Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
11/2005
11/09/2005EP1592825A1 Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit
11/09/2005EP1525085B1 Method and device for forming a body having a three-dimensional structure
11/09/2005EP1430532B1 Encapsulation of pin solder for maintaining accuracy in pin position
11/09/2005EP1309447A4 Lead-free alloys with improved wetting properties
11/09/2005EP0985132B1 Method of and wire bonding apparatus for manufacturing a transducer
11/09/2005EP0903386B1 Pressure-sensitive adhesive having excellent heat resistance and heat conductivity, adhesive sheets, and method of securing electronic component to heat-radiating member therewith
11/09/2005EP0855049B1 A method of forming a monolayer of particles, and products formed thereby
11/09/2005CN1695411A Apparatus and method for replacement of defective parts of pcb panel
11/09/2005CN1695408A Multilayer printed board, electronic apparatus, and packaging method
11/09/2005CN1695407A Printing process and solder mask ink composition
11/09/2005CN1695406A Plating process
11/09/2005CN1695209A Techniques for fabricating a resistor on a flexible base material
11/09/2005CN1694934A Process and ink for making electronic devices
11/09/2005CN1694612A Electronic component with shielding case and method of manufacturing the same
11/09/2005CN1694606A Printed circuit board and method for processing printed circuit board and method for manufacturing printed circuit board
11/09/2005CN1694605A Method for manufacturing double-sided printed circuit board
11/09/2005CN1694604A Wired circuit board and production method thereof
11/09/2005CN1694603A Electrolytic gold plating method of printed circuit board
11/09/2005CN1694602A Flat flexible circuit board strucure with shield plane layer
11/09/2005CN1693955A Method for forming pattern using printing method
11/09/2005CN1693947A Printed circuit board and liquid crystal display device having the same
11/09/2005CN1693404A Compositions for use in electronics devices
11/09/2005CN1693167A Feeding device with quantitative
11/09/2005CN1226907C Sheet adhesive machine and suction nozzle of sheet adhesive machine
11/09/2005CN1226905C Electronic element and its producing method
11/09/2005CN1226904C Power source and stratum of PCB
11/09/2005CN1226752C Composite particle for dielectrics, ultramicro particulate composite resin particle, composition for forming dielectrics and use thereof
11/09/2005CN1226671C Optical amplification regulating system
11/09/2005CN1226668C Mask. wiring substrate for brazing filler metal printing and producing method thereof, and their application
11/09/2005CN1226592C Position detecting method, position detecting apparatus and method for positioning printed circuit board
11/09/2005CN1226346C Resin composition for insulation and laminated body using said composition
11/09/2005CN1226140C Freestanding reactive multilayer foils manufacturing method and producted product
11/08/2005US6963494 Blind hole termination of pin to pcb
11/08/2005US6963493 Multilayer electronic devices with via components
11/08/2005US6963491 Expansion board apparatus and removing method
11/08/2005US6963483 Self-aligned coaxial via capacitors
11/08/2005US6963438 Rearview mirror constructed for efficient assembly
11/08/2005US6963265 Ball grid array resistor network having a ground plane
11/08/2005US6963209 Apparatus and method for calibrating equipment for high frequency measurements
11/08/2005US6963143 Method of ball grid array (BGA) alignment, method of testing, alignment apparatus and semiconductor device assembly
11/08/2005US6963128 Vertically mountable and alignable semiconductor device assembly
11/08/2005US6963034 Multilayer printed board with a double plane spiral interconnection structure
11/08/2005US6963033 Ball grid array attaching means having improved reliability and method of manufacturing same
11/08/2005US6963028 IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC wireless
11/08/2005US6962872 High density chip carrier with integrated passive devices
11/08/2005US6962770 Photosensitive paste; exposure, development, baking cycles
11/08/2005US6962642 Treating copper surfaces for electronic applications
11/08/2005US6962628 Method of treating epoxy resin-cured product
11/08/2005US6962147 Dicing saw blade positioning apparatus and methods independent of blade thickness via constrained biasing elements
11/08/2005US6962111 Screen-printing plate, manufacturing method of laminated-ceramic electronic devices, and laminated-ceramic electronic device manufactured by the method
11/08/2005US6961995 Absorbs the stresses that occur between a chip carrier and a printed wiring board during thermal cycling
11/08/2005US6961990 Method of manufacturing multilayer microwave couplers using vertically-connected transmission line structures
11/08/2005CA2171749C Electrical assembly comprising a ptc resistive element
11/03/2005WO2005104639A1 Multilayer ceramic board, manufacturing method thereof and piezoelectric resonant component
11/03/2005WO2005104638A1 Wiring board and method for producing the same
11/03/2005WO2005104637A1 Method and apparatus for accurately applying structures to a substrate
11/03/2005WO2005104636A1 Electronics module and method for manufacturing the same
11/03/2005WO2005104635A1 Heat conduction from an embedded component
11/03/2005WO2005104303A1 Wiring branch unit
11/03/2005WO2005104230A1 Wiring board, semiconductor device and wiring board manufacturing method
11/03/2005WO2005104229A1 Power semiconductor arrangement
11/03/2005WO2005104227A1 Stacked module systems and methods
11/03/2005WO2005104226A2 Method for production of through-contacts in a plastic mass and semiconductor component with said through contacts
11/03/2005WO2005104222A1 Process for forming a solder mask, apparatus thereof and process for forming electric-circuit patterned internal dielectric layer
11/03/2005WO2005104149A1 Systems and methods for blocking microwave propagation in parallel plate structures utilizing cluster vias
11/03/2005WO2005103824A2 Method of forming a metal pattern on a substrate
11/03/2005WO2005103822A2 Photosensitive resin composition, cured product thereof and production method of printed circuit board using the same
11/03/2005WO2005103649A1 Method of assessing the risk of whiskers appearing on the surface of a metallic deposit
11/03/2005WO2005103564A1 Led light source module packaged with metal
11/03/2005WO2005102629A1 Punching machine for flexible printed circuit board
11/03/2005WO2005102594A1 Solder and mounted article using same
11/03/2005WO2005083164A3 Electrical components and circuits constructed as textiles
11/03/2005WO2005072031A3 Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
11/03/2005WO2004079795A3 Coaxial waveguide microstructures and methods of formation thereof
11/03/2005US20050245172 Dicing saw blade positioning apparatus and methods independent of blade thickness via constrained biasing elements
11/03/2005US20050245137 Memory module, socket and mounting method providing improved heat dissipating characteristics
11/03/2005US20050245121 Solder ball formation structure for a terminal socket
11/03/2005US20050245118 Flex circuit assembly
11/03/2005US20050245111 Method and system for making and using an electrical connection between a conductor and a circuit board
11/03/2005US20050245105 Interconnection system
11/03/2005US20050245103 Transceiver module having a flexible circuit
11/03/2005US20050245085 Method for forming pattern using printing method
11/03/2005US20050245084 Filling high aspect ratio openings by enhanced electrochemical deposition (ECD)
11/03/2005US20050245079 Basic meterial for patterning and patterning method
11/03/2005US20050245059 Method for making an interconnect pad
11/03/2005US20050245004 Method for manufacturing wiring substrate and method for manufacturing electronic device
11/03/2005US20050245000 PC adapter cards and method of manufacturing the same
11/03/2005US20050244999 Method, system and apparatus for constructing resistive vias
11/03/2005US20050244622 Method for processing by laser, apparatus for processing by laser, and three-dimensional structure
11/03/2005US20050244621 Printed circuit board and method for processing printed circuit board
11/03/2005US20050244620 Wired circuit board and production method thereof
11/03/2005US20050243536 Printed circuit board, parts mounting method and mounting position verifying method
11/03/2005US20050243530 Printed circuit board and liquid crystal display device having the same
11/03/2005US20050243528 Board pieces and composite wiring boards using the board pieces
11/03/2005US20050243527 Printed wiring board with enhanced structural integrity
11/03/2005US20050243472 Head stack assembly and manufacturing thereof
11/03/2005US20050242997 Dielectric sheet, method for fabricating the dielectric sheet, printed circuit and patch antenna using the dielectric sheet, and method for fabricating the printed circuit
11/03/2005US20050242443 A palladium layer and a gold layer are formed by an electrolytic plating on a solderd part having a nickel layer; thickness of the palladium layer is 0.007 to 0.1 mu m; thickness of the gold layer is 0.003 to 0.02 mu; the gold layer partially laps a palladium strike surface
11/03/2005US20050242437 Method and apparatus for supporting microelectronic substrates
11/03/2005US20050242434 Electronic packaging using conductive interposer connector
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