863A Insect repellent coating and industrial product using the same |
| 11/16/2005 | CN1697858A Photo-curable and thermosetting resin composition |
| 11/16/2005 | CN1697728A Stretched film and method for production thereof |
| 11/16/2005 | CN1697727A Cushioning material for hot pressing and process for producing layered board |
| 11/16/2005 | CN1697598A Substrate for forming specific pattern, and method for manufacturing the same |
| 11/16/2005 | CN1697597A Surface treatment appts.of substrate material |
| 11/16/2005 | CN1697593A Wiring base board, method of producing thereof, and electronic device |
| 11/16/2005 | CN1697592A Printed wiring board, production process thereof and semiconductor device |
| 11/16/2005 | CN1697588A A pattern form object and a manufacturing method thereof |
| 11/16/2005 | CN1697259A Board mounted electrical connector |
| 11/16/2005 | CN1697164A Carrier tape, a method of manufacturing an electronic device with the carrier tape, and a tape carrier package with the carrier tape |
| 11/16/2005 | CN1697163A Wiring board and semiconductor package using the same |
| 11/16/2005 | CN1697092A Surface mountable polymeric PTC device with integral weld plate |
| 11/16/2005 | CN1697027A Suspension board with circuit |
| 11/16/2005 | CN1696972A IC card module |