| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/22/2005 | WO2005088737A1 Metal base circuit substrate for an optical device and method manufacturing the aforementioned substrate |
| 09/22/2005 | WO2005088736A1 Production method of circuit board for light emitting body, precursor of circuit board for light emitting body, circuit board for light emitting body, and light emitting body |
| 09/22/2005 | WO2005088730A2 Method for forming a structure |
| 09/22/2005 | WO2005088711A1 Driver module structure |
| 09/22/2005 | WO2005088706A1 Semiconductor package with perforated substrate |
| 09/22/2005 | WO2005088529A1 Flat transponder and method for the production thereof |
| 09/22/2005 | WO2005088526A1 Production process of inlet for electronic tag |
| 09/22/2005 | WO2005088191A1 Socket device |
| 09/22/2005 | WO2005087980A2 Semiconductor device, method for manufacturing the same and a wiring substrate |
| 09/22/2005 | WO2005087979A2 A method and a device for deposition of a metal layer on a non-conducting surface of a substrate |
| 09/22/2005 | WO2005087888A1 Heat-peelable pressure-sensitive adhesive sheet and method of processing adherend with the heat-peelable pressure-sensitive adhesive sheet |
| 09/22/2005 | WO2005087497A2 3d-ink jet structuring of highly topographic surfaces |
| 09/22/2005 | WO2005087489A1 Carrier foil-attached electrolytic copper foil proviuded with insulation layer forming resin layer, copper-clad laminated sheet, printed circuit board, production method for multilayer copper-clad laminated sheet and production method for printed circuit board |
| 09/22/2005 | WO2005087480A1 Novel polyimide film and use thereof |
| 09/22/2005 | WO2005087430A1 Method of semi-conductor device assembly including fatigue-resistant ternary solder alloy |
| 09/22/2005 | WO2005086978A2 Embedded power management control circuit |
| 09/22/2005 | WO2005072030A3 Providing differentiated levels of solder paste for a circuit paste for a circuit board |
| 09/22/2005 | WO2005067092B1 Triangular conforming transmission structure |
| 09/22/2005 | WO2005066392A3 Surface structuring by means of a film |
| 09/22/2005 | WO2005048663A3 Improved methods of cleaning copper surfaces in the manufacture of printed circuit boards |
| 09/22/2005 | WO2003073805A3 Improved patching methods and apparatus for fabricating memory modules |
| 09/22/2005 | US20050209822 Inspection method and system and production method of mounted substrate |
| 09/22/2005 | US20050209117 (Electro)chemical deposition of copper, nickel, zinc or gold; electrolytic cleaning of soft steels; solution of carboxymethylated polyethyleneimine sodium salt, dispersants, inorganic transition metal compound, inorganic acid or base, and metal oxide or salt; improved corrosion resistance; nontoxic |
| 09/22/2005 | US20050208914 High frequency circuit block unit, method for producing same, high frequency module device and method for producing same |
| 09/22/2005 | US20050208792 Bending tool for flexible printed circuit assemblies |
| 09/22/2005 | US20050208789 Printed wiring board, method of manufacturing the printed wiring board, lead frame package, and optical module |
| 09/22/2005 | US20050208751 Solder bump structure and method for forming a solder bump |
| 09/22/2005 | US20050208749 Methods for forming electrical connections and resulting devices |
| 09/22/2005 | US20050208709 Screen-printing metal mask plate and method of resin-sealing vibrating part |
| 09/22/2005 | US20050208708 Adhesive assembly for a circuit board |
| 09/22/2005 | US20050208706 Method of creating multi-layered monolithic circuit structure containing integral buried and trimmed components |
| 09/22/2005 | US20050208705 Semiconductor device package and method of production and semiconductor device of same |
| 09/22/2005 | US20050208704 Methods including fabrication of substrates and other semiconductor device components with collars on or around the contact pads thereof |
| 09/22/2005 | US20050208433 Pattern forming method, circuit substrate and electronic apparatus |
| 09/22/2005 | US20050208428 Surface graft material, conductive pattern material, and production method thereof |
| 09/22/2005 | US20050208293 Printed circuits; semiconductors |
| 09/22/2005 | US20050208280 Microelectronic device interconnects |
| 09/22/2005 | US20050208278 Laminating copper foil, adhesion promoting elastomer and curing agent, and circuit substrate material to form low dielectric constant, low dissipation factor circuit material; enhancing adhesion |
| 09/22/2005 | US20050208251 Low cost electrically conductive tapes and films manufactured from conductive loaded resin-based materials |
| 09/22/2005 | US20050208227 Flexible circuit of a dielectric substrate, and a conductive layer; a conformal coating on a surface of a conjugated polypyrrole polymer, pyrrolidones, and perfluorinated organic compounds |
| 09/22/2005 | US20050207930 Compound for forming wiring conductor, fabrication method of circuit board using the same and circuit board |
| 09/22/2005 | US20050207133 Embedded power management control circuit |
| 09/22/2005 | US20050207132 Printed circuit board with electromagnetic interference (EMI) radiation suppressed |
| 09/22/2005 | US20050207114 Method and apparatus for venting an electronic control module |
| 09/22/2005 | US20050207091 Intermediate substrate |
| 09/22/2005 | US20050206898 Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device |
| 09/22/2005 | US20050206677 High nozzle density inkjet printhead |
| 09/22/2005 | US20050206467 Microstrip line |
| 09/22/2005 | US20050206357 Cooled power switching device |
| 09/22/2005 | US20050206047 Contoured circuit boards |
| 09/22/2005 | US20050206011 Circuit module |
| 09/22/2005 | US20050206009 Method for manufacturing wiring board and semiconductor device |
| 09/22/2005 | US20050205999 Method for pattern metalization of substrates |
| 09/22/2005 | US20050205997 Device with through-hole interconnection and method for manufacturing the same |
| 09/22/2005 | US20050205996 Semiconductor apparatus |
| 09/22/2005 | US20050205994 Signal transmitting device with vias and solder balls |
| 09/22/2005 | US20050205976 Circuit device and manufacturing method thereof |
| 09/22/2005 | US20050205972 COF flexible printed wiring board and semiconductor device |
| 09/22/2005 | US20050205970 [package with stacked substrates] |
| 09/22/2005 | US20050205778 Laser trim motion, calibration, imaging, and fixturing techniques |
| 09/22/2005 | US20050205712 Low cost magnetic brakes and motion control devices manufactured from conductive loaded resin-based materials |
| 09/22/2005 | US20050205642 PCB manufacturing system |
| 09/22/2005 | US20050205551 Low cost heated clothing manufactured from conductive loaded resin-based materials |
| 09/22/2005 | US20050205524 Method of manufacturing tape wiring substrate |
| 09/22/2005 | US20050205516 Wiring board and process for producing the same |
| 09/22/2005 | US20050205429 Electroplating cell with hydrodynamics facilitating more uniform deposition across a workpiece during plating |
| 09/22/2005 | US20050205407 Multi-shot molded touch switch |
| 09/22/2005 | US20050205297 Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus |
| 09/22/2005 | US20050205296 Panel for electro-optical apparatus, method of manufacture thereof, electro-optical apparatus and electronic apparatus |
| 09/22/2005 | US20050205294 Flexible substrate, Multilayer flexible substrate and process for producing the same |
| 09/22/2005 | US20050205293 Substrate |
| 09/22/2005 | US20050205292 Circuit and method for broadband switching noise suppression in multilayer printed circuit boards using localized lattice structures |
| 09/22/2005 | US20050205291 Flexible substrate having interlaminar junctions, and process for producing the same |
| 09/22/2005 | US20050205282 Electronic component mounting structure onto board |
| 09/22/2005 | US20050205201 Method of attaching optical waveguide component to printed circuit board |
| 09/22/2005 | US20050205196 Screen printing a predetermined thick film pattern onto a fused silica glass substrate to form constraint layers, boring holes and filling with a conductive paste, hydrostatic pressing, firing to obtain a low temperature co-firable ceramic; high density packaging for high frequency and microwave circuits |
| 09/22/2005 | US20050205195 Method of forming one or more base structures on an LTCC cofired module |
| 09/22/2005 | US20050204956 Writable and printable colloidal gold solution |
| 09/22/2005 | US20050204638 Polishing composition and polishing method |
| 09/22/2005 | US20050204553 Device and method for conveying and holding plate-like member |
| 09/22/2005 | US20050204550 Board through-hole working method |
| 09/22/2005 | DE4324210B4 Kühlanordnung für elektronische Leistungsbauelemente Cooling arrangement for electronic power devices |
| 09/22/2005 | DE202005011141U1 Galvanic bath with electrolyte injector for surface treatment of suspended workpieces with guide plates, upper lower, and side plates and anode plates useful in electrodeposition of metals |
| 09/22/2005 | DE202005010815U1 Arrangement for contacting molded parts and circuit boards e.g. for hardware modules, has conductor path structure containing points of contact on molded parts |
| 09/22/2005 | DE19847913B4 Vorrichtung und Verfahren zur optischen Inspektion insbesondere verdeckter Lötverbindungen Apparatus and method for optically inspecting particular hidden solder joints |
| 09/22/2005 | DE19838532B4 Verfahren und Vorrichtung zum Plazieren und Umschmelzen von Lotmaterialformstücken A method and apparatus for placing and remelting formed solder material |
| 09/22/2005 | DE19709687B4 Elektrisches oder elektronisches Gerät und Leiterplatte für ein solches Gerät Electrical or electronic device and printed circuit board for such a device |
| 09/22/2005 | DE19605255B4 Verfahren und Vorrichtung zum Betrachten von Beschaltungs- bzw. Verdrahtungsmustern in einer gedruckten Schaltungsplatte Method and apparatus for viewing Wiring and wiring patterns in a printed circuit board |
| 09/22/2005 | DE10337280B4 Vorrichtung und Verfahren zum Analysieren des Oberflächenzustands einer gedruckten Schaltkarte unter Verwendung von RGB-Farben Apparatus and method for analyzing the surface condition of a printed circuit board using RGB colors |
| 09/22/2005 | DE10221532B4 Automatisierte Werkzeugmaschine Automated machine tool |
| 09/22/2005 | DE102004053557A1 Verfahren und Vorrichtungen zum Drucken leitfähiger Dickfilme über Dickfilmdielektrika Methods and apparatus for printing conductive thick films on Dickfilmdielektrika |
| 09/22/2005 | DE102004011567A1 Haftfester Verbund und Verfahren zur Herstellung Solid adhesive composite and method for producing |
| 09/22/2005 | DE102004010703A1 Bauelement mit WLP-fähiger Verkapselung und Herstellverfahren Component with WLP-efficient encapsulation and manufacturing |
| 09/22/2005 | DE102004009825A1 Leiterplatte Circuit board |
| 09/22/2005 | DE10103390B4 Verfahren und System zum Herstellen einer im Wesentlichen ringförmigen Lotverbindung A method and system for producing a substantially annular solder joint |
| 09/21/2005 | EP1578186A2 Inspection method and system and production method of mounted substrate |
| 09/21/2005 | EP1578178A1 Flexible substrate, multilayer flexible substrate and process for producing the same |
| 09/21/2005 | EP1578003A1 Electric machine with a device for connecting coil ends |
| 09/21/2005 | EP1577979A1 Board through hole working method |
| 09/21/2005 | EP1577944A1 Semiconductor device and method for production thereof |