Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
12/2005
12/14/2005EP1604751A1 Punching device and punch therefor
12/14/2005EP1604746A1 Vibrator and portable terminal device mounted with the vibrator
12/14/2005EP1604556A1 Electronic card with wire-braced structure
12/14/2005EP1604554A1 Domed circuit board of an antenna amplifier for a vehicle antenna device
12/14/2005EP1604553A1 Pcb connector
12/14/2005EP1604178A2 Liquid level sending unit with flexible sensor board
12/14/2005EP1603985A1 A conductive adhesive composition
12/14/2005EP1603732A1 System and method for bending a substantially rigid substrate
12/14/2005EP1603722A1 Breaking device for separating ceramic printed circuit boards
12/14/2005EP1549962A4 Construction structures and manufacturing processes for probe card assemblies and packages having wafer level springs
12/14/2005EP1518145B1 Display cell, in particular liquid crystal, or photovoltaic cell comprising means for connection to an electronic control circuit
12/14/2005EP1297086B1 Polymeric materials to metal surfaces adhesion process
12/14/2005CN2746605Y 电连接器 The electrical connector
12/14/2005CN2746401Y Electrical parameter test equipment
12/14/2005CN1709017A Method for manufacturing printed wiring board
12/14/2005CN1709016A Method for manufacturing printed circuit board
12/14/2005CN1709015A Method for manufacturing printed circuit board
12/14/2005CN1709009A Transparent window with non-transparent contact surface for a soldering bonding
12/14/2005CN1708841A Film carrier tape for mounting electronic component
12/14/2005CN1708555A Thermally vanishing material, transfer sheet using the same, and method for forming pattern
12/14/2005CN1708207A Method for preventing interwelding pad of circuit board from generating
12/14/2005CN1708206A Chip-component-mounted device and semiconductor device
12/14/2005CN1707779A 半导体装置 Semiconductor device
12/14/2005CN1707767A Wiring substrate and method for manufacturing the same
12/14/2005CN1232160C Screen printing method and device
12/14/2005CN1231824C Flux coating amount controlling system
12/14/2005CN1231815C Ultraviolet-curing resin composition and photo solder resist ink containing the same
12/14/2005CN1231524C Process for producing novel silicone polymer, silicone polymer produced by the process, thermosetting resin composition ,resin film, metal foil with insulating. material, insulating film with metal
12/13/2005US6975518 Printed circuit board housing clamp
12/13/2005US6975200 Microconverter and laminated magnetic-core inductor
12/13/2005US6975024 Hybrid integrated circuit device and manufacturing method thereof
12/13/2005US6975021 Carrier for substrate film
12/13/2005US6974916 Laminated ceramic electronic component having via-hole conductors with different sectional sizes
12/13/2005US6974915 Printed wiring board interposer sub-assembly and method
12/13/2005US6974909 IC module, and wireless information-storage medium and wireless information-transmitting/receiving apparatus including the IC module
12/13/2005US6974776 Activation plate for electroless and immersion plating of integrated circuits
12/13/2005US6974765 Encapsulation of pin solder for maintaining accuracy in pin position
12/13/2005US6974727 Method of manufacturing a hybrid integrated circuit device
12/13/2005US6974615 Binding member for coaxial cable and an electric connector for coaxial cable both using resin solder, and a method of connecting the binding member to coaxial cable or the electric connector
12/13/2005US6974551 Hydrophobic composition and use on a substrate for preventing ice formation and corrosion
12/13/2005US6974547 inorganic high dielectric film on metal electrode; metal oxide adhesive on an organic polymer or metal foil substrate; not broken when bent; integrated circuit cards
12/13/2005US6974515 Ceramic substrate and method of manufacturing same
12/13/2005US6974346 Land grid array connector assembly with pick up cap
12/13/2005US6974345 Land grid array connector with reinforcement stiffener
12/13/2005US6974333 High-density connection between multiple circuit boards
12/13/2005US6974330 Electronic devices incorporating electrical interconnections with improved reliability and methods of fabricating same
12/13/2005US6974263 Optical data link
12/13/2005US6974071 Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components
12/13/2005US6974069 Solder ball attaching system and method
12/13/2005US6973722 Release height adjustment of stressy metal devices by annealing before and after release
12/13/2005US6973720 Method for manufacturing a connector integrated with a LED
12/13/2005US6973719 Method of making a thermal management for a circuit board panel
12/13/2005US6973717 Method for producing a semiconductor device in chip format
12/13/2005US6973716 Electronic circuit construction method, as for a wireless RF tag
12/13/2005US6973710 Method and apparatus for making devices
12/08/2005WO2005117510A1 Multilayer printed wiring board
12/08/2005WO2005117508A2 Printed wiring board with conductive constraining core including resin filled channels
12/08/2005WO2005117149A1 Fixing device and fixing structure for light emitting diode
12/08/2005WO2005117094A1 Plasma processing method and method for fabricating electronic component module using the same
12/08/2005WO2005116976A2 Force sensing pointing device with click function
12/08/2005WO2005116920A1 Secure electronic entity such as a passport
12/08/2005WO2005116774A1 Pattern formation method
12/08/2005WO2005116763A1 Method of forming graft pattern, graft pattern material, method of lithography, method of forming conductive pattern, conductive pattern, process for producing color filter, color filter and process for producing microlens
12/08/2005WO2005116760A2 Photosensitive resin composition, and cured product and use thereof
12/08/2005WO2005116670A1 Circuit board inspecting apparatus and circuit board inspecting method
12/08/2005WO2005116512A1 Multipurpose spacer support for maintaining and positioning complexly shaped parts
12/08/2005WO2005116152A1 Block copolymerized polyimide ink composition for printing
12/08/2005WO2005115751A1 Mold releasing laminated film
12/08/2005WO2005115679A1 Composition of a solder, and method of manufacturing a solder connection
12/08/2005WO2005115669A2 Selective soldering apparatus with jet wave solder jet and nitrogen preheat
12/08/2005WO2005115637A1 Forming method, unit and material for pattern films, and product gained by said method
12/08/2005WO2005096458B1 Light beam bonding
12/08/2005WO2005079353A3 Nanoscale metal paste for interconnect and method of use
12/08/2005WO2005077033A3 Led burning prevention
12/08/2005WO2005059823A3 Systems and methods for detecting defects in printed solder paste
12/08/2005WO2005043699A3 Laser processing of a locally heated target material
12/08/2005WO2005028176A3 Process for forming a patterned thin film structure for in-mold decoration
12/08/2005WO2004063415A3 Methods for coating surfaces with metal and products made thereby
12/08/2005US20050273731 Operation-related information display method and operation-related information display system
12/08/2005US20050272608 Polyimide metal laminate and its production method
12/08/2005US20050272307 Mounting element
12/08/2005US20050272277 Method of manufacturing annular oblique light illumination apparatus and flexible wiring substrate
12/08/2005US20050272276 Wired circuit board and connection structure of wired circuit board
12/08/2005US20050272252 Circuit device
12/08/2005US20050272249 Method and system for producing conductive patterns on a substrate
12/08/2005US20050272223 Method for dicing substrate
12/08/2005US20050271828 Wiring board and production method thereof, and semiconductor apparatus
12/08/2005US20050271330 Three-dimensional mounted assembly and optical transmission device
12/08/2005US20050270875 Hierarchical module
12/08/2005US20050270757 Electronic devices with small functional elements supported on a carrier
12/08/2005US20050270755 Method for preventing pins of semiconductor package from short circuit during soldering
12/08/2005US20050270752 Electronic devices with small functional elements supported on a carrier
12/08/2005US20050270748 Substrate structure integrated with passive components
12/08/2005US20050270621 Rearview assembly having an integral crush zone
12/08/2005US20050270620 Rearview mirror element having a circuit mounted to the rear surface of the element
12/08/2005US20050270518 Method for determining position of reference point
12/08/2005US20050270334 Ink jet nozzle arrangement having paddle forming a portion of a wall
12/08/2005US20050270136 Device comprising a circuit arrangement with an inductive element
12/08/2005US20050270017 System and method for automatically comparing test points of a PCB
12/08/2005US20050269714 Semiconductor device components with structures for stabilizing the semiconductor device components upon flip-chip arrangement with high-level substrates