Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2005
10/27/2005WO2005101935A1 Connection structure of inner conductor and multilayer substrate
10/27/2005WO2005101934A1 Composite electronic component and method for producing the same
10/27/2005WO2005101933A1 Arrangement with a contact element
10/27/2005WO2005101932A1 Method for reflow soldering
10/27/2005WO2005101931A1 Surface mounted component mounting structure
10/27/2005WO2005101930A1 Method for printing electrical and/or electronic structures and film for use in such a method
10/27/2005WO2005101929A1 Printed circuit board including track gap-filled resin and fabricating method thereof
10/27/2005WO2005101928A1 Hybrid printed circuit board assembly system for the compact assembly of electric components
10/27/2005WO2005101503A2 Device, in particular intelligent power module with planar connection
10/27/2005WO2005101501A1 Housing formed by a metallic layer
10/27/2005WO2005101496A2 Method for structured application of a laminatable film to a substrate for a semiconductor module
10/27/2005WO2005101495A1 Flexible printed circuit board for mounting semiconductor chip
10/27/2005WO2005101493A2 Improved bonding arrangement and method for ltcc circuitry
10/27/2005WO2005101458A2 Method and use of a device for applying coatings onto band-shaped structures during the production of semiconductor components
10/27/2005WO2005101183A1 Interchangeable graphics card for a computing device
10/27/2005WO2005101123A1 Photosensitive resin composition and photoresist film
10/27/2005WO2005100638A1 Etching method and etching liquid
10/27/2005WO2005100448A1 Resin curable with actinic energy ray, photocurable/thermosetting resin composition containing the same, and cured article obtained therefrom
10/27/2005WO2005100220A1 Coverlay film laminating device
10/27/2005WO2005099979A1 Apparatus for cutting nonmetal
10/27/2005WO2005099961A1 Lead-free, bismuth-free solder alloy powders and pastes and methods of production thereof
10/27/2005WO2005099939A1 Silver powder coated with silver compound and manufacturing method thereof
10/27/2005WO2005088730A3 Method for forming a structure
10/27/2005WO2005082034A3 An interconnect structure and method for connecting buried signal lines to electrical devices
10/27/2005WO2005059993A3 Packaging substrates for integrated circuits and soldering methods
10/27/2005WO2005056734A3 Electronic component
10/27/2005WO2005025001A8 Embedded rf vertical interconnect for flexible conformal antenna
10/27/2005US20050240888 Multiple propagation speeds of signals in layered circuit apparatus
10/27/2005US20050240020 Functional fluorescent dyes
10/27/2005US20050239347 Structure for repairing or modifying surface connections on circuit boards
10/27/2005US20050239342 Light emitting module
10/27/2005US20050239329 Systems and methods for connecting electrical components
10/27/2005US20050239301 Repairable ball grid array contact
10/27/2005US20050239295 Chemical treatment of material surfaces
10/27/2005US20050239237 Method for producing a BGA chip module and BGA chip module
10/27/2005US20050239236 Printed circuit board and fabrication method thereof
10/27/2005US20050239233 Recording head unit and method of producing the same
10/27/2005US20050239229 Method of connecting wiring member
10/27/2005US20050238969 Methods for producing pattern-forming body
10/27/2005US20050238906 Immersion plating and plated structures
10/27/2005US20050238889 Layered components, materials, methods of production and uses thereof
10/27/2005US20050238878 Device mounting board
10/27/2005US20050238811 Composition and method for preparing chemically-resistant roughened copper surfaces for bonding to substrates
10/27/2005US20050238278 Material for substrate mounting optical circuit-electric circuit mixedly and substrate mounting optical circuit-electric circuit mixedly
10/27/2005US20050237776 System and method for patient controlled communication of DICOM protected health information
10/27/2005US20050237760 Vehicular lamp
10/27/2005US20050237445 Display cell, in particular liquid crystal, or photovoltaic cell comprising means for connection to an electronic control circuit
10/27/2005US20050237365 Electric device where actuator unit and printed wiring board are connected using bonding parts
10/27/2005US20050237364 Printed wiring board and electric device using the same
10/27/2005US20050237136 Electronic circuit board having microstrip lines
10/27/2005US20050237077 Method for testing using a universal wafer carrier for wafer level die burn-in
10/27/2005US20050237076 Method for testing using a universal wafer carrier for wafer level die burn-in
10/27/2005US20050237075 Method for testing using a universal wafer carrier for wafer level die burn-in
10/27/2005US20050236739 Step and flash imprint lithography
10/27/2005US20050236719 IC module assembly
10/27/2005US20050236718 Printed circuit board
10/27/2005US20050236706 Semiconductor device and hybrid integrated circuit device
10/27/2005US20050236378 Program-controlled dicing of a substrate using a pulsed laser
10/27/2005US20050236361 Biomedical electrochemical sensor array and method of fabrication
10/27/2005US20050236359 Copper/copper alloy surface bonding promotor and its usage
10/27/2005US20050236275 Method of using an etchant solution for removing a thin metallic layer
10/27/2005US20050236182 Board for printed wiring, printed wiring board, and method for manufacturing them
10/27/2005US20050236180 Laminate ceramic circuit board and process therefor
10/27/2005US20050236179 Circuit board device and method for board-to-board connection
10/27/2005US20050236178 Fusion bonded assembly with attached leads
10/27/2005US20050236177 Multilayer printed wiring board
10/27/2005US20050236176 Circuit board with identifiable information and method for fabricating the same
10/27/2005US20050235869 Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair
10/27/2005US20050235789 Method and related apparatus for cutting a product from a sheet material
10/27/2005US20050235777 Method for forming fine structure of a group of metal fine particles
10/27/2005US20050235490 Printed circuit board defective area transplant repair method
10/27/2005US20050235488 Selective area solder placement
10/27/2005DE202005011948U1 Electronic component facility for manufacturing electronic subassemblies and/or printed circuit boards uses a programmable device to position a boring head for chips
10/27/2005DE10393395T5 Schaltungsmaterialien, Schaltungen, mehrschichtige Schaltungen und Herstellungsverfahren davon Circuit materials, circuits, multilayer circuits and manufacturing method thereof
10/27/2005DE102005016538A1 Laserbearbeitungsvorrichtung für ein plattenförmiges Werkstück A laser machining apparatus for a plate-shaped workpiece
10/27/2005DE102005013270A1 Schaltungsplatine zum Verbinden einer integrierten Schaltung mit einem Träger und einem IC-BGA-Gehäuse, das dieselbe verwendet Circuit board for connecting an integrated circuit having a substrate and an IC BGA package, using the same
10/27/2005DE102004016205A1 Leiterplatte sowie Verfahren zum Herstellen einer solchen Printed circuit board as well as methods for producing such
10/27/2005DE102004015837A1 Elektrische Verbindungseinrichtung für Einspritzeinrichtungen von Verbrennungsmotoren Electrical connecting device for injectors of internal combustion engines
10/26/2005EP1589799A1 Multi-layer ceramic substrate and method for manufacture thereof
10/26/2005EP1589798A1 Multilayer printed board, electronic apparatus, and packaging method
10/26/2005EP1589797A2 Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein
10/26/2005EP1589796A1 Member for circuit board, method for manufacturing circuit board, apparatus for manufacturing circuit board
10/26/2005EP1589795A1 Laminate ceramic circuit board and process therefor
10/26/2005EP1589618A1 Electronic device with a contact pin and method for producing such a device
10/26/2005EP1589614A1 Strain-resistant electrical connection
10/26/2005EP1589581A1 Wiring substrate and radiation detector using same
10/26/2005EP1589570A1 Semiconductor device and process for producing the same
10/26/2005EP1589547A1 Capacitor unit
10/26/2005EP1589540A1 Conductive paste, method for producing same, circuit board using such conductive paste and method for producing same
10/26/2005EP1589376A1 Conductive pattern forming method, and conductive pattern material
10/26/2005EP1588596A2 Circuit board stiffener
10/26/2005EP1588594A2 Circuit board standoff
10/26/2005EP1588419A2 Circuit board threadplate
10/26/2005EP1588407A2 Area array package with non-electrically connected solder balls
10/26/2005EP1587892A1 Thermally-formable and cross-linkable precursor of a thermally conductive material
10/26/2005EP1587728A1 Stanchion with an integrated device for securing a load, in particular for tarpaulin-covered transport vehicles
10/26/2005EP1587709A2 Seat buckle sensor
10/26/2005EP1587677A1 Poly(phenylene ether)-polyvinyl thermosetting adhesives, films, and substrates made therefrom
10/26/2005EP1383844B1 A thermosetting adhesive film, and an adhesive structure based on the use thereof
10/26/2005EP1275036B1 Abbe error correction system and method
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