Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2005
10/26/2005EP1266546B1 Treatment of circuit supports with impulse excitation
10/26/2005EP0976309B1 Case for circuit boards
10/26/2005CN1689382A Multilayer printed wiring board and production method therefor
10/26/2005CN1689381A Method for the manufacture of printed circuit boards with integral plated resistors
10/26/2005CN1689181A Fixtures and methods for facilitating the fabrication of devices having thin film materials
10/26/2005CN1689175A Film comprising organic semiconductors
10/26/2005CN1688870A Dial module, manufacturing method thereof, LED display element, display module, movement module, connector module, and meter using them
10/26/2005CN1688753A Device and method for electrolytically treating an at least superficially electrically conducting work piece
10/26/2005CN1225154C Method for producing circuit board
10/26/2005CN1225153C Circuit board device and its mounting method
10/26/2005CN1225063C Demountable clamping mechanism for land grid array connectors
10/26/2005CN1225023C Integrated circuit die and/or package having a variable pitch contact array for maximization of number of signal lines per routing layer
10/26/2005CN1225014C Method for making electronic element with lugs and method for making said electronic element
10/26/2005CN1224985C Surface-sticked PTC Thermosensitive resistor and sticking method
10/26/2005CN1224844C Low-intensity magnetic field sensor using printed circuit board mfg. thchnology and its mfg. method
10/26/2005CN1224465C Viscous material coater
10/25/2005US6958899 Electronic device
10/25/2005US6958539 Metal bump with an insulating sidewall and method of fabricating thereof
10/25/2005US6958531 Multi-substrate package and method for assembling same
10/25/2005US6958527 Wiring board having interconnect pattern with land, and semiconductor device, circuit board, and electronic equipment incorporating the same
10/25/2005US6958262 Mounting structure of semiconductor device and mounting method thereof
10/25/2005US6958106 Material separation to form segmented product
10/25/2005US6958095 Apparatus for manufacturing stacked type electronic part
10/25/2005US6957963 Compliant interconnect assembly
10/25/2005US6957760 Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux
10/25/2005US6957759 Viscous fluid transfer apparatus and transfer method, electronic component mounting apparatus and mounting method, and semiconductor device
10/25/2005US6957608 Contact print methods
10/25/2005CA2297249C Chemical compounds of intrinsically conductive polymers with metals
10/20/2005WO2005099331A1 Module component and manufacturing method thereof
10/20/2005WO2005099329A1 Rigid-flexible board and manufacturing method thereof
10/20/2005WO2005099328A1 Circuit board and manufacturing method thereof
10/20/2005WO2005099327A1 A method of creating solder bar connections on electronic packages
10/20/2005WO2005099326A2 A method for manufacturing a flexible circuit board having small thickness and flexible board manufactured thereby
10/20/2005WO2005099325A1 Carrier substrate with a thermochromatic coating
10/20/2005WO2005099324A1 Printed wiring board assembled panel, unit sheet for mounting printed wiring board, rigid-flexible board and method for manufacturing them
10/20/2005WO2005099067A1 Surface mounting type vibrating motor and portable communication equipment having the same
10/20/2005WO2005099028A2 Embedded capacitors using conductor filled vias
10/20/2005WO2005098993A1 Method for providing a substrate with a printed pattern
10/20/2005WO2005098992A1 Method for providing a substrate with a printed pattern which comprises a number of separate pattern elements
10/20/2005WO2005098947A1 Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist
10/20/2005WO2005098942A1 Al/AlN JOINT MATERIAL, BASE PLATE FOR POWER MODULE, POWER MODULE AND PROCESS FOR PRODUCING Al/AlN JOINT MATERIAL
10/20/2005WO2005098941A2 Integrated circuit stacking system and method
10/20/2005WO2005098931A1 Submount and manufacturing method thereof
10/20/2005WO2005097882A1 Thermosetting composition and curing method thereof
10/20/2005WO2005097494A1 A laminated electrically conductive polymer structure
10/20/2005WO2005097396A1 Joining method and device therefor
10/20/2005WO2005097390A1 Methods and apparatus for transferring conductive pieces during semiconductor device fabrication
10/20/2005WO2005089034A3 An element for carrying electronic components
10/20/2005WO2005056875A3 Formation of solid layers on substrates
10/20/2005WO2004034753A3 Circuit board standoff
10/20/2005US20050235243 Method and system for deciding a wiring route
10/20/2005US20050233628 Land grid array connector with reinforcement stiffener
10/20/2005US20050233613 Coupling structure of electronic components
10/20/2005US20050233611 Signal transmission device
10/20/2005US20050233609 Compliant interconnect assembly
10/20/2005US20050233607 Orientation equipment with multiple PCBS
10/20/2005US20050233593 Plating of multi-layer structures
10/20/2005US20050233567 Method of manufacturing multi-stack package
10/20/2005US20050233503 Method for the production of structured layers on substrates
10/20/2005US20050233482 Method of making contact pin card system
10/20/2005US20050233480 Clearance inspection apparatus and clearance inspection method
10/20/2005US20050233172 Alumina insulation for coating implantable components and other microminiature devices
10/20/2005US20050233148 Metallised parts made from plastic material
10/20/2005US20050233122 Manufacturing method of laminated substrate, and manufacturing apparatus of semiconductor device for module and laminated substrate for use therein
10/20/2005US20050232878 Ultraviolet light block and photocatalytic materials
10/20/2005US20050232728 Methods and apparatus for transferring conductive pieces during semiconductor device fabrication
10/20/2005US20050232641 Methods for manufacturing lead frame connectors for optical transceiver modules
10/20/2005US20050232316 Laser processing device, processing method, and method of producing circuit substrate using the method
10/20/2005US20050231929 Board mounting method and mounting structure
10/20/2005US20050231927 Method, system and apparatus for controlled impedance at transitional plated-through hole via sites using barrel inductance minimization
10/20/2005US20050231926 Wiring board, balun and apparatus using wiring board, and method of manufacturing wiring board
10/20/2005US20050231925 Semiconductor device and method for manufacturing the same
10/20/2005US20050231922 Functional printed circuit board module with an embedded chip
10/20/2005US20050231889 Capacitor-embedded substrate
10/20/2005US20050231696 Exposure device
10/20/2005US20050231495 Display device
10/20/2005US20050231343 Graduated stiffness for electrical connections in tires
10/20/2005US20050231049 Fan with brushless direct current motor
10/20/2005US20050230852 Semiconductor chip package
10/20/2005US20050230851 Display device
10/20/2005US20050230848 Component built-in module and method for producing the same
10/20/2005US20050230843 Flip-chip type semiconductor devices and conductive elements thereof
10/20/2005US20050230835 Semiconductor device
10/20/2005US20050230829 Semiconductor device
10/20/2005US20050230828 Carrier, chip package structure, and circuit board package structure
10/20/2005US20050230825 Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer
10/20/2005US20050230824 BGA semiconductor device having a dummy bump
10/20/2005US20050230823 Semiconductor device and printed circuit board
10/20/2005US20050230814 Semiconductor packaging substrate and method of producing the same
10/20/2005US20050230813 Printed circuit board including via contributing to superior characteristic impedance
10/20/2005US20050230811 Compliant contact pin assembly and card system
10/20/2005US20050230810 Compliant contact pin assembly and card system
10/20/2005US20050230809 Compliant contact pin assembly and card system
10/20/2005US20050230806 Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements
10/20/2005US20050230799 Multi-chip module with embedded package and method for manufacturing the same
10/20/2005US20050230790 Tape carrier for TAB
10/20/2005US20050230711 [circuit connecting structure and fabricating method thereof]
10/20/2005US20050230667 Conductive adhesive and circuit using the same
10/20/2005US20050230486 Method for manufacturing radiofrequency identification device using transfer paper and radiofrequency identification device produced using this method
10/20/2005US20050230365 Methods of drilling through-holes in homogenous and non-homogeneous substrates
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