Patents
Sitemap › H05 - Electric techniques not otherwise provided for › H05K - Printed circuits; Casings or constructional details of electric apparatus; Manufacture of assemblages of electrical components › H05K 3 - Apparatus or processes for manufacturing printed circuits
Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473)
10/2005
10/12/2005CN1681375A Method for forming film pattern, method for manufacturing device, electro-optical apparatus, and electronic apparatus
10/12/2005CN1681374A Three-dimensional mounting structure and method for producing the same
10/12/2005CN1681372A 电路衬底 Circuit substrate
10/12/2005CN1681371A 电路衬底 Circuit substrate
10/12/2005CN1681169A Thermal pressing apparatus and method, flexible circuit substrate and electronic device therewith
10/12/2005CN1681099A Interconnections for flip-chip using lead-free solders and having reaction barrier layers
10/12/2005CN1681096A Chip-embedded modular circuit board
10/12/2005CN1681056A Electronic component and manufacturing method of electronic component
10/12/2005CN1680846A Panel display plate and its assembling method
10/12/2005CN1680621A Method for treating laser-structured plastic surfaces
10/12/2005CN1680067A Laser machining apparatus for sheet-like workpiece
10/12/2005CN1223255C Surface mount machine correcting instrument
10/12/2005CN1223252C Method for forming wire-scribing filament circuit pattern and wire-scribing board, smart card made thereby
10/12/2005CN1223250C Multilayer wiring substrate and method for producing the same
10/12/2005CN1223249C Low side surface internet structure
10/12/2005CN1223248C Transmission belt type vacuum applicator and coating method of printing circuit board anti-corrosion drying film
10/12/2005CN1223247C Method for producing etched circuit
10/12/2005CN1223246C Method for designing printed circuit board and its equipment
10/12/2005CN1223245C Metal substrate repairing method and apparatus thereof
10/12/2005CN1223244C Double-sided wiring board and its mfg. method
10/12/2005CN1223243C Flexible printed substrate
10/12/2005CN1223107C Energy conditioning circuit assembly
10/12/2005CN1223097C Thick film millimeter wave transceiver module
10/12/2005CN1222995C Mixed IC device
10/12/2005CN1222991C Wiring method and element arragning method using the same, and method of producing image display devices
10/12/2005CN1222990C A method and an arrangement for providing vias in printed circuit boards
10/12/2005CN1222989C Ultrasonic generator, multi-layer flexible circuit board and manufacture thereof
10/12/2005CN1222918C Wiring substrate and image display using same
10/12/2005CN1222636C Pretreatment solution and pretreatment process of chemical nickel plating
10/12/2005CN1222413C Pattern forming apparatus and method, mfg. method of conducting film wiring and electronic device
10/11/2005US6954362 System and method for reducing apparent height of a board system
10/11/2005US6954126 Lead-less surface mount reed relay
10/11/2005US6954013 Controller and rectifier for an electrical machine, and electrical machine
10/11/2005US6953998 Unmolded package for a semiconductor device
10/11/2005US6953989 Film carrier tape for mounting electronic devices thereon and final defect marking method using the same
10/11/2005US6953986 Leadframes for high adhesion semiconductor devices and method of fabrication
10/11/2005US6953899 Wiring board comprising granular magnetic film
10/11/2005US6953893 Circuit board for connecting an integrated circuit to a support and IC BGA package using same
10/11/2005US6953892 Connection housing for an electronic component
10/11/2005US6953712 Circuit device manufacturing method
10/11/2005US6953698 Methods for making microwave circuits
10/11/2005US6953600 Complex of an amine compound and aluminum hydride and an organic solvent used to form wiring or an electrode which can be suitably used in a variety of electronic devices
10/11/2005US6953349 Multilayer circuit board for high frequency signals
10/11/2005US6953291 Compact package design for vertical cavity surface emitting laser array to optical fiber cable connection
10/11/2005US6953145 Soldering method for mounting electric components
10/11/2005US6952871 comprises carrying out a first selective engraving by machining/chemical attack over one face of a panel made of electro-conducting material to form reliefs corresponding to future tracks and some depressions corresponding to future tracks
10/11/2005US6952870 Integrated circuit wiring method
10/06/2005WO2005094149A2 Support platform for electrical components, and module comprising said support platform
10/06/2005WO2005094148A1 Multilayer wiring board and manufacturing method thereof
10/06/2005WO2005094147A1 A process of forming a solder mask
10/06/2005WO2005094146A1 Circuit board panel with a plurality of circuit carriers, circuit carrier and method for individually separating circuit carriers belonging to a circuit board panel
10/06/2005WO2005094145A1 Device provided with an electric motor and a main printed circuit board and mounting method
10/06/2005WO2005094144A1 Circuit device and method for manufacturing same
10/06/2005WO2005094143A1 Flexible circuit board assembly
10/06/2005WO2005093827A1 Through wiring board and method for producing the same
10/06/2005WO2005093817A1 Semiconductor device and process for manufacturing the same
10/06/2005WO2005093793A1 Process for forming permanent pattern
10/06/2005WO2005093115A1 Process for producing austenite stainless steel, solder melting vessel and autosoldering apparatus
10/06/2005WO2005093009A1 Etched dielectric film in microfluidic devices
10/06/2005WO2005092945A1 Resin composition, metal foil with resin, insulating sheet with base material and multilayer printed wiring board
10/06/2005WO2005092043A2 Process for fabrication of printed circuit boards
10/06/2005WO2005091955A2 Conductive circuits or cables manufactured from conductive loaded resin-based materials
10/06/2005WO2005091817A2 Method and apparatus for venting an electronic control module
10/06/2005WO2005074336A3 Multilayered circuit board for high-speed, differential signals
10/06/2005WO2005074026A3 Tin-based coating of electronic component
10/06/2005WO2005041265A3 Paste for forming an interconnect and interconnect formed from the paste
10/06/2005WO2004113594A3 Metal plating of conductive loaded resin-based materials for low cost manufacturing of conductive articles
10/06/2005US20050221680 Electrical interconnection devices incorporating redundant contact points for reducing capacitive stubs and improved signal integrity
10/06/2005US20050221637 Dual segment molded lead frame connector for optical transceiver modules
10/06/2005US20050221636 Surface mount connector and circuit board assembly with same
10/06/2005US20050221635 Micro-bumps to enhance lga interconnections
10/06/2005US20050221633 High-density connection between multiple circuit boards
10/06/2005US20050221605 Microelectronic packages including nanocomposite dielectric build-up materials and nanocomposite solder resist
10/06/2005US20050221597 Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor
10/06/2005US20050221555 Embedded capacitors using conductor filled vias
10/06/2005US20050221538 Resin encapsulated semiconductor device and the production method
10/06/2005US20050221537 Plastic packaging with high heat dissipation and method for the same
10/06/2005US20050221534 Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same
10/06/2005US20050221531 Carrier substrates and conductive elements thereof
10/06/2005US20050221524 Method for forming film pattern, method for manufacturing device, electro-optical apparatus, electronic apparatus, and method for manufacturing active matrix substrate
10/06/2005US20050221235 Applying alternating material layers on a ridge and then removing some of the alternating layers to expose edges; exposed edges can be of nearly arbitrary length and curvature; edges can be used to fabricate an array of nano-scale-width curved wires
10/06/2005US20050221232 Method of forming a metal pattern on a substrate
10/06/2005US20050221112 Microtools for package substrate patterning
10/06/2005US20050221103 Polyimide complex sheet
10/06/2005US20050221101 Method of manufacturing laminated material for security tag
10/06/2005US20050221080 polyimide film with a metal layer laminated on one face and an adhesive layer laminated on the other face; printed wiring boards; high heat resistance, wiring patterns with narrow pitches, vias with a small diameter
10/06/2005US20050221068 Multilayer ceramic substrate and method for manufacture thereof
10/06/2005US20050221066 Carrier substrate with a thermochromatic coating
10/06/2005US20050219829 Printed circuit board and electronic apparatus using the same
10/06/2005US20050219774 Method for manufacture of multilayer ceramic substrate and multilayer ceramic substrate
10/06/2005US20050219738 Insulation sheet and disk device provided with the same
10/06/2005US20050219349 Thermal head having adhesive interposed between adhesion surface of heat-dissipation plate and adhesion surface of head substrate and method for producing the same
10/06/2005US20050219348 Thermal head having adhesive layer partially disposed on heat sink and method for manufacturing such thermal head
10/06/2005US20050219297 Droplet discharge control method and liquid discharge apparatus
10/06/2005US20050219296 Droplet discharge control method and liquid discharge apparatus
10/06/2005US20050219177 Liquid crystal display device
10/06/2005US20050219150 Display apparatus
10/06/2005US20050219009 Circuitry module
10/06/2005US20050218528 Capillary underfill channel
10/06/2005US20050218525 Soldered material, semiconductor device, method of soldering, and method of manufacturing semiconductor device
1 ... 498 499 500 501 502 503 504 505 506 507 508 509 510 511 512 513 514 515 516 517 518 ... 1185