Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2005
11/16/2005CN1696775A LCD device having external terminals
11/16/2005CN1696709A 接触探针 The touch probe
11/16/2005CN1696671A Apparatus and method for detecting defect and apparatus and method for extracting wire area
11/16/2005CN1696231A Interface adhesive compsn. and rework prepn.
11/16/2005CN1695865A Removing useless solder and device for removing the same
11/16/2005CN1227957C Method for manufacturing circuit device and circuit device
11/16/2005CN1227735C Installation structure of semi-conductor apparatus, electro-optical apparatus and electronic apparatus
11/16/2005CN1227727C Mfg. appts. of electronic device, its mfg. method
11/16/2005CN1227726C Mfg. appts. of electronic device, mfg. method of electronic device
11/16/2005CN1227725C Noise shielded multi-layer substrates and manufacture thereof
11/16/2005CN1227293C Aromatic liquid crystal polyester liquid composite
11/15/2005US6965552 Mounting method for optical device and optical head equipment
11/15/2005US6965517 Component substrate for a printed circuit board and method of assembyling the substrate and the circuit board
11/15/2005US6965499 Head suspension configured for improved thermal performance during solder ball bonding to head slider
11/15/2005US6965170 High wireability microvia substrate
11/15/2005US6965169 Hybrid integrated circuit package substrate
11/15/2005US6965162 Semiconductor chip mounting substrate and semiconductor device using it
11/15/2005US6965161 Ceramic multilayer substrate and method for manufacturing the same
11/15/2005US6965158 Multi-layer substrates and fabrication processes
11/15/2005US6964918 Electronic components such as thin array plastic packages and process for fabricating same
11/15/2005US6964887 Method for manufacturing semiconductor device
11/15/2005US6964885 Stress resistant land grid array (LGA) module and method of forming the same
11/15/2005US6964884 Circuitized substrates utilizing three smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same
11/15/2005US6964813 Ultraviolet curable resin composition and photo solder resist including the same
11/15/2005US6964749 Three-dimensional nonwoven substrate for circuit board
11/15/2005US6964575 Sealed electronic module with seal-in-place connector header
11/15/2005US6964093 System for mounting electronic device
11/15/2005CA2279197C High temperature release films
11/15/2005CA2136361C Process for structuring polymer films
11/10/2005WO2005107350A1 Multi-layer printed circuit board
11/10/2005WO2005107349A1 Multilayer printed circuit board and method for the production thereof
11/10/2005WO2005107348A1 Method for producing transverse connections in printed circuit board sets
11/10/2005WO2005107347A1 Conductive member for non-contact data carrier and manufacturing method and device thereof
11/10/2005WO2005107346A1 Component placement substrate and production method thereof
11/10/2005WO2005107344A1 Multilayer printed circuit board
11/10/2005WO2005107343A1 Printed wiring board and method for mounting component on the printed wiring board
11/10/2005WO2005107342A1 Method for the production of circuit boards and/or corresponding constructs
11/10/2005WO2005106973A1 Wiring board for light emitting element
11/10/2005WO2005105633A1 Anisotropic conductive film holding tape and mounting method
11/10/2005WO2005105401A1 Mold made of amorphous fluorine resin and fabrication method thereof
11/10/2005WO2005076319A3 Semiconductor component comprising a semiconductor chip stack on a wiring frame and method for producing the same
11/10/2005WO2005069354A3 Advanced packaging shell for pocketable consumer electronic devices
11/10/2005WO2005066616A3 Biosensor and method of making
11/10/2005WO2005059057A3 Additives to stop copper attack by alkaline etching agents such as ammonia and monoethanol amine (mea)
11/10/2005WO2005041890A3 Erysipelothrix rhusiopathiae-haemophilus parasuis vaccine and methods of using the same
11/10/2005US20050251777 Method and structure for implementing enhanced electronic packaging and PCB layout with diagonal vias
11/10/2005US20050250387 Grouped element transmission channel link termination assemblies
11/10/2005US20050250379 Hole adapter for a printed circuit board
11/10/2005US20050250333 Method and composition to minimize dishing
11/10/2005US20050250310 Multi-layer interconnection circuit module and manufacturing method thereof
11/10/2005US20050250303 Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive
11/10/2005US20050250249 Method of making an electronic package
11/10/2005US20050250247 Method for internal electrical insulation of a substrate for a power semiconductor module
11/10/2005US20050249967 Tin plating method
11/10/2005US20050249933 Method of manufacturing clad board for forming circuitry, clad board and core board for clad board
11/10/2005US20050249927 Copper foil for high-density ultra-fine printed wiring board
11/10/2005US20050249479 System and method for determining signal coupling coefficients for vias
11/10/2005US20050248927 Electronic component with shielding case and method of manufacturing the same
11/10/2005US20050248926 SDIO memory and interface card
11/10/2005US20050248900 Amalgam of shielding and shielded energy pathways and other elements for single or multiple circuitries with common reference node
11/10/2005US20050248885 Suspension board with circuit
11/10/2005US20050248709 Flexible printed circuit film and liquid crystal display device including the same
11/10/2005US20050248617 Methods for forming and protecting electrical interconnects and resultant assemblies
11/10/2005US20050248418 Multi-band RF transceiver with passive reuse in organic substrates
11/10/2005US20050248040 Semiconductor device power interconnect striping
11/10/2005US20050248039 Semiconductor device
11/10/2005US20050248031 Mounting with auxiliary bumps
11/10/2005US20050248020 Lead-free solder ball
11/10/2005US20050248010 Semiconductor package and system module
11/10/2005US20050248001 Method for producing a conductor path on a substrate, and a component having a conductor path fabricated in accordance with such a method
11/10/2005US20050247916 Compositions for use in electronics devices
11/10/2005US20050247894 Systems and methods for forming apertures in microfeature workpieces
11/10/2005US20050247796 Memory-card type USB mass storage device
11/10/2005US20050247761 Surface mount attachment of components
11/10/2005US20050247760 Method for securing electronic components to a substrate
11/10/2005US20050247759 Methods for manufacturing optical modules using lead frame connectors
11/10/2005US20050247665 Method of manufacturing an electronic parts packaging structure
11/10/2005US20050247482 Wiring base board, method of producing thereof, and electronic device
11/10/2005US20050247481 Circuit board with quality-indicator mark and method for indicating quality of the circuit board
11/10/2005US20050246892 Fabrication method for printed circuit board
11/10/2005US20050246891 Multilayer wiring board, manufacturing method therefor and test apparatus thereof
11/10/2005US20050246879 Method and apparatus of recycling printed circuit board
11/10/2005DE10356659B3 Bauelement und Schaltungsmodul Component and circuit module
11/10/2005DE102005007841A1 Leiterplattenkomponenten-UmgebungsfeuchtigkeitsaussetzungsÜberwachung PCB component ambient humidity exposure monitoring
11/10/2005DE102004046251A1 Verfahren zur biegenden Herstellung eines Geräts der Leistungselektronik A process for producing a bending of the power electronics unit
11/10/2005DE102004019447A1 Vorrichtung, insbesondere intelligentes Leistungsmodul, mit planarer Verbindungstechnik Device, especially intelligent power module, with planar connection technology
11/10/2005DE102004019431A1 Hybrider Leiterplattenaufbau zur kompakten Aufbautechnik von elektrischen Bauelementen Hybrid PCB construction for compact design of electrical components
11/10/2005DE102004019161A1 Verfahren und eine Vorrichtung zum Auftragen von mehrkomponentigen Auftragmassen A method and an apparatus for applying plural component coating compositions
11/10/2005DE102004018475A1 Leistungshalbleiteranordnung Power semiconductor device
11/10/2005DE102004012099B3 Making connections between film conductors, e.g. for vehicles, involves ultrasonic welding of laminated or extruded film conductors with simultaneous process control; FFC conductors and FPC circuit parts are combined into F-hybrid circuit
11/10/2005DE10194555B4 System und Verfahren zum Anbringen elektronischer Komponenten auf flexiblen Substraten System and method for mounting electronic components on flexible substrates
11/09/2005EP1594353A1 High frequency multilayer printed wiring board
11/09/2005EP1594352A1 Method for manufacturing double-sided printed circuit board
11/09/2005EP1594351A2 Compositions for use in electronics devices
11/09/2005EP1594350A2 Method for applying parts of an electronic circuit with a printing press
11/09/2005EP1594165A2 Method of electrically insulating a substrate for a power-device
11/09/2005EP1593734A2 Azeotrope-like compositions and their use
11/09/2005EP1593450A1 Electronic device with surface mount components having stand-off space free of solder mask under the component - method for manfacturing the same
11/09/2005EP1593187A1 Wire management system
11/09/2005EP1593163A2 A thin film semiconductor device and method of manufacturing a thin film semiconductor device
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