| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/06/2005 | US6972392 Laser beam machining method for wiring board, laser beam machining apparatus for wiring board, and carbonic acid gas laser oscillator for machining wiring board |
| 12/06/2005 | US6972391 Laser trimming of annular passive components |
| 12/06/2005 | US6972383 Multilayered circuit board |
| 12/06/2005 | US6972382 Inverted microvia structure and method of manufacture |
| 12/06/2005 | US6972381 Semiconductor device and method of manufacture thereof, circuit board and electronic instrument |
| 12/06/2005 | US6972380 Printed wiring board having impedance-matched differential pair signal traces |
| 12/06/2005 | US6972379 Circuit board and a method for making the same |
| 12/06/2005 | US6972371 Potting crack shield and related method |
| 12/06/2005 | US6972268 Methods and systems for processing a device, methods and systems for modeling same and the device |
| 12/06/2005 | US6972257 Conductive material patterning methods |
| 12/06/2005 | US6972256 Method and apparatus for forming thin film of metal |
| 12/06/2005 | US6972249 Use of nitrides for flip-chip encapsulation |
| 12/06/2005 | US6972207 Method of manufacturing annular oblique light illumination apparatus and flexible wiring substrate |
| 12/06/2005 | US6972152 Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same |
| 12/06/2005 | US6972081 Fabrication of embedded vertical spiral inductor for multichip module (MCM) package |
| 12/06/2005 | US6972070 Method of manufacturing a printed wiring board |
| 12/06/2005 | US6971889 Electrical connector with continuous strip contacts |
| 12/06/2005 | US6971742 Slurried suspension ejector and related systems and methods of forming same |
| 12/06/2005 | US6971571 Reflow soldering apparatus and reflow soldering method |
| 12/06/2005 | US6971429 Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board |
| 12/06/2005 | US6971167 Multilayered circuit board forming method and multilayered circuit board |
| 12/01/2005 | WO2005115072A2 Support with solder globule elements and a method for assembly of substrates with globule contacts |
| 12/01/2005 | WO2005115066A1 Hole adapter for a printer circuit board |
| 12/01/2005 | WO2005114720A2 Parylene-based flexible multi-electrode arrays for neuronal stimulation and recording and methods for manufacturing the same |
| 12/01/2005 | WO2005114658A2 Method for making noble metal conductive leads for suspension assemblies |
| 12/01/2005 | WO2005114367A1 Touch panel and electronic device display window protection panel using the same |
| 12/01/2005 | WO2005113134A1 Method for oxidizing substance and oxidation apparatus therefor |
| 12/01/2005 | WO2005086549A3 Backup board for machining process |
| 12/01/2005 | WO2005079126A3 Metal deposition |
| 12/01/2005 | WO2005056202A3 Apparatus and method for cleaning surfaces |
| 12/01/2005 | WO2005022684A3 Low cost rfid antenna manufactured from conductive loaded resin-based materials |
| 12/01/2005 | WO2004112151A3 Transparent conducting structures and methods of production thereof |
| 12/01/2005 | US20050266704 Flexible printed board mounting structure and optical pick up having the same |
| 12/01/2005 | US20050266703 Electro-formed ring interconnection system |
| 12/01/2005 | US20050266702 Flexible ring interconnection system |
| 12/01/2005 | US20050266687 Method of manufacturing semiconductor device and semiconductor device |
| 12/01/2005 | US20050266683 Remover compositions for dual damascene system |
| 12/01/2005 | US20050266674 Screen printing method of forming conductive bumps |
| 12/01/2005 | US20050266671 Manufacturing method of semiconductor device |
| 12/01/2005 | US20050266668 Semiconductor device and method of manufacturing the same |
| 12/01/2005 | US20050266618 Plasma processing method and method for fabricating electronic component module using the same |
| 12/01/2005 | US20050266615 Chip resistor and method for producing the same |
| 12/01/2005 | US20050266613 Integrated circuit packages with reduced stress on die and associated methods |
| 12/01/2005 | US20050266609 Method of fabricating a built-in chip type substrate |
| 12/01/2005 | US20050266608 Packaging substrate without plating bar and a method of forming the same |
| 12/01/2005 | US20050266352 Metallic pattern forming method and conductive pattern material |
| 12/01/2005 | US20050266265 Multiple stage electroless deposition of a metal layer |
| 12/01/2005 | US20050266255 Conductive film forming method and conductive material |
| 12/01/2005 | US20050266249 Flexible metal clad laminate film and a manufacturing method for the same |
| 12/01/2005 | US20050266214 Wiring substrate and method of fabricating the same |
| 12/01/2005 | US20050266213 Layered board and manufacturing method of the same, electronic apparatus having the layered board |
| 12/01/2005 | US20050266212 Layered board and manufacturing method of the same, electronic apparatus having the layered board |
| 12/01/2005 | US20050266165 Method for metallizing plastic surfaces |
| 12/01/2005 | US20050266154 Apparatus for forming a circuit |
| 12/01/2005 | US20050265797 Printed board drilling method and printed board machining apparatus |
| 12/01/2005 | US20050265408 Method of providing consistent quality of target material removal by lasers having different output performance characteristics |
| 12/01/2005 | US20050265010 Multipart electronic circuit assembly with detachably interconnecting and locking component circuit substrates |
| 12/01/2005 | US20050265009 Detecting short circuits and detecting component misplacement |
| 12/01/2005 | US20050265008 Method and structures for implementing enhanced reliability for printed circuit board high power dissipation applications |
| 12/01/2005 | US20050264924 Disk device |
| 12/01/2005 | US20050264710 Method and apparatus for fabricating flat panel display |
| 12/01/2005 | US20050264380 Method and stiffener-embedded waveguide structure for implementing enhanced data transfer |
| 12/01/2005 | US20050263911 Circuit device and manufacturing method thereof |
| 12/01/2005 | US20050263909 Semiconductor device |
| 12/01/2005 | US20050263905 Method for manufacturing circuit device |
| 12/01/2005 | US20050263903 forming an adhesion layer in contact with a substrate and electricoconductive surface layers using electrophotoghic imaging masks, to improve lamination, and increase the reliability and quality of electronic circuits |
| 12/01/2005 | US20050263898 Substrate, connecting structure and electronic equipment |
| 12/01/2005 | US20050263895 Circuit device and manufacturing method thereof |
| 12/01/2005 | US20050263887 Circuit carrier and fabrication method thereof |
| 12/01/2005 | US20050263880 Circuit device and manufacturing method thereof |
| 12/01/2005 | US20050263875 Method for controlled ink-jet spreading of polymers for the insulation and/or protection of printed circuits |
| 12/01/2005 | US20050263874 Semiconductor package, method of production of same, and semiconductor device |
| 12/01/2005 | US20050263872 Flex-based circuit module |
| 12/01/2005 | US20050263867 Intermediate substrate |
| 12/01/2005 | US20050263846 Circuit device |
| 12/01/2005 | US20050263743 Etching with organic ammonium compound and/or oxoammonium compound, water, and solvent |
| 12/01/2005 | US20050263572 Circuit assembly for battery pack or the like, and method of making the same |
| 12/01/2005 | US20050263571 Injection molded continuously solidified solder method and apparatus |
| 12/01/2005 | US20050263506 Laser machining apparatus |
| 12/01/2005 | US20050263501 Laser beam processing method and component machined by the method |
| 12/01/2005 | US20050263498 Ceramic heater |
| 12/01/2005 | US20050263482 Method of manufacturing circuit device |
| 12/01/2005 | US20050263324 Circuit board assembly employing solder vent hole |
| 12/01/2005 | US20050263322 Enhanced blind hole termination of pin to PCB |
| 12/01/2005 | US20050263321 Electronic circuit board |
| 12/01/2005 | US20050263320 Circuit device and manufacturing method thereof |
| 12/01/2005 | US20050263319 Printed circuit board, magnetic disk device, and method for manufacturing the printed circuit board |
| 12/01/2005 | US20050263318 Structure for fixing an electronic device to a substrate |
| 12/01/2005 | US20050263250 Micro adhesive nozzle and adhesive applying apparatus |
| 12/01/2005 | US20050263238 Placing a resin sheet in a surface recess or inner void in ceramic green sheets; laminating the sheets with the resin sheet in place; and firing the laminate, which decomposes the resin sheet; deformation and delamination in the recess or void site area is prevented |
| 12/01/2005 | US20050262687 Centrifugal solder extraction tool and method |
| 12/01/2005 | DE19827014B4 Belotungsverfahren Belotungsverfahren |
| 12/01/2005 | DE10201209B4 Lotformteil und Verfahren zur Bestückung desselben The same solder preform and method for mounting |
| 12/01/2005 | DE102005020638A1 Brennstoffzellenanordnung und Montagemethode für Brennstoffzelle Fuel cell arrangement and assembly method for fuel cell |
| 12/01/2005 | DE102004049485B3 Elektrische Schaltung mit einer Mehrlagen-Leiterplatte An electrical circuit with a multi-layer printed circuit board |
| 12/01/2005 | DE102004023189A1 Lösbare elektrische Kontaktierung dreidimensionaler spritzgegossener Schaltungsträger Releasable electrical contact three-dimensional molded interconnect devices |
| 12/01/2005 | DE102004022430A1 Verfahren zum maschinellen Vereinzeln von Schaltungsträgern aus einem Leiterplattennutzen A method of mechanically separating circuit boards from a PCB panels |
| 12/01/2005 | DE102004022232A1 Viskoses Klebematerial zur Befestigung elektronischer Bauelemente Viscous adhesive material for mounting electronic components |
| 12/01/2005 | DE102004022178A1 Verfahren zur Herstellung einer Leiterbahn auf einem Substrat und Bauelement mit einer derart hergestellten Leiterbahn A method of fabricating a wiring on a substrate and the component to a conductor track manufactured in such a way |
| 12/01/2005 | DE102004021927A1 Verfahren zur inneren elektrischen Isolation eines Substrats für ein Leistungshalbleitermodul A process for the inner electrical insulation of a substrate for a power semiconductor module |