| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 09/29/2005 | DE10343655B4 Verfahren zum Herstellen einer Lötverbindung zwischen einem Substrat und einem Kontaktelement einer Brennstoffzelleneinheit sowie Brennstoffzelleneinheit A method for forming a solder connection between a substrate and a contact element of a fuel cell unit and the fuel cell unit |
| 09/29/2005 | DE102005008323A1 Optische Halbleitervorrichtung und diese verwendende elektronische Anordnung Optical semiconductor device and electronic device employing the same |
| 09/29/2005 | DE102004028888A1 Electronic component, especially regulator or micromechanical sensor element for automobiles, with gel layer of specific hardness for protecting circuitry against corrosion, temperature and vibration |
| 09/29/2005 | DE102004026489B3 Verfahren zur Metallisierung von Kunststoffoberflächen Process for the metallization of plastic surfaces |
| 09/29/2005 | DE102004012211A1 Coating electrical circuit boards with a protective lacquer used in an electronic device finishing process comprises using a lacquer bath having a constant temperature in which the circuit boards are immersed |
| 09/29/2005 | DE102004011929A1 Electrical contact surfaces connection establishing method, involves arranging contact surfaces by irradiating surfaces with laser radiation having power density within specific range |
| 09/29/2005 | DE102004009901A1 Vorrichtung zum Singulieren und Bonden von Halbleiterchips und Verfahren zum Singulieren und Bonden Apparatus for singulating and bonding semiconductor chips and method for singulating and bonding |
| 09/29/2005 | DE102004009567A1 Wiring carrier for accommodating chip, is divided into function unit, such that bending rigidity of cross board and side band portion is increased |
| 09/29/2005 | DE102004005586B3 Halbleiterbauteil mit einem Halbleiterchipstapel auf einer Umverdrahtungsplatte und Herstellung desselben Of the same semiconductor device with a semiconductor chip stack on a rewiring and manufacturing |
| 09/28/2005 | EP1581037A2 Method of manufacturing a sealed electronic module |
| 09/28/2005 | EP1581036A2 Method of manufacturing a sealed electronic module |
| 09/28/2005 | EP1581035A2 Multilayer ceramic substrate and its production method |
| 09/28/2005 | EP1581034A1 Method of forming solder mask |
| 09/28/2005 | EP1581033A2 Metallic platelet for electrical connection, electric component comprising this platelet and connection adapter |
| 09/28/2005 | EP1581032A1 Electronic part and manufacturing method thereof |
| 09/28/2005 | EP1581031A1 Method of forming a pattern, conductive patterned material, and method of forming a conductive pattern |
| 09/28/2005 | EP1580595A2 Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material |
| 09/28/2005 | EP1580243A1 Polishing composition and polishing method |
| 09/28/2005 | EP1580235A1 Resin composition, cured resin, cured resin sheet, laminate, prepreg, electronic part, and multilayer substrate |
| 09/28/2005 | EP1579926A2 Apparatus supplying liquid drops to predetermined positions on a substrate |
| 09/28/2005 | EP1579503A2 Semiconductor device power interconnect striping |
| 09/28/2005 | EP1579500A1 Methods for performing substrate imprinting using thermoset resin varnishes and products formed therefrom |
| 09/28/2005 | EP1579477A2 Components, methods and assemblies for multi-chip packages |
| 09/28/2005 | EP1579204A1 Manufacture of electrochemical sensors by moveable flat screen printing |
| 09/28/2005 | EP1579031A1 Peel strength enhancement of copper laminates 102426-201 |
| 09/28/2005 | EP1579024A1 Flexible frame for mounting a deposition mask |
| 09/28/2005 | EP1578849A1 Method for modifying the surface of a polymeric substrate |
| 09/28/2005 | EP1578612A2 Ink composition for use in a continuous web process for the manufacture of electrochemical sensors |
| 09/28/2005 | EP1578559A1 Bonding material and bonding method |
| 09/28/2005 | EP1578543A2 A method for forming ceramic film capacitors |
| 09/28/2005 | EP1440493B1 Bending a tab flex circuit via cantilevered leads |
| 09/28/2005 | EP1393109B1 Device for holding an optical fibre |
| 09/28/2005 | EP1309420B1 Soldering method for mounting electric components |
| 09/28/2005 | EP1176159B1 Thermosetting resin composition and flexible-circuit overcoating material comprising the same |
| 09/28/2005 | EP0890197B1 Bidirectional non-solid impedance controlled reference plane |
| 09/28/2005 | EP0886894B1 Contact carriers for populating substrates with spring contacts |
| 09/28/2005 | CN2730079Y Reciprocating electronic element repair platform |
| 09/28/2005 | CN2730078Y Compound multi-layer flexible circuit board structure |
| 09/28/2005 | CN2730077Y Fixed mount for printed circuit board |
| 09/28/2005 | CN1675968A Method for forming bump on electrode pad with use of double-layered film |
| 09/28/2005 | CN1675967A An electronic product, a body and a method of manufacturing |
| 09/28/2005 | CN1675760A 多层印刷线路板 Multilayer printed circuit boards |
| 09/28/2005 | CN1675754A Method of microelectrode connection and connected structure of use thereof |
| 09/28/2005 | CN1675411A Method for manufacturing plated film, cathode roll for plating, and method for manufacturing circuit board |
| 09/28/2005 | CN1675407A Metallisation |
| 09/28/2005 | CN1675065A Support system and method for a screen printing unit |
| 09/28/2005 | CN1675020A Laser processing device, processing method, and method of producing circuit substrate using the method |
| 09/28/2005 | CN1674777A Substrate holding method and method of manufacturing electronic part |
| 09/28/2005 | CN1674770A Board through-hole working method |
| 09/28/2005 | CN1674769A Surface treatment method for copper foil and method for producing copper-coating laminated board |
| 09/28/2005 | CN1674768A Double-side butt pasting method for ball grid array device and printed-wiring board |
| 09/28/2005 | CN1674767A Pattern forming method, circuit substrate and electronic apparatus |
| 09/28/2005 | CN1674766A CO2 laser drilling hole method |
| 09/28/2005 | CN1674765A UV laser drilling hole method |
| 09/28/2005 | CN1674762A Wiring substrate and producing method thereof |
| 09/28/2005 | CN1674760A Circuit board and method for manufacturing the same |
| 09/28/2005 | CN1674758A 电路装置及其制造方法 Circuit device and manufacturing method thereof |
| 09/28/2005 | CN1674359A 压配合端子 Press-fit terminal |
| 09/28/2005 | CN1674281A Hybrid integrated circuit device |
| 09/28/2005 | CN1674278A 电路装置 Circuit means |
| 09/28/2005 | CN1674269A Interlayer member used for producing multi-layer wiring board and method of producing the same |
| 09/28/2005 | CN1674242A Semiconductor chip, semiconductor device, method for producing semiconductor device, and electronic equipment |
| 09/28/2005 | CN1674217A Processing apparatus |
| 09/28/2005 | CN1673860A Exposure device and positioning method |
| 09/28/2005 | CN1673187A Multi-layer ceramic substrate and manufacturing method thereof |
| 09/28/2005 | CN1673143A Dielectric ceramic material and multilayer ceramic substrate |
| 09/28/2005 | CN1672920A Flexible metal foil-polyimide laminate and making method |
| 09/28/2005 | CN1221158C Method for producing double-side distributing board |
| 09/28/2005 | CN1221157C Manufacture method of mixed integrated circuit device |
| 09/28/2005 | CN1221029C High frequency semiconductor device |
| 09/28/2005 | CN1221021C Method for connecting integrated circuit to substrate and relative circuit wiring |
| 09/28/2005 | CN1220990C Method for producing nano composite magnet by spray method |
| 09/28/2005 | CN1220976C Magnetic head universal rack assembly and its making method |
| 09/28/2005 | CN1220556C Slurry conveying mechanism |
| 09/27/2005 | US6950315 High frequency module mounting structure in which solder is prevented from peeling |
| 09/27/2005 | US6950293 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 09/27/2005 | US6949992 System and method of providing highly isolated radio frequency interconnections |
| 09/27/2005 | US6949836 Printed circuit board multi-layer structure with embedded device |
| 09/27/2005 | US6949819 Jumper chip component and mounting structure therefor |
| 09/27/2005 | US6949815 Semiconductor device with decoupling capacitors mounted on conductors |
| 09/27/2005 | US6949771 Light source |
| 09/27/2005 | US6949709 Method for making a dashboard subassembly in paticular a motor vehicle dashboard console |
| 09/27/2005 | US6949470 Method for manufacturing circuit devices |
| 09/27/2005 | US6949412 Clad plate for forming interposer for semiconductor device, interposer for semiconductor device, and method of manufacturing them |
| 09/27/2005 | US6949215 Method for processing a three-dimensional structure by laser |
| 09/27/2005 | US6949171 Method of providing conductive tracks on a printed circuit and apparatus for use in carrying out the method |
| 09/27/2005 | US6949144 Low pressure plasma processing apparatus and method |
| 09/27/2005 | US6948944 Wiring board with built-in electronic component and method for producing the same |
| 09/27/2005 | US6948941 Interconnect assemblies and methods |
| 09/27/2005 | US6948940 Helical microelectronic contact and method for fabricating same |
| 09/27/2005 | US6948863 Optical module and optical transceiver module |
| 09/27/2005 | US6948242 Process for producing a contact-making device |
| 09/27/2005 | US6948240 Method for shaping an object |
| 09/27/2005 | US6948238 Method for dissociating metals from metal compounds |
| 09/27/2005 | US6948235 Shroud installation apparatus and method of installation |
| 09/27/2005 | CA2261258C A flux formulation |
| 09/24/2005 | CA2489647A1 Lead-in for electronic bobbins |
| 09/22/2005 | WO2005089034A2 An element for carrying electronic components |
| 09/22/2005 | WO2005089032A1 Apparatus for testing of flexible printed circuit board |
| 09/22/2005 | WO2005089023A1 Variable watt density layered heater |