Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2005
10/20/2005US20050230353 Method and array for processing carrier materials by means of heavy ion radiation and subsequent etching
10/20/2005US20050230259 Process for metallising support media made from plastic material
10/20/2005US20050230148 Strain-resistant electrical connection
10/20/2005US20050230147 Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board
10/20/2005US20050230146 Multilayer printed board, electronic apparatus, and packaging method
10/20/2005US20050230050 Substrate support jig, circuit board production apparatus, and method of producing circuit board
10/20/2005US20050230035 Thin film forming apparatus and thin film forming method
10/20/2005US20050229816 waterborne reactive graded mixed metal Zr:Si sol-gel; stable oxide surface covalently bonded on titanium and aluminum alloy; corrosion resistance, impact resistance over wide temperature range; adhesion; Conversion coating; nontoxic; spraying rather than immersion for easy maintenance
10/20/2005US20050229767 Sheet-cutting apparatus
10/20/2005US20050229393 Methods of forming a contact pin assembly
10/19/2005EP1587351A1 Method and apparatus for manufacturing circuit board
10/19/2005EP1587350A1 Method for metallizing an electric component on a flexible circuit support and flexible circuit support with an electric component metallized thereon
10/19/2005EP1587183A1 An insert-molded article and a production method for insert-molded article
10/19/2005EP1586615A1 Adhesive, adhesive member, interconnecting substrate for semiconductor mounting having adhesive member, and semiconductor device containing the same
10/19/2005EP1586224A2 Cover for ball-grid array connector
10/19/2005EP1586223A1 Electrical connection element, especially for electric tool switches
10/19/2005EP1586222A1 Apparatus and method for controlling registration of print steps in a continuous process for the manufacture of electrochemical sensors
10/19/2005EP1586112A2 Binder diffusion patterning of a thick film paste layer
10/19/2005EP1585614A1 Mixed alloy lead-free solder paste
10/19/2005EP1585604A2 Industrial microdeposition system including masking to reduce the impact of droplet alignment and droplet volume tolerances and errors
10/19/2005EP1415369B1 Batch electrically connecting sheet
10/19/2005EP1224674B1 Process of manufacturing a capacitor component
10/19/2005CN2735722Y 印制电路板安装装置 Printed circuit board mounting device
10/19/2005CN2735713Y Hot plate of printed circuit multi-layer board pressing machine
10/19/2005CN1685776A High-frequency layered part and manufacturing method thereof
10/19/2005CN1685775A Circuit board and process for producing the same
10/19/2005CN1685774A Flexible circuit with electrostatic damage limiting feature
10/19/2005CN1685595A Power converting module device and power unit using it
10/19/2005CN1685508A Electronic module having canopy-type carriers
10/19/2005CN1685507A Method for producing a component comprising a conductor structure that is suitable for use at high frequencies
10/19/2005CN1685491A Joining apparatus
10/19/2005CN1685454A Process for producing laminated ceramic capacitor
10/19/2005CN1684828A Screen printing machine having replaceable ink jet printing unit
10/19/2005CN1684575A Capacitor-embedded substrate
10/19/2005CN1684574A Printed circuit board, parts mounting method and mounting position verifying method
10/19/2005CN1684573A Mounting substrate and mounting method of electronic part
10/19/2005CN1684572A Circuit board assembling method and structure, and tool for assembling said structure
10/19/2005CN1684571A Adhesive system and method for printed circuit board surface
10/19/2005CN1684570A Managing system and method for cleaning printed circuit board
10/19/2005CN1684569A Displacement and repairing method for electronic circuit board
10/19/2005CN1684284A Optical semiconductor device and electronic equipment using same
10/19/2005CN1684206A Paste dispenser and method for controlling the same
10/19/2005CN1684205A Printing method for reducing electrode layer thickness in passive module
10/19/2005CN1683589A Surface contact improver for copper and copper alloy and its usage
10/19/2005CN1683140A An insert-molded article and a production method for insert-molded article
10/19/2005CN1224305C Method for mfg. multilayer circuit board for semiconductor device
10/19/2005CN1224304C Method for mfg. ceramic multilayered board
10/19/2005CN1224303C Installing sheet
10/19/2005CN1224301C High-frequency module
10/19/2005CN1224299C Circuit board
10/19/2005CN1224284C Front module
10/19/2005CN1224137C Electric resistance measuring connector and measuring device and measuring method for circuit board electric resistance
10/19/2005CN1224100C 树脂密封型的半导体装置 The resin sealing type semiconductor device
10/19/2005CN1224059C Coating material for flat electric cable and flat electric cable therewith
10/19/2005CN1223958C Machine for exposing plate to laser radiation
10/19/2005CN1223903C Explosure device for double side printed circuit board
10/19/2005CN1223900C Photo-sensitive conducting resin, conductor pattern forming method and manufacturing method of ceramic laminated structural parts
10/19/2005CN1223702C Plating method of metal film on surface of polymer
10/19/2005CN1223457C Screen printing equipment and method
10/19/2005CN1223456C Screen printing press
10/18/2005US6956635 Liquid crystal device and manufacturing method therefor
10/18/2005US6956303 Electronic control device for controlling electric units of motor vehicle doors which have different equipment
10/18/2005US6956284 Integrated circuit stacking system and method
10/18/2005US6956252 Hybrid integrated circuit device
10/18/2005US6956182 Method of forming an opening or cavity in a substrate for receiving an electronic component
10/18/2005US6956174 Tip structures
10/18/2005US6956173 Wiring board comprising granular magnetic film
10/18/2005US6955982 Flip chip C4 extension structure and process
10/18/2005US6955948 Method of manufacturing a component built-in module
10/18/2005US6955945 Memory expansion and chip scale stacking system and method
10/18/2005US6955943 Method for producing a substrate arrangement
10/18/2005US6955942 Method for manufacturing circuit device
10/18/2005US6955849 Method and structure for small pitch z-axis electrical interconnections
10/18/2005US6955848 Curable composition and multilayered circuit substrate
10/18/2005US6955781 Injection molding method with surface modification
10/18/2005US6955740 Production of laminates for printed wiring boards using protective carrier
10/18/2005US6955739 Method for adhering substrates using ultraviolet activatable adhesive film and an ultraviolet irradiation apparatus
10/18/2005US6955737 Supported greensheet structure and method in MLC processing
10/18/2005US6955553 Non-reciprocal device
10/18/2005US6955449 LED symbol signal
10/18/2005US6955285 Apparatus for aligning and dispensing solder columns in an array
10/18/2005US6955120 Pressure control system for printing a viscous material
10/18/2005US6954987 Method of interconnecting a circuit board to a substrate
10/18/2005US6954986 Method for fabricating electrical connecting element
10/18/2005US6954985 Method for plugging holes in a printed circuit board
10/18/2005US6954984 Land grid array structure
10/18/2005CA2417496C Circuit board protection system and method
10/13/2005WO2005096684A1 Circuit board, circuit board manufacturing method and display apparatus provided with circuit board
10/13/2005WO2005096683A1 Circuit board, its manufacturing method, and joint box using circuit board
10/13/2005WO2005096682A2 Fully-integrated hybrid electrical optical circuit boards
10/13/2005WO2005096458A1 Light beam bonding
10/13/2005WO2005096442A1 Anisotropic conductive film and manufacturing method thereof
10/13/2005WO2005096367A1 Heater, reflow apparatus, and solder bump forming method and apparatus
10/13/2005WO2005096351A2 Fabrication and use of superlattice
10/13/2005WO2005096299A1 Laminate for hdd suspension and process for producing the same
10/13/2005WO2005096188A1 Integrated power supply system ananyzing system, integrated power supply system ananyzing method, and multilayer printed circuit board
10/13/2005WO2005095951A1 Method for evaluating bonding strength of roughened surface of copper foil
10/13/2005WO2005095677A1 Copper foil and its manufacturing method
10/13/2005WO2005095517A1 Thermosetting resin composition and multilayered printed wiring board comprising the same
10/13/2005WO2005095103A1 Process for producing double-sided metal clad laminate and double-sided metal clad laminate produced by the process
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