Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2005
12/01/2005DE102004021643A1 Applikationsverfahren für eine Bestandteile eines elektronischen Schaltkreises innerhalb einer Druckmaschine Application process for a component of an electronic circuit within a printing press
12/01/2005DE102004021122A1 Anordnung in Druckkontaktierung mit einem Leistungshalbleitermodul Arrangement in pressure contact with a power semiconductor module
12/01/2005DE102004020897A1 Circuit board arrangement with connection entrance and electronic component e.g. for transformers, has connection wire deformed during insertion into connection entrance for testable fixture
12/01/2005DE102004019510A1 Plastic housing for electronic devices esp. for motor vehicles, has conductor path provided with layer forming carrier only on one face
12/01/2005DE102004009901B4 Vorrichtung zum Singulieren und Bonden von Halbleiterchips und Verfahren zum Singulieren und Bonden Apparatus for singulating and bonding semiconductor chips and method for singulating and bonding
11/2005
11/30/2005EP1601053A1 Wired circuit board and connection structure of wired circuit board
11/30/2005EP1601017A1 Multilayer printed wiring board
11/30/2005EP1601016A2 Apparatus in screw pressure contact with a power semiconductor module
11/30/2005EP1601012A2 Microelectronic assembly having variable thickness solder joint
11/30/2005EP1600807A1 Apparatus and method of detecting breakdown of conducting wires
11/30/2005EP1600528A2 Method for the metallisation of plastic surfaces
11/30/2005EP1600249A1 Composition of a solder, and method of manufacturing a solder connection
11/30/2005EP1600237A1 Jet soldering apparatus
11/30/2005EP1599903A2 Method for producing an electronic component or module and a corresponding component or module
11/30/2005EP1488025B1 Conveyorized plating line and method for electrolytically metal plating a workpiece
11/30/2005EP1407062B1 Composite foil and its manufacturing process
11/30/2005EP0935532B1 Process and apparatus for the deposition of a viscous product on a substrate via a stencil
11/30/2005CN1703939A Device and method for reshaping the interconnection elements of an electronic module using the stress reflow method and, in particular, for restoring the flatness thereof
11/30/2005CN1703774A Jet singulation of a substrate
11/30/2005CN1703527A A lead-free solder, and a lead-free joint
11/30/2005CN1703327A Method of stripping silver from a printed circuit board
11/30/2005CN1703295A An apparatus and method for filling a ball grid array template
11/30/2005CN1703286A Nanostructured and nanoporous film compositions, structures, and methods for making the same
11/30/2005CN1703138A Joint unit and joint method
11/30/2005CN1703137A Exposure unit
11/30/2005CN1703136A Wired circuit board and connection structure of wired circuit board
11/30/2005CN1703071A Substrate inspection apparatus
11/30/2005CN1702856A Wiring substrate and method of fabricating the same
11/30/2005CN1702854A Intermediate substrate
11/30/2005CN1702853A Semiconductor device and manufacturing method of the same
11/30/2005CN1702470A Probe card for probing wafers with raised contact elements
11/30/2005CN1701952A Layer sequence for producing a composite material for electromechanical components
11/30/2005CN1230054C Laminated printing circuit board and producing method thereof
11/30/2005CN1230053C Printed circuit board and its making process
11/30/2005CN1230051C Printed circuit board structure and method for manufacturing the same and used printed mask and uses
11/30/2005CN1230050C Electronic machine
11/30/2005CN1230049C Surface mounting type electronic component
11/30/2005CN1230048C Plane mounting circuit module
11/30/2005CN1229862C Wiring base board and its producing method, electronic parts and electronic instrument
11/30/2005CN1229854C Mounting device and structure for semiconductor component, electro-optical device and producing method thereof
11/30/2005CN1229817C Conducting metal particles, conducting composite metal particles and applied products using same
11/30/2005CN1229422C Heat-resistant resin precursor, heat-resistant resin, insulating film and semiconductor device
11/30/2005CN1229296C Impregnated glass fiber strands and products including the same
11/30/2005CN1229209C Ceramic multi-layer substrate manufacturing method unfired composite multi-layer body
11/30/2005CN1229200C Thermal pressure welding method and thermal pressure welding equipment
11/29/2005US6971081 Routing for reducing impedance distortions
11/29/2005US6971077 Signal line impedance adjustment tool
11/29/2005US6970367 Switching power supply
11/29/2005US6970210 Folder type multi display device
11/29/2005US6969913 Semiconductor device and manufacturing method for the same
11/29/2005US6969912 Embedded microelectronic capacitor incorporating ground shielding layers and method for fabrication
11/29/2005US6969910 Semiconductor device, wiring board and method of making same
11/29/2005US6969808 Multi-layer printed board
11/29/2005US6969674 Structure and method for fine pitch flip chip substrate
11/29/2005US6969638 Low cost substrate for an integrated circuit device with bondpads free of plated gold
11/29/2005US6969636 Semiconductor package with stress inhibiting intermediate mounting substrate
11/29/2005US6969557 Surface-treated copper foil low-dielectric substrate and copper-clad laminate and printed wiring board using the same
11/29/2005US6969471 Process for manufacturing printed circuit boards with protected spaces between tracks
11/29/2005US6969436 Method and structure for producing Z-axis interconnection assembly of printed wiring board elements
11/29/2005US6969301 Filling plugs through chemical mechanical polish
11/29/2005US6969286 Connector having improved contacts with fusible members
11/29/2005US6969264 Transparent touch panel
11/29/2005US6969189 LED backlight module
11/29/2005US6968763 Orienting and stacking parts
11/29/2005US6968613 Preparing a core layer; applying an insulating material; applying a non-solderable material; removing the insulating material to expose the terminals of the conductive traces
11/27/2005CA2468551A1 Multipart electronic circuit assembly with detachably interconnecting and locking component circuit substrates
11/24/2005WO2005112531A1 Circuit board and electronic apparatus employing it
11/24/2005WO2005112530A1 Screen printing apparatus and screen printing method
11/24/2005WO2005112529A1 Method for manufacturing non halogen fire retardant epoxy or phenol circuit board using n-p type fire retardant
11/24/2005WO2005112528A1 Transport device
11/24/2005WO2005112527A1 Connector employing flexible printed board
11/24/2005WO2005112113A2 Mounting with auxiliary bumps
11/24/2005WO2005112100A2 Stacked module systems and methods
11/24/2005WO2005111274A2 Selective catalytic activation of non-conductive substrates
11/24/2005WO2005111169A1 Connecting material
11/24/2005WO2005111168A1 Adhesive agent composition and adhesive film for electronic component
11/24/2005WO2005111164A1 Adhesive film, flexible metal-clad laminate, and processes for producing these
11/24/2005WO2005110666A1 Methods of drilling through-holes in homogeneous and non-homogeneous substrates
11/24/2005WO2005110657A2 Soldering process
11/24/2005WO2005091370A8 Method for manufacturing integrated circuit
11/24/2005WO2005085347A8 Resin molded article with reduced dielectric loss tangent and production method therefor
11/24/2005WO2005084183A3 Electronic interconnect devices
11/24/2005WO2005084092A3 Micrometric direct-write methods for patterning conductive material and applications to flat panel display repair
11/24/2005WO2005077549A8 Thin film transistor and display device, and method for manufacturing thereof
11/24/2005WO2005065274A3 Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit
11/24/2005WO2005055369A3 Methods for making vertical electrical feed through structures
11/24/2005WO2004091838A3 Method of soldering or brazing articles having surfaces that are difficult to bond
11/24/2005US20050261152 Cleaning composition
11/24/2005US20050260870 Structurally integrable electrode and associated assembly and fabrication method
11/24/2005US20050260844 Package with barrier wall and method for manufacturing the same
11/24/2005US20050260790 Substrate imprinting techniques
11/24/2005US20050260520 Heat stable photocurable resin composition for dry film resist
11/24/2005US20050260430 To be used for connecting two or more electrodes of an electric circuit, having an improved connection reliability resulting from relaxation of force applied to a circuit, and to substrate structures
11/24/2005US20050260391 Wired circuit board
11/24/2005US20050260350 Forming a conductor circuit on a substrate
11/24/2005US20050260341 Adhesive sheet stamping device, adhesive sheet stamping method, part mounter display panel manufacturing method
11/24/2005US20050260339 Multiple stage electroless deposition of a metal layer
11/24/2005US20050260338 Method of manufacturing circuit layout on touch panel by utilizing metal plating technology
11/24/2005US20050259994 Optical transceiver module having improved printed circuit board
11/24/2005US20050259862 Device and method for recognizing recognition marks for component placement
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