| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/20/2005 | US6977441 Interconnect substrate and method of manufacture thereof, electronic component and method of manufacturing thereof, circuit board and electronic instrument |
| 12/20/2005 | US6977432 Prefabricated semiconductor chip carrier |
| 12/20/2005 | US6977381 Gating grid and method of making same |
| 12/20/2005 | US6977349 Method for manufacturing wiring circuit boards with bumps and method for forming bumps |
| 12/20/2005 | US6977348 High density laminated substrate structure and manufacture method thereof |
| 12/20/2005 | US6977347 Flexible printed circuit board |
| 12/20/2005 | US6977346 Vented circuit board for cooling power components |
| 12/20/2005 | US6977339 Surface mounting package |
| 12/20/2005 | US6977338 Underfill diffusion prevention layer of photosensitive polyimide between mounted electronic part and conductor cover layer; prevents underfill on highly wettable surface; allows high density circuit design |
| 12/20/2005 | US6977222 Pattern forming method and apparatus, and device fabrication method and device |
| 12/20/2005 | US6977211 Selective consolidation processes for electrically connecting contacts of semiconductor device components |
| 12/20/2005 | US6977190 Semiconductor device and method for production thereof |
| 12/20/2005 | US6977130 Method of manufacturing an electronic circuit and manufacturing apparatus of an electronic circuit |
| 12/20/2005 | US6977055 Securing electrical conductors |
| 12/20/2005 | US6977035 using solution including a compound containing a structure of X S Y , wherein X and Y are chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen atom, and contacting solution with ozone |
| 12/20/2005 | US6977025 Method of forming a monolayer of particles having at least two different sizes, and products formed thereby |
| 12/20/2005 | US6976881 Grouped element transmission channel link termination assemblies |
| 12/20/2005 | US6976855 Solder reserve transfer device and process |
| 12/20/2005 | US6976849 Pinless solder joint for coupling circuit boards |
| 12/20/2005 | US6976616 Circuit board transferring apparatus and method and solder ball mounting method |
| 12/20/2005 | US6976415 Method for manufacturing printed wiring substrates, metal plate for use in manufacturing printed wiring substrates, and multi-printed wiring-substrate panel |
| 12/20/2005 | US6976306 laminating a dielectric onto an electric circuit layer, drilling, filling holes with plastic conductive material; requires only one heating, pressurization step, |
| 12/20/2005 | CA2246057C Thin film fabrication technique for implantable electrodes |
| 12/17/2005 | CA2507440A1 Led automotive headlamp |
| 12/15/2005 | WO2005120143A1 Electronic component |
| 12/15/2005 | WO2005120142A1 Multilayer wiring board and method for manufacturing the same |
| 12/15/2005 | WO2005120141A1 Solder jetting apparatus, solder jetting apparatus manufacturing method and electronic component soldering method |
| 12/15/2005 | WO2005120140A1 Circuit board, and metal paste and method for manufacturing the same |
| 12/15/2005 | WO2005120139A1 Surface-treated copper foil and flexible copper-clad laminate plate and film carrier tape manufactured by use of the surface-treated copper foil |
| 12/15/2005 | WO2005119860A2 Method of providing consistent quality of target material removal by lasers having different output performance characteristics |
| 12/15/2005 | WO2005119850A1 Electro-formed ring interconnection system |
| 12/15/2005 | WO2005119849A1 Flexible scrub ring contact |
| 12/15/2005 | WO2005119848A1 Flexible ring interconnection system |
| 12/15/2005 | WO2005119847A1 Centrifugal solder extractor tool and method |
| 12/15/2005 | WO2005119765A2 Assembly including vertical and horizontal joined circuit panels |
| 12/15/2005 | WO2005119709A1 Inductor |
| 12/15/2005 | WO2005119633A1 Led assembly with vented circuit board |
| 12/15/2005 | WO2005118244A2 Fuel cell bipolar plates of conductive loaded resin-based materials |
| 12/15/2005 | WO2005118219A1 Gripper for holding a piece to be machined in a grinding machine |
| 12/15/2005 | WO2005118213A2 Solder paste and process |
| 12/15/2005 | WO2005118212A1 Solder mask enhancement and method of inspecting printed circuit board assemblies |
| 12/15/2005 | WO2005081595A3 Preferential assymmetrical via positioning for printed circuit boards |
| 12/15/2005 | US20050278679 Device for estimating number of board layers constituting board, system including the device, and method for estimating the same and program for executing the method |
| 12/15/2005 | US20050277329 Board-to-board power connector for a projection device |
| 12/15/2005 | US20050277313 Surface mountable pin assembly for a printed circuit board |
| 12/15/2005 | US20050277310 System and method for processor power delivery and thermal management |
| 12/15/2005 | US20050277309 Flexible scrub ring contact |
| 12/15/2005 | US20050277286 Metallic glass microtool |
| 12/15/2005 | US20050277282 Method of manufacturing wiring substrate |
| 12/15/2005 | US20050277245 Method for forming bump on electrode pad with use of double-layered film |
| 12/15/2005 | US20050277244 Method for fastening microtool components to objects |
| 12/15/2005 | US20050277226 High density flip chip interconnections |
| 12/15/2005 | US20050277225 Method for production of semiconductor package |
| 12/15/2005 | US20050276934 heat decaying polymer containing a polyoxyalkylene resin as the principal ingredient formed by crosslinking a crosslinkable group containing hydrolyzing silyl group, an epoxy group, an acid anhydride group, a carboxyl group, a hydroxyl group; a decomposition promoter (SnO2 ) |
| 12/15/2005 | US20050276933 Method to form a conductive structure |
| 12/15/2005 | US20050276918 Adhesive film exhibiting anisotropic electrical conductivity |
| 12/15/2005 | US20050276912 Wiring substrate, semiconductor device and manufacturing method thereof |
| 12/15/2005 | US20050276911 Printing of organometallic compounds to form conductive traces |
| 12/15/2005 | US20050276024 Flexi-rigid printed circuit board with integral flexible heat sink area |
| 12/15/2005 | US20050275420 Method and apparatus for managing aligning and coupling of a land grid array interposer for a field replacement unit |
| 12/15/2005 | US20050275317 Structure with a plurality of substrates, its manufacturing method and crystal oscillator with the structure |
| 12/15/2005 | US20050275100 Capping of metal interconnects in integrated circuit electronic devices |
| 12/15/2005 | US20050275096 Pre-doped reflow interconnections for copper pads |
| 12/15/2005 | US20050275094 Encapsulation of pin solder for maintaining accuracy in pin position |
| 12/15/2005 | US20050275090 Chip-component-mounted device and semiconductor device |
| 12/15/2005 | US20050275084 Compliant contact pin assembly and card system |
| 12/15/2005 | US20050275083 Compliant contact pin assembly and card system |
| 12/15/2005 | US20050275078 High frequency multilayer integrated circuit |
| 12/15/2005 | US20050275074 Semiconductor package and method of manufacturing the same |
| 12/15/2005 | US20050274957 LED packaging structure |
| 12/15/2005 | US20050274933 Formulation for printing organometallic compounds to form conductive traces |
| 12/15/2005 | US20050274802 Circuit board inspection apparatus |
| 12/15/2005 | US20050274772 Treating an area to increase affinity for a fluid |
| 12/15/2005 | US20050274770 Method for the precise and reliable placement of solid metallic and non-metallic particles |
| 12/15/2005 | US20050274704 Method of joining terminals by soldering |
| 12/15/2005 | US20050274689 Printed wiring board, production process thereof and semiconductor device |
| 12/15/2005 | US20050274630 Tamper barrier enclosure with corner protection |
| 12/15/2005 | US20050274603 Plating process enhanced by squeegee roller apparatus |
| 12/15/2005 | US20050274544 Electrical isolation of PCBs gasketing using controlled depth drilling |
| 12/15/2005 | US20050274542 Wiring board, magnetic disc apparatus, and manufacturing method of wiring board |
| 12/15/2005 | US20050274541 Module circuit board for semiconductor device having barriers to isolate I/O terminals from solder |
| 12/15/2005 | US20050274480 Reduction of spontaneous metal whisker formation |
| 12/15/2005 | US20050274267 Method and stencil for extruding material on a substrate |
| 12/15/2005 | US20050274251 Punching device and punching die for it |
| 12/15/2005 | US20050274007 Method for increasing a production rate of printed wiring boards |
| 12/15/2005 | US20050274005 Pin removal structure used in printed circuit board drilling machine |
| 12/15/2005 | DE202005014664U1 Elastomer/rubber ring for influencing the height and shape of soldered joints between an integrated switching circuit (ISC) and a printed circuit board fits around a solder deposit on the ISC |
| 12/15/2005 | DE102005024312A1 System und Verfahren für das Verbinden von Flachbandlitzenkabeln System and method for connecting Flachbandlitzenkabeln |
| 12/15/2005 | DE102005005304A1 Fuel cell battery in form of plug-in card, e.g. for powering electrical equipment, has multiple membrane electrolytes embedded in printed circuit board |
| 12/15/2005 | DE102004025279A1 Träger mit Lotkugelelementen und ein Verfahren zum Bestücken von Substraten mit Kugelkontakten Carrier with solder ball elements and a method for loading substrates with ball contacts |
| 12/15/2005 | DE102004025211A1 Übertrager für ein Gerät der Hochfrequenztechnik, der direkt auf einer Leiterplatte angeordnet ist Transformer for a device of high frequency technology, which is located directly on a circuit board |
| 12/15/2005 | DE102004024718A1 Electrical printed circuit board component assembly has injection molded thermoplastic body formed by spraying which encloses printed circuit board |
| 12/15/2005 | DE102004001108B4 Permanenter oder temporärer Schutz von Bauelementen mittels Schrumpffolie Permanent or temporary protection of components by shrink film |
| 12/14/2005 | EP1605739A1 Rigid-flex wiring board |
| 12/14/2005 | EP1605738A1 Method for production of semiconductor package |
| 12/14/2005 | EP1605737A2 Apparatus and process in at least three steps for cleaning of flat items by cleaning, rinsing and drying. |
| 12/14/2005 | EP1605736A2 Integrated circuits with copper metallization for interconnection |
| 12/14/2005 | EP1605735A2 High frequency multilayer integrated circuit |
| 12/14/2005 | EP1605552A1 Contact pin with solder mass and method of production |
| 12/14/2005 | EP1605078A1 Novel imidazole compound and usage thereof |