| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
|---|
| 09/21/2005 | EP1577942A2 Device with through-hole interconnection and method for manufacturing the same |
| 09/21/2005 | EP1577905A2 Surface mountable polymeric PTC device with integral weld plate |
| 09/21/2005 | EP1577740A2 Screen-printing metal mask plate and method of resin-sealing vibration part |
| 09/21/2005 | EP1577699A2 Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatus |
| 09/21/2005 | EP1576864A1 Separator plate for the production of circuit board components |
| 09/21/2005 | EP1576703A1 Flat cable harness |
| 09/21/2005 | EP1576536A1 A tamper-indicating rfid antenna |
| 09/21/2005 | EP1576297A1 Bolt assembly, method and device for release, and computer system |
| 09/21/2005 | EP1576206A2 Method of and apparatus for forming three-dimensional structures |
| 09/21/2005 | EP1576205A1 Plating of multi-layer structures |
| 09/21/2005 | EP1576203A2 Reduction of surface oxidation during electroplating |
| 09/21/2005 | EP1576064A1 Self-adhesive article with at least one layer of a thermally-conducting adhesive mass and method for production thereof |
| 09/21/2005 | EP1014302B1 Noncontact ic card and manufacture thereof |
| 09/21/2005 | CN2728180Y Surface mounted component assembly |
| 09/21/2005 | CN2728178Y Electronic element attractor |
| 09/21/2005 | CN2728168Y A hot air circulator |
| 09/21/2005 | CN2728167Y Elastic fatigue resistant surface adhesion spring |
| 09/21/2005 | CN1672481A Apparatus and method for insepecting cream solder printed on a substrate |
| 09/21/2005 | CN1672479A Circuit substrate management method, tag chip mounting method, and electronic circuit manufacturing system |
| 09/21/2005 | CN1672478A Part mounting recognition mark recognition device and method |
| 09/21/2005 | CN1672477A Electronics housing with integrated thermal dissipater |
| 09/21/2005 | CN1672475A Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof |
| 09/21/2005 | CN1672474A Process for creating holes of circuit assembly |
| 09/21/2005 | CN1672473A Method for manufacturing board with built-in device and board with built-in device, and method for manufacturing printed wiring board and printed wiring board |
| 09/21/2005 | CN1672472A Process for creating holes in polymeric substrates |
| 09/21/2005 | CN1672471A Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions |
| 09/21/2005 | CN1672294A Connection device for flexible circuit |
| 09/21/2005 | CN1672246A Semiconductor polishing compound, process for its production and polishing method |
| 09/21/2005 | CN1672225A Device comprising a circuit arrangement with an inductive element |
| 09/21/2005 | CN1672222A Chip resistor and method of manufacturing the same |
| 09/21/2005 | CN1672168A Methods of optical filament scribing of circuit patterns with planar and non-planar portions |
| 09/21/2005 | CN1672107A Method, apparatus and program of thermal analysis, heat controller and heating furnace using the method |
| 09/21/2005 | CN1671804A Electrodepositable dielectric coating compositions to coat a substrate and methods to form dielectric coating |
| 09/21/2005 | CN1671770A Liquid crystalline polymeric compositions |
| 09/21/2005 | CN1671536A Method and device for forming a body having a three-dimensional structure |
| 09/21/2005 | CN1671506A Solder paste flux system |
| 09/21/2005 | CN1671481A Method for patterning carbon nanotube coating and carbon nanotube wiring |
| 09/21/2005 | CN1671276A 多层电路板 The multilayer circuit board |
| 09/21/2005 | CN1671275A Circuit board with enlarged signal wiring area |
| 09/21/2005 | CN1671274A Flexible substrate having interlaminar junctions, and process for producing the same |
| 09/21/2005 | CN1671273A Device with through-hole interconnection and method for manufacturing the same |
| 09/21/2005 | CN1671272A 加热装置 Heating device |
| 09/21/2005 | CN1671271A Resin distributing device |
| 09/21/2005 | CN1671270A Method of manufacturing tape wiring substrate |
| 09/21/2005 | CN1671269A Circuit module |
| 09/21/2005 | CN1671268A Flexible substrate, multilayer flexible substrate and process for producing the same |
| 09/21/2005 | CN1670936A Semiconductor device |
| 09/21/2005 | CN1670934A Screen-printing metal mask plate and method of resin-sealing vibration part |
| 09/21/2005 | CN1670910A Circuit device and manufacturing method thereof |
| 09/21/2005 | CN1670578A Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatus |
| 09/21/2005 | CN1670117A 抛光组合物及抛光方法 Polishing composition and polishing method |
| 09/21/2005 | CN1670107A Flame retardant adhesive composition, and adhesive sheet, coverlay film and flexible copper-clad laminate using same |
| 09/21/2005 | CN1669788A Metallized polyimide film |
| 09/21/2005 | CN1669787A Metallized polyimide film |
| 09/21/2005 | CN1220417C Connecting structure of circuit base plate or flat antenna |
| 09/21/2005 | CN1220415C Method for fabricating multiplayer circuit boards |
| 09/21/2005 | CN1220414C Method for installing electronic components in electronic device |
| 09/21/2005 | CN1220413C Printed circuit board with welding trace and circuit module with printed circuit board |
| 09/21/2005 | CN1220412C Interlayer arrangement structure for multilayer circuit board |
| 09/21/2005 | CN1220260C Semiconductor device and making method, and printing mask |
| 09/21/2005 | CN1220116C Device for measuring relative position error |
| 09/21/2005 | CN1220067C Apparatus for scanning-testing printed circuit board |
| 09/21/2005 | CN1219647C Circuit board connector, integrated circuit chip and ink cartridge with the chip |
| 09/21/2005 | CN1219637C Metal-foil laminate and producing method thereof, and method for mounting circuit baseboard by same |
| 09/20/2005 | US6947295 Ball grid array package with an electromagnetic shield connected directly to a printed circuit board |
| 09/20/2005 | US6947293 Method and apparatus for providing power to a microprocessor with integrated thermal and EMI management |
| 09/20/2005 | US6947276 Process for producing laminated ceramic capacitor |
| 09/20/2005 | US6947258 UV curable and electrically conductive adhesive for bonding magnetic disk drive components |
| 09/20/2005 | US6947090 Microminiature image pickup device |
| 09/20/2005 | US6947005 Low cost antennas and electromagnetic (EMF) absorption in electronic circuit packages or transceivers using conductive loaded resin-based materials |
| 09/20/2005 | US6946926 Wired transmission path with plural equidistant differential conductors |
| 09/20/2005 | US6946922 Crystal oscillation device and electronic device using the same |
| 09/20/2005 | US6946789 EL sheet with bent leg connectors |
| 09/20/2005 | US6946743 Flexibility enhanced integrated circuit carrier |
| 09/20/2005 | US6946738 Semiconductor packaging substrate and method of producing the same |
| 09/20/2005 | US6946737 Robust interlocking via |
| 09/20/2005 | US6946733 Ball grid array package having testing capability after mounting |
| 09/20/2005 | US6946732 Stabilizers for flip-chip type semiconductor devices and semiconductor device components and assemblies including the same |
| 09/20/2005 | US6946724 By forming constricted parts at the separation grooves, the adhesion of the conductive patterns with the insulating resin that fills the separation grooves can be improved |
| 09/20/2005 | US6946601 Electronic package with passive components |
| 09/20/2005 | US6946392 Filling plugs through chemical mechanical polish |
| 09/20/2005 | US6946329 Methods of making and using a floating interposer |
| 09/20/2005 | US6946324 Process for fabricating a leadless plastic chip carrier |
| 09/20/2005 | US6946205 Wiring transfer sheet and method for producing the same, and wiring board and method for producing the same |
| 09/20/2005 | US6946091 Laser drilling |
| 09/20/2005 | US6946065 cathodic polarization; vapor deposition; bottom-up filling of trenches/vias within sidewalls to avoid production of seams/voids; for production of integrated circuits |
| 09/20/2005 | US6946035 Dirt removed by irradiating the substrate with ultraviolet rays in an oxygen-containing atmosphere in advance of wet cleaning with pure water; wet cleaning time and the amount of pure water can be reduced; liquid crystal device glass substrates |
| 09/20/2005 | US6946027 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates |
| 09/20/2005 | US6945799 Electrical connector assembly with readily removable pick up cap |
| 09/20/2005 | US6945789 Display module |
| 09/20/2005 | US6945786 Solderless method for transferring high frequency, radio frequency signals between printed circuit boards |
| 09/20/2005 | US6945707 Three-dimensional mounted assembly and optical transmission device |
| 09/20/2005 | US6945466 PC adapter cards and method of manufacturing the same |
| 09/20/2005 | US6945447 Thermal solder writing eutectic bonding process and apparatus |
| 09/20/2005 | US6945406 Tape carrier package film |
| 09/20/2005 | US6945167 Screen printing apparatus and screen printing method |
| 09/20/2005 | US6945151 Integrated circuit package separators |
| 09/20/2005 | US6944946 Porous power and ground planes for reduced PCB delamination and better reliability |
| 09/20/2005 | US6944945 multilayered circuit boards having capacity for increased chip and other component attachment and further characterized by increased circuit density; formed by new sequential build procedures |
| 09/20/2005 | CA2160242C Three dimensional package for monolithic microwave/millimeterwave integrated circuits |