Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2005
10/06/2005US20050218524 Low moisture absorptive circuitized substrate with reduced thermal expansion, method of making same, electrical assembly utilizing same, and information handling system utilizing same
10/06/2005US20050218517 Semiconductor flip-chip package and method for the fabrication thereof
10/06/2005US20050218516 Sacrificial component
10/06/2005US20050218513 Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus
10/06/2005US20050218511 Mounting structure of ball grid array
10/06/2005US20050218510 Use of palladium in IC manufacturing with conductive polymer bump
10/06/2005US20050218506 Non-magnetic, hermetically-sealed micro device package
10/06/2005US20050218503 Multilayer wiring board, method for producing the same, and method for producing fiber reinforced resin board
10/06/2005US20050218502 Capacitor-mounted wiring board and method of manufacturing the same
10/06/2005US20050218496 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
10/06/2005US20050218491 Circuit component module and method of manufacturing the same
10/06/2005US20050218487 Method for manufacturing wiring substrate and method for manufacturing electronic device
10/06/2005US20050218485 Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same
10/06/2005US20050218480 Device mounting board and semiconductor apparatus using device mounting board
10/06/2005US20050218382 Uphill screen printing in the manufacturing of microelectronic components
10/06/2005US20050218197 Solder heating system
10/06/2005US20050218195 Underfill fluxing curative
10/06/2005US20050218110 Method for manufacturing wiring substrate and method for manufacturing electronic device
10/06/2005US20050218035 Infrared transmissive integrated circuit socket cap
10/06/2005US20050217895 Flexible printed circuits with many tiny holes
10/06/2005US20050217894 Fabrication method and structure of PCB assembly, and tool for assembly thereof
10/06/2005US20050217893 Printed circuit board and manufacturing method thereof
10/06/2005US20050217885 Circuit board for connecting an integrated circuit to a support and ic bga package using same
10/06/2005US20050217757 Preflux, flux, solder paste and method of manufacturing lead-free soldered body
10/06/2005US20050217697 Aqueous stripping and cleaning composition
10/06/2005US20050217643 Electrical connection device for injection devices of internal combustion engines
10/06/2005DE19946753B4 Verfahren zur Erkennung und Vermeidung von ätzkritischen Bereichen Methods for the detection and prevention of ätzkritischen areas
10/06/2005DE19750224B4 Stecker zur Herstellung einer lösbaren elektrischen Verbindung zwischen einem Flachbandkabel und einer Leiterplatte Plug for producing a detachable electrical connection between a ribbon cable and a printed circuit board
10/06/2005DE19611239B4 Leitfähige Paste Conductive paste
10/06/2005DE10334391B4 Verfahren zur Erzeugung von Verbindungen in der Mikroelektronik A process for the production of compounds in microelectronics
10/06/2005DE10297539T5 Verfahren und Vorrichtung zum Verbinden von Leiterplatten für eine Sensoranordnung A method and apparatus for connecting printed circuit boards for a sensor arrangement
10/06/2005DE102005010377A1 Separation of chip components on a wafer uses a weakened wafer layer along the grid of cutting lines, between the chips, to be penetrated by a pulsed laser beam and broken apart along the weakened separation lines
10/06/2005DE102004014034A1 Leiterplatte mit wenigstens einer Anschlußbohrung für einen Anschlußdraht bzw. -Pin eines bedrahteten elektronischen Bauteils Circuit board with at least one connection hole for a lead wire or -Pin a wired electronic component
10/06/2005DE102004013477A1 Trägerplattform für Leistungselektronik-Bauelemente und Modul mit der Trägerplattform Support platform for power electronic components and modules to the support platform
10/06/2005DE102004012672A1 Messfühler Probe
10/06/2005CA2567902A1 Support platform for electrical components, and module comprising said support platform
10/06/2005CA2558862A1 Method and apparatus for venting an electronic control module
10/06/2005CA2553559A1 Flexible circuit board assembly
10/05/2005EP1583407A1 Multilayer printed wiring board with filled viaholes
10/05/2005EP1583406A2 Interconnect assembly for printed circuit boards
10/05/2005EP1583405A2 Circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
10/05/2005EP1583110A2 Securing electrical conductors
10/05/2005EP1583108A1 Dielectric composition for forming dielectric layer for use in circuitized substrates
10/05/2005EP1582967A1 Transparent, electrically conductive, coated polyester film, process for its preparation and its use
10/05/2005EP1582360A2 Thermal head having adhesive interposed between adhesion surface of heat-dissipation plate and adhesion surface of head substrate and method for producing the same
10/05/2005EP1582359A2 Thermal head having adhesive layer partially disposed on heat sink and method for manufacturing such thermal head
10/05/2005EP1582287A1 Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device
10/05/2005EP1582281A1 Solder handling system
10/05/2005EP1582093A2 Improved patching methods and apparatus for fabricating memory modules
10/05/2005EP1581955A1 Electric conductors
10/05/2005EP1581385A2 High temperature resistant films and adhesive articles made therefrom
10/05/2005EP1165250B1 Dispensing assembly
10/05/2005CN2731907Y Multilayer printed circuit board
10/05/2005CN1679379A Controlled depth etched dielectric film
10/05/2005CN1679174A Electrode for photovoltaic cells, photovoltaic cell and photovoltaic module
10/05/2005CN1679163A A packaged semiconductor with coated leads and method therefor
10/05/2005CN1679152A Pattern formation substrate and method of pattern formation
10/05/2005CN1679032A System and method for modifying electronic design data
10/05/2005CN1678961A Removing solution
10/05/2005CN1678452A Resin layer-coated copper foil and multilayered printed wiring board obtained with the resin layer-coated copper foil
10/05/2005CN1678176A Method for manufacture of multilayer ceramic substrate and multilayer ceramic substrate
10/05/2005CN1678175A Circuit component module and method of manufacturing the same
10/05/2005CN1678174A Multilayer ceramic substrate and method for manufacture thereof
10/05/2005CN1678173A Circuit substrate and method for mounting electronic element
10/05/2005CN1678172A Circuit board component ambient moisture exposure monitoring
10/05/2005CN1678171A Method for making circuit substrate
10/05/2005CN1678170A Method of manufacturing substrate having resist film
10/05/2005CN1678169A 印制线路板及其制造方法 A printed wiring board and its manufacturing method
10/05/2005CN1678168A Circuit board, electronic device and mfg. method thereof
10/05/2005CN1678167A Multi-layer circuit board and mfg. method
10/05/2005CN1678166A Flexible copper-coated laminated board and mfg. method
10/05/2005CN1678165A Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip
10/05/2005CN1678141A Flat display device
10/05/2005CN1677667A Hybrid integrated circuit device and method of manufacturing the same
10/05/2005CN1677665A 电路装置及其制造方法 Circuit device and manufacturing method thereof
10/05/2005CN1677660A Semiconductor apparatus, manufacturing method thereof, semiconductor module apparatus using semiconductor apparatus, and wire substrate for semiconductor apparatus
10/05/2005CN1677657A Semiconductor device and manufacturing method for the same
10/05/2005CN1677652A Vice mounting board and semiconductor apparatus using device mounting board
10/05/2005CN1677651A Device mounting board
10/05/2005CN1677552A Insulation sheet and disk device provided with the same
10/05/2005CN1677118A 印刷电路板检查装置 A printed circuit board inspection apparatus
10/05/2005CN1677096A 印刷电路板检查装置 A printed circuit board inspection apparatus
10/05/2005CN1677095A Automatic optical detection system of membrane type or belt type printed circuit board and processing method thereof
10/05/2005CN1676428A Manufacturing method for electronic or electric products such as flat-panel display devices and band-shaped package therefor
10/05/2005CN1676342A Thermal head and method for manufacturing such thermal head
10/05/2005CN1676341A Thermal head and method for manufacturing such thermal head
10/05/2005CN1676322A A method of manufacturing laminated material for security tags
10/05/2005CN1676260A Solder handling system
10/05/2005CN1676259A Welding method and circuit board using same
10/05/2005CN1222206C Packaging structure having good assembling operation property
10/05/2005CN1222203C Copper plated circuit layer carrying copper clad laminated sheet and method of producing printed wiring board using the copper plated circuit layer carrying copper clad laminated sheet
10/05/2005CN1222202C Local welding method for printed substrate and apparatus thereof
10/05/2005CN1222201C Method for producing wire with rough conducting structures and at least one area with fine conducting structures
10/05/2005CN1222200C Circuit micro assembly
10/05/2005CN1222198C Printed circuit board with testing point formed at side
10/05/2005CN1222085C Connector and contact wafer
10/05/2005CN1222074C Process for securing microwave module to support
10/05/2005CN1222059C Connector for button battery contained in electronic device
10/05/2005CN1222042C Metal inter-connector and active matrix bottom therewith
10/05/2005CN1222026C Device and method for forming bump
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