Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2005
10/13/2005WO2005094409A2 Process for preparing a non-conductive substrate for electroplating
10/13/2005WO2005094394A2 Non-chrome plating on plastic
10/13/2005US20050228144 Resin particle, conductive particle and anisotropic conductive adhesive containing the same
10/13/2005US20050227744 System and method for a simplified cable tuner
10/13/2005US20050227510 Small array contact with precision working range
10/13/2005US20050227506 Pinless solder joint for coupling circuit boards
10/13/2005US20050227497 Light transparent substrate imprint tool with light blocking distal end
10/13/2005US20050227413 Method for depositing a solder material on a substrate
10/13/2005US20050227411 Methods for fabricating electronic components to include supports for conductive structures
10/13/2005US20050227408 Method for forming housings for electronic components and electronic components that are hermetically encapsulated thereby
10/13/2005US20050227181 Metallisation
10/13/2005US20050227161 Image forming apparatus and method of manufacturing electronic circuit using the same
10/13/2005US20050227158 Toner for producing wiring board and method of producing wiring board using thereof
10/13/2005US20050227052 Semi-suspended coplanar waveguide on a printed circuit board
10/13/2005US20050227049 Process for fabrication of printed circuit boards
10/13/2005US20050227036 Insert-molded article and a production method for insert-molded article
10/13/2005US20050227014 Use of "CAP coater" in which liquid level height, capillary gap distance, and relative scanning speed between coating nozzle and surface to be coated are adjusted by setting the thickness of the resist film at a predetermined value; the larger the coating gap, the smaller the thickness distribution rate
10/13/2005US20050226997 Dicopper(I)oxalate complexes for use as precursor substances in metallic copper deposition
10/13/2005US20050226995 Flexible printed circuits with many tiny holes
10/13/2005US20050225956 Multilayer circuit board, process of manufacturing same, board for multilayer circuitry, and electronic apparatus
10/13/2005US20050225954 Field changeable graphics system for a computing device
10/13/2005US20050225953 Method for improved high current component interconnections
10/13/2005US20050225949 Circuit arrangement for controlling electromotive driving means of a mobile working machine, particularly of an industrial truck
10/13/2005US20050225894 Data storage system including an overmolded input/output connector
10/13/2005US20050225408 Direct current cut structure
10/13/2005US20050225342 Method of manufacturing a semiconductor device testing contactor having a circuit-side contact piece and test-board-side contact piece
10/13/2005US20050225210 Z-axis electrical connection and methods for ultrasound transducers
10/13/2005US20050224989 Passive within via
10/13/2005US20050224985 Circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
10/13/2005US20050224977 Wiring substrate and method using the same
10/13/2005US20050224974 Electronic component mounting method and apparatus
10/13/2005US20050224973 Extension of fatigue life for C4 solder ball to chip connection
10/13/2005US20050224971 Circuit board, device mounting structure, device mounting method, and electronic apparatus
10/13/2005US20050224966 Interconnections for flip-chip using lead-free solders and having reaction barrier layers
10/13/2005US20050224961 Electronic package with optimized lamination process
10/13/2005US20050224951 Jet-dispensed stress relief layer in contact arrays, and processes of making same
10/13/2005US20050224937 Exposed pad module integrated a passive device therein
10/13/2005US20050224934 Circuit device
10/13/2005US20050224932 Electrically conductive wire
10/13/2005US20050224931 Method of producing electronic circuit and electronic circuit
10/13/2005US20050224912 Circuit and method for enhanced low frequency switching noise suppression in multilayer printed circuit boards using a chip capacitor lattice
10/13/2005US20050224767 dielectric compositions for forming dielectric layers that can be used as circuitized substrates and particularly those used in multilayered circuit boards, chip carriers, and the like; comprising: a cured epoxy resin material; and a particulate filler
10/13/2005US20050224762 Flexible good conductive layer and anisotropic conductive sheet comprising same
10/13/2005US20050224561 Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device
10/13/2005US20050224560 Mounting substrate and mounting method of electronic part
10/13/2005US20050224476 Laser machining apparatus for sheet-like workpiece
10/13/2005US20050224461 Method for metallizing titanate-based ceramics
10/13/2005US20050224357 Method and device for treating flat and flexible work pieces
10/13/2005US20050224256 Interlayer member used for producing multilayer wiring board and method of producing the same
10/13/2005US20050224255 Plastic injected part with a plastic-coated printed circuit board, which can be equipped with components
10/13/2005US20050224254 Electronic device having side electrode, method of manufacturing the same, and apparatus using the same
10/13/2005US20050224253 Wiring board and production method of wiring board
10/13/2005US20050224252 Component mounting substrate and structure
10/13/2005US20050224251 Low moisture absorptive circuitized substrate, method of making same, electrical assembly utilizing same, and information handling system utilizing same
10/13/2005US20050224167 Material separation to form segmented product
10/13/2005US20050224092 Substrates, after laser structuring, are brought into contact with solution of wetting agents and compositions that support the cleaning before metallization; leads to sufficient removal of the unintentionally deposited metal seeds without having lasting damaging effect on surface
10/13/2005US20050223917 Paste dispenser and method for controlling the same
10/13/2005US20050223553 Method for providing an electrical connection
10/13/2005US20050223551 Method for manufacturing a high-efficiency thermal conductive base board
10/13/2005US20050223550 Method for making a non-detachable microcircuit card
10/13/2005DE10393466T5 Verfahren zum Erzeugen eines Keramik-Mehrschicht-Substrats A method for producing a ceramic multi-layer substrate
10/13/2005DE10257173B4 Verfahren zum Aufbringen von Lotmaterial, Verwendung einer Anlage zur laserunterstützten direkten Metallabscheidung hierfür und Kontaktflächen mit Lotdepots A method of applying solder material, using an installation for laser-assisted direct metal deposition and contact surfaces thereof with the solder deposits
10/13/2005DE102004047302A1 Kondensator-Befestigungsstruktur Capacitor-mounting structure
10/13/2005DE102004047033A1 Substrat Substratum
10/13/2005DE102004014645A1 Transparente, elektrisch leitfähige, beschichtete Polyesterfolie, Verfahren zu ihrer Herstellung sowie ihre Verwendung Transparent, electrically conductive, coated polyester film, process for their preparation and their use
10/13/2005DE102004013716A1 Circuit board with wired electronic components, has integrated elastic retention device provided in connection boring
10/13/2005DE102004012979A1 Kopplungssubstrat für Halbleiterbauteile und Verfahren zur Herstellung desselben Coupling of the same substrate for semiconductor devices and methods for making
10/12/2005EP1585376A1 Combination system including two recording/reproducing units and a digital broadcast receiver
10/12/2005EP1585375A1 Injection moulded component with a plastic overmoulded circuit board
10/12/2005EP1585374A1 Circuit board checker and circuit board checking method
10/12/2005EP1585184A1 Direct current cut structure
10/12/2005EP1585076A1 A method of manufacturing laminated material for security tags
10/12/2005EP1584971A1 Flat display device
10/12/2005EP1584708A2 Process for the treatment of laser-structured plastic surfaces
10/12/2005EP1584365A1 Transmitter for wireless control
10/12/2005EP1584222A1 Placement of a camera module in a portable device
10/12/2005EP1584101A2 Semiconductor package having non-ceramic based window frame
10/12/2005EP1583669A2 Improved surface for use on implantable device
10/12/2005EP1480778B1 Operating method for a laser machining system
10/12/2005EP1421835B1 Embedded electrical traces and method for making
10/12/2005EP1392495A4 Three-dimensional nonwoven substrate for circuit board
10/12/2005EP1082882A4 Method of manufacturing resistors
10/12/2005CN2733824Y Length regulator for circuit board drill bit
10/12/2005CN2733823Y A base plate for drilling printed circuit board
10/12/2005CN2733822Y Aluminum base printed circuit board
10/12/2005CN2733821Y Elastic fatigue resistant D-style surface adhesion spring
10/12/2005CN2733525Y An electric conductor and chip using the same
10/12/2005CN1682521A Electrical subassembly and use thereof
10/12/2005CN1682379A Semiconductor device exhibiting enhanced pattern recognition when illuminated
10/12/2005CN1681900A Method of adhesion of conductive materials, laminate, and adhesive composition
10/12/2005CN1681891A Functional fluorescent dyes
10/12/2005CN1681649A Method of producing laminates, and laminates
10/12/2005CN1681632A Method for producing laminated board and misregistration-preventing system for laminated board production
10/12/2005CN1681618A Solder hierarchy for lead free solder joint
10/12/2005CN1681617A Photo-thermal induced diffusion method and electrical device
10/12/2005CN1681581A Printing method using rubber stamp
10/12/2005CN1681382A Support pin identifying method and device, screen printer and surface installation machine
10/12/2005CN1681378A Blocking wiring method of multi-layer circuit board
10/12/2005CN1681377A Method of manufacturing electronic component mounting body, electronic component mounting body, and electro-optical device
10/12/2005CN1681376A Method and apparatus for manufacturing circuit board
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