| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/22/2005 | WO2005122660A1 Aluminum substrate for printed circuits, manufacturing method thereof, printed circuit board, and manufacturing method thereof |
| 12/22/2005 | WO2005122659A1 Method for coating one side of a printed circuit board, coated printed circuit board and coating material |
| 12/22/2005 | WO2005122658A1 Solder paste lateral flow and redistribution system and methods of same |
| 12/22/2005 | WO2005122657A1 Rigid-flex wiring board and method for producing same |
| 12/22/2005 | WO2005122656A1 Flex-rigid wiring board and manufacturing method thereof |
| 12/22/2005 | WO2005122655A2 Pcb including a star shaped through-hole solder pad |
| 12/22/2005 | WO2005122247A1 Composite electronic component |
| 12/22/2005 | WO2005122237A1 Component mounting method and component mounting apparatus |
| 12/22/2005 | WO2005121266A1 Adhesive composition, circuit connecting material, connecting structure for circuit member, and semiconductor device |
| 12/22/2005 | WO2005121101A1 Phenylnaphthylimidazoles for use on copper surfaces during soldering |
| 12/22/2005 | WO2005120823A2 Non-covalent bonding agent for carbon nanotube reinforced polymer composites |
| 12/22/2005 | WO2005099028A3 Embedded capacitors using conductor filled vias |
| 12/22/2005 | WO2005081596A3 Preferential ground and via exit structures for printed circuit boards |
| 12/22/2005 | WO2005076679A3 Method for disposing a conductor structure on a substrate, and substrate comprising said conductor structure |
| 12/22/2005 | WO2004028223A3 Electronics component and method for fabricating same |
| 12/22/2005 | US20050283794 Anti-hacking printed circuit board having high-molecular material deposited thereon and deposition method for the same |
| 12/22/2005 | US20050283117 Systems and methods for detecting tissue contact and needle penetration depth |
| 12/22/2005 | US20050282924 Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device |
| 12/22/2005 | US20050282923 Photosensitive resin compositon comprising a halogen-free colorant |
| 12/22/2005 | US20050282427 Guide pin and guide pin assembly |
| 12/22/2005 | US20050282415 Printed circuit boards having improved solder pads |
| 12/22/2005 | US20050282411 Stud bump socket |
| 12/22/2005 | US20050282410 Flexible contact-connection device |
| 12/22/2005 | US20050282385 Conductive material patterning methods |
| 12/22/2005 | US20050282383 Systems for forming insulative coatings for via holes in semiconductor devices |
| 12/22/2005 | US20050282315 High-reliability solder joint for printed circuit board and semiconductor package module using the same |
| 12/22/2005 | US20050282314 Printed circuit boards and methods for fabricating the same |
| 12/22/2005 | US20050282313 Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly |
| 12/22/2005 | US20050282311 Flip-chip substrate and flip-chip bonding process thereof |
| 12/22/2005 | US20050282309 Circuit board with embedded passive component and fabrication process thereof |
| 12/22/2005 | US20050282088 Production method of suspension board with circuit |
| 12/22/2005 | US20050282002 Electrically anisotropically conductive hotmelt adhesive for implanting electrical modules in a card body |
| 12/22/2005 | US20050281995 Sheet material and wiring board |
| 12/22/2005 | US20050281981 Fixtures and methods for facilitating the fabrication of devices having thin film materials |
| 12/22/2005 | US20050281528 Optical transceiver, connector, substrate unit, optical transmitter, optical receiver, and semiconductor device |
| 12/22/2005 | US20050281033 LED automotive headlamp |
| 12/22/2005 | US20050281009 Electronic circuit unit for internal combustion engine |
| 12/22/2005 | US20050280948 Disk drive and arm coil support assembly |
| 12/22/2005 | US20050280946 Wiring board, magnetic disc apparatus, and method of manufacturing wiring board |
| 12/22/2005 | US20050280944 Method for providing electrical crossover in laminated structure |
| 12/22/2005 | US20050280940 System and method for improving suspension-to-slider attachment in a hard disk drive |
| 12/22/2005 | US20050280498 Conductive base material with resistance layer and circuit board material with resistance layer |
| 12/22/2005 | US20050280490 Semiconductor and electronic device with spring terminal |
| 12/22/2005 | US20050280161 Unmolded package for a semiconductor device |
| 12/22/2005 | US20050280158 Prefabricated semiconductor chip carrier |
| 12/22/2005 | US20050280153 Wired circuit forming board, wired circuit board, and thin metal layer forming method |
| 12/22/2005 | US20050280148 Device mounting board and semiconductor apparatus using the same |
| 12/22/2005 | US20050280136 Method for producing Z-axis interconnection assembly of printed wiring board elements |
| 12/22/2005 | US20050280135 Stacking system and method |
| 12/22/2005 | US20050280130 Printed wiring board and production method for printed wiring board |
| 12/22/2005 | US20050280112 Semiconductor assembly having substrate with electroplated contact pads |
| 12/22/2005 | US20050279813 Automated ball mounting process and system with solder ball testing |
| 12/22/2005 | US20050279809 Optical structures including liquid bumps and related methods |
| 12/22/2005 | US20050279640 Method of forming a lead-free bump and a plating apparatus therefor |
| 12/22/2005 | US20050279530 Compliant spring contacts, methods of making, and utilization as electrical contacts in probe card and flip-chip applications |
| 12/22/2005 | US20050279529 Wiring board, magnetic disc apparatus, and production method of wiring board |
| 12/22/2005 | US20050279253 Resin surface treating agent and resin surface treatment |
| 12/22/2005 | US20050278944 Integrated circuit package separators |
| 12/22/2005 | DE19832011B4 Flachbandleitung mit einem zum lösbaren Verbinden vorgesehenen Anschlußbereich Ribbon cable with a provided for releasably connecting terminal region |
| 12/22/2005 | DE10393589T5 Leiterplatte und Verfahren zu deren Herstellung Printed circuit board and process for their preparation |
| 12/22/2005 | DE10355921B4 Elektrische Schaltungsanordnung mit einem elektronischen Chip in einer Aufnahmevorrichtung des Schaltungsträgers An electrical circuit arrangement with an electronic chip in a receiving device of the circuit substrate |
| 12/22/2005 | DE10257111B4 Chipkarte und Verfahren zur Herstellung einer Chipkarte Chip card and method for manufacturing a smart card |
| 12/22/2005 | DE102005025556A1 Laserbearbeitungsvorrichtung Laser processing apparatus |
| 12/22/2005 | DE102005023455A1 Box für elektrische Verbindungen und Verfahren zur Herstellung derselben Box for electric connections and methods of making the same |
| 12/22/2005 | DE102004029894B3 Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von flachem Behandlungsgut Apparatus and method for electrolytic treatment of electrically mutually insulated, electrically conductive structures on surfaces of a flat item to be treated |
| 12/22/2005 | DE102004028603A1 Verfahren zur Beschichtung einer Seite einer Leiterplatte, beschichtete Leiterplatte sowie Beschichtungs-Material A method for coating one side of a printed circuit board, coated circuit board and coating material |
| 12/22/2005 | DE102004025609A1 Anordnung in Schraub- Druckkontaktierung mit einem Leistungshalbleitermodul Assembly screw in pressure contact with a power semiconductor module |
| 12/21/2005 | EP1608211A2 Wired circuit forming board, wired circuit board and thin metal layer forming method |
| 12/21/2005 | EP1608210A1 Wiring Board, Magnetic Disc Apparatus, and Method of Manufacturing Wiring Board |
| 12/21/2005 | EP1608209A1 Conductive base material with resistance layer and circuit board material with resistance layer |
| 12/21/2005 | EP1608016A2 Capacitor-built-in-type wiring substrate, printed wiring substrate, and capacitor |
| 12/21/2005 | EP1607457A2 Electrical anisotropic conductable hot-melt adhesive for implanting electric modules in a card body |
| 12/21/2005 | EP1607435A1 Treatment of resin surfaces with aqueous Cerium solutions |
| 12/21/2005 | EP1606982A2 Method and device for electrically and mechanically connecting two printed boards |
| 12/21/2005 | EP1606981A2 Method and device for aligning a substrate and a printing screen during solder paste printing |
| 12/21/2005 | EP1606551A2 Led symbol signal |
| 12/21/2005 | EP1606431A1 Solution for etching copper surfaces and method of depositing metal on copper surfaces |
| 12/21/2005 | EP1606358A2 Powder coating and process for the preparation of thin layers in the manufacture of printed circuit boards |
| 12/21/2005 | EP1019925A4 Microelectronic component carrier and method of its manufacture |
| 12/21/2005 | EP0943170A4 Paired multi-layered dielectric independent passive component architecture resulting in differential and common mode filtering with surge protection in one integrated package |
| 12/21/2005 | CN2747823Y Working base for welding flexible circuit board |
| 12/21/2005 | CN2747822Y Fixer |
| 12/21/2005 | CN1711811A Multi-layer circuit assembly and process for preparing the same |
| 12/21/2005 | CN1711810A Method for controlled ink-jet spreading of polymers for the insulation and/or protection of printed circuits |
| 12/21/2005 | CN1711636A Components, methods and assemblies for multi-chip packages |
| 12/21/2005 | CN1711150A Method for boring holes in a substrate, especially in an electrical circuit substrate, by means of a laser beam |
| 12/21/2005 | CN1711140A Nozzle arrangement |
| 12/21/2005 | CN1711011A Method for realizing Fanout design in PCB |
| 12/21/2005 | CN1711010A Electronic circuit board of integrated fuel cell |
| 12/21/2005 | CN1710003A Electrically anisotropically conductive hotmelt adhesive |
| 12/21/2005 | CN1709949A Resin surface treating agent and resin surface treatment |
| 12/21/2005 | CN1233205C Mfg. method of circuit device |
| 12/21/2005 | CN1233204C Screen printing device and method |
| 12/21/2005 | CN1233203C Electronic circuit unit |
| 12/21/2005 | CN1233029C Soldered ball embedding device |
| 12/21/2005 | CN1232885C Positive type photosensitive epoxy resin composition and printed circuit board using same |
| 12/21/2005 | CN1232884C Photoresisting agent composition |
| 12/20/2005 | US6978058 Multi-layer PCB and method for coupling block type multichannel optical signals |
| 12/20/2005 | US6977820 Electronic circuit board |
| 12/20/2005 | US6977707 Display device and wiring substrate including electric wiring formed of conductive film |