| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 11/24/2005 | US20050259717 Method for connecting terminals |
| 11/24/2005 | US20050259396 Thermal management system and method for electronic equipment mounted on coldplates |
| 11/24/2005 | US20050259387 Display modules and methods of fixing flexible circuit boards therein |
| 11/24/2005 | US20050259096 Method and structure for measuring a bonding resistance |
| 11/24/2005 | US20050259069 Force sensing pointing device with click function |
| 11/24/2005 | US20050259014 Antenna coupling structure for a mobile terminal |
| 11/24/2005 | US20050258925 Flyback transformer wire attach method to printed circuit board |
| 11/24/2005 | US20050258913 Constant temperature type crystal oscillator |
| 11/24/2005 | US20050258836 Apparatus and method of inspecting breakdown of conducting wire |
| 11/24/2005 | US20050258551 Fine-pitch packaging substrate and a method of forming the same |
| 11/24/2005 | US20050258550 Circuit board and semiconductor device using the same |
| 11/24/2005 | US20050258548 Capacitor-built-in-type printed wiring substrate printed wiring substrate, and capacitor |
| 11/24/2005 | US20050258544 Substrate for solder joint |
| 11/24/2005 | US20050258526 Semiconductor device, method for mounting the same, and method for repairing the same |
| 11/24/2005 | US20050258522 Printed wiring board and method for producing the same |
| 11/24/2005 | US20050258509 Substrate, semiconductor device, and substrate fabricating method |
| 11/24/2005 | US20050258446 LED assembly with vented circuit board |
| 11/24/2005 | US20050258153 System and method for joining flat flexible cables |
| 11/24/2005 | US20050258134 by using a silver colloidal catalyst solution produced through reduction by a metal ion in place of palladium as a catalyst for initiating copper electroless plating, a circuit can be formed at a low cost without use of complicated steps |
| 11/24/2005 | US20050257958 Package modification for channel-routed circuit boards |
| 11/24/2005 | US20050257957 Printed wiring board with conductive constraining core including resin filled channels |
| 11/24/2005 | US20050257954 Structure for mounting electronic component on wiring board |
| 11/24/2005 | US20050257953 Method of creating gold contacts directly on printed circuit boards and product thereof |
| 11/24/2005 | US20050257952 Flexible printed wiring board and manufacturing method thereof |
| 11/24/2005 | US20050257950 Electrical connection box and manufacturing method thereof |
| 11/24/2005 | US20050257886 Process for producing electrical apparatus |
| 11/24/2005 | US20050257369 Electronic component extraction tool |
| 11/24/2005 | DE19742072B4 Verfahren zur Herstellung druckdichter Durchkontaktierungen A process for producing a pressure-tight vias |
| 11/24/2005 | DE10223509B4 Vorrichtung zum definierten Materialabtrag sowie Verfahren zur Steuerung einer Vorrichtung Apparatus for defined removal of material as well as methods for controlling a device |
| 11/24/2005 | DE102005011373A1 Interconnection for test measurement and logical analysis systems and probes for integrated circuits has flexible layers with contact bumps sandwiching rigid layer with holes |
| 11/24/2005 | DE102004022118A1 Anordnung zur Kühlung einer Elektronikeinheit sowie Herstellung einer solchen Anordnung Arrangement for cooling an electronic unit and the production of such an arrangement |
| 11/24/2005 | DE102004021720A1 Drilling support for drilling and/or cutting a circuit board comprises a wood fiber board coated with a nanocrystalline lacquer layer on the drill surface |
| 11/24/2005 | DE102004021062A1 Verfahren zur Herstellung von Leiterplatten und/oder entsprechenden Konstrukten Process for the preparation of printed circuit boards and / or corresponding constructs |
| 11/23/2005 | EP1599081A2 Thermal management system and method for electronic equipment mounted on coldplates |
| 11/23/2005 | EP1599079A1 Method for producing circuit-forming board and material for producing circuit-forming board |
| 11/23/2005 | EP1599078A2 Method of mounting an electronic component on a substrate |
| 11/23/2005 | EP1599077A1 Method of creating gold contacts directly on printed circuit boards and product thereof |
| 11/23/2005 | EP1599076A1 Wired circuit board |
| 11/23/2005 | EP1598931A1 Constant temperature type crystal oscillator |
| 11/23/2005 | EP1598899A1 Antenna coupling structure for a mobile terminal |
| 11/23/2005 | EP1598863A1 Semiconductor device and radiation detector employing it |
| 11/23/2005 | EP1598862A1 Semiconductor device and radiation detector employing it |
| 11/23/2005 | EP1598839A2 Translator for high frequency device arranged directly on a circuit board |
| 11/23/2005 | EP1598591A2 Light emitting assembly |
| 11/23/2005 | EP1598449A2 Improved plating method |
| 11/23/2005 | EP1598448A1 Lead-free bump and method for forming the same |
| 11/23/2005 | EP1598120A2 Devices and methods for forming a film, manufacturing a color filter and manufacturing a display device |
| 11/23/2005 | EP1597947A1 Method for manufacturing an electronic module |
| 11/23/2005 | EP1597946A1 Method for manufacturing an electronic module, and an electronic module |
| 11/23/2005 | EP1597945A1 Method for electrically contacting a component to a flat cable |
| 11/23/2005 | EP1597332A1 Conductive adhesive compositions with electrical stability and good impact resistance for use in electronics devices |
| 11/23/2005 | EP1597194A1 Templated cluster assembled wires |
| 11/23/2005 | EP1517939B1 Biaxially oriented polyester film and laminates thereof with copper |
| 11/23/2005 | EP1516404B1 Integrated device providing overcurrent and overvoltage protection and common-mode filtering to data bus interface |
| 11/23/2005 | EP1412307B1 Method for the production of metal-ceramic composite materials, especially metal-ceramic substrates |
| 11/23/2005 | EP1311644B1 Process for increasing polymer to metal adhesion |
| 11/23/2005 | EP1297548A4 Multilayer electrode structure and method for forming |
| 11/23/2005 | EP1075172B1 Multilayer printed wiring board having filled-via structure |
| 11/23/2005 | EP0891603B1 Non-conductive substrate forming a band or panel, on which are formed a plurality of support elements |
| 11/23/2005 | CN2742723Y Rocking vibrator for circuit board |
| 11/23/2005 | CN1701649A Method for supplying solder |
| 11/23/2005 | CN1701648A Circuit board and process for producing the same |
| 11/23/2005 | CN1701647A Circuit formation substrate manufacturing method and circuit formation substrate material |
| 11/23/2005 | CN1701437A 电子装置 Electronic devices |
| 11/23/2005 | CN1701429A Wiring-board and its manufacturing method |
| 11/23/2005 | CN1701401A Surface mounting type part |
| 11/23/2005 | CN1701137A Surface-treated copper foil having blackening-treated surface, process for producing the surface-treated copper foil and, using the surface-treated copper foil, electromagnetic wave shielding conducti |
| 11/23/2005 | CN1701134A Process for improving the adhesion of polymeric materials to metal surfaces |
| 11/23/2005 | CN1700845A Circuit assembly having manufacturing process blind hole and method for fabricating the same |
| 11/23/2005 | CN1700842A Flexible printed circuit film |
| 11/23/2005 | CN1700840A Flexible printed circuit film and liquid crystal display device including the same |
| 11/23/2005 | CN1700459A Semiconductor chip package |
| 11/23/2005 | CN1700453A Structure of forming pressure contact with power semiconductor module |
| 11/23/2005 | CN1700436A Wired circuit board |
| 11/23/2005 | CN1700026A Apparatus and method of detecting breakdown of conducting wires |
| 11/23/2005 | CN1229007C Method for mfg. multilayer printed wiring board and multilayer printed wiring board thereby |
| 11/23/2005 | CN1229006C Circuit forming board producing method, circuit forming board, material for circuit forming board |
| 11/23/2005 | CN1229005C Distributing base board device |
| 11/23/2005 | CN1229003C Wire circuit board |
| 11/23/2005 | CN1229002C Circuit formed substrate and method of manufacturing circuit formed substrate |
| 11/23/2005 | CN1229000C Soft circuit board capable of providing for identification |
| 11/23/2005 | CN1228836C Base-plate terminal structure, liquid crystal device and electronic device |
| 11/23/2005 | CN1228826C High- and low-melting point ball grid array arrangement |
| 11/23/2005 | CN1228688C Photosensitive resin compsn., photosensitive element, prodn. method for resist pattern and prodn. method for printed circuit board |
| 11/23/2005 | CN1228677C Substrate conducting wiring cutting method and device, electronic device manufacturing method and device |
| 11/23/2005 | CN1228638C 接触探针 The touch probe |
| 11/23/2005 | CN1228383C Paste for connecting circuit, anisotropic conductive paste and applications thereof |
| 11/23/2005 | CN1228178C Method of manufacturing ceramic laminated body |
| 11/23/2005 | CN1228165C Device and method for printing marks on copper coated laminating boards |
| 11/22/2005 | US6968300 Computer system and printed circuit board manufactured in accordance with a quasi-Monte Carlo simulation technique for multi-dimensional spaces |
| 11/22/2005 | US6967849 One system module for electric/electronic appliance |
| 11/22/2005 | US6967843 System and method for dissipating heat from an electronic board |
| 11/22/2005 | US6967705 Lamination of liquid crystal polymer dielectric films |
| 11/22/2005 | US6967307 Method and process of contact to a heat softened solder ball array |
| 11/22/2005 | US6967163 Metal film and manufacturing method therefor, and laminated ceramic electronic component and manufacturing method therefor |
| 11/22/2005 | US6967153 Bump fabrication process |
| 11/22/2005 | US6967152 Multilevel electronic circuit and method of making the same |
| 11/22/2005 | US6967138 Process for manufacturing a substrate with embedded capacitor |
| 11/22/2005 | US6967124 Imprinted integrated circuit substrate and method for imprinting an integrated circuit substrate |
| 11/22/2005 | US6966787 Clockspring with flat cable |