| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 10/05/2005 | CN1221990C Coil assembly with printed circuit board and coil frame |
| 10/05/2005 | CN1221926C Method and device for examining circuit board in pre-determined area of said circuit |
| 10/05/2005 | CN1221611C Light solidified and heat solidified resin composition and method for producing printed circuit board |
| 10/05/2005 | CN1221388C Liquid filling method of drop spray nozzle |
| 10/04/2005 | US6952250 Pressure-welded structure of flexible circuit boards |
| 10/04/2005 | US6952104 Inspection method and apparatus for testing fine pitch traces |
| 10/04/2005 | US6952054 Semiconductor package having interconnect with conductive members |
| 10/04/2005 | US6952049 Capacitor-built-in type printed wiring substrate, printed wiring substrate, and capacitor |
| 10/04/2005 | US6951980 dielectrics; integrated circuits; semiconductors |
| 10/04/2005 | US6951778 Edge-sealed substrates and methods for effecting the same |
| 10/04/2005 | US6951777 Methods for forming a slot with a laterally recessed area at an end thereof through an interposer or other carrier substrate |
| 10/04/2005 | US6951707 Applying cirable coating to electroconductive substrate; then photoresist; imaging zones; heating; curing; development |
| 10/04/2005 | US6951684 Electrical interconnect using locally conductive adhesive |
| 10/04/2005 | US6951666 Metal precursor compound; and agent that reduces the conversion temperature of said precursor by at least 25 degrees C.; viscosity of at least 1000 centipoise |
| 10/04/2005 | US6951621 Method for forming a product sensor, and a product sensor |
| 10/04/2005 | US6951604 Production method for flexible printed board |
| 10/04/2005 | US6951596 RFID label technique |
| 10/04/2005 | US6951549 Systems and methods for detecting tissue contact and needle penetration depth |
| 10/04/2005 | US6951466 Attachment plate for directly mating circuit boards |
| 10/04/2005 | US6951299 Tooling frame able to adhere to tin |
| 10/04/2005 | US6951175 Method for forming printing inspection data |
| 09/29/2005 | WO2005091692A1 Module heat radiation structure and control device using the same |
| 09/29/2005 | WO2005091689A1 Printed circuit board comprising at least one connection borehole for a connecting wire or pin of a wired electronic component |
| 09/29/2005 | WO2005091688A1 Flexible printed wiring board and process for producing the same |
| 09/29/2005 | WO2005091687A1 Micro plasma jet generator |
| 09/29/2005 | WO2005091370A1 Method for manufacturing integrated circuit |
| 09/29/2005 | WO2005091365A2 Coupling substrate for semiconductor components and method for the production thereof |
| 09/29/2005 | WO2005091354A1 Solder composition and method of bump formation therewith |
| 09/29/2005 | WO2005091313A1 Electronic component |
| 09/29/2005 | WO2005091213A1 Polymeric film substrate for use in radio-frequency responsive tags |
| 09/29/2005 | WO2005090957A1 Connector cable for probe |
| 09/29/2005 | WO2005090454A1 Method for forming surface graft, method for forming conductive film, method for forming metal pattern, method for forming multilayer wiring board, surface graft material, and conductive material |
| 09/29/2005 | WO2005090070A1 Method for producing substrate for flexible printed wiring board |
| 09/29/2005 | WO2005089999A1 Lead-free solder ball |
| 09/29/2005 | WO2005089510A2 Method of forming one or more base structures on an ltcc cofired module |
| 09/29/2005 | WO2005089204A2 Maximizing capacitance per unit area while minimizing signal transmission delay in pcb |
| 09/29/2005 | WO2005089076A2 Film type conductive sheet, method for manufacturing the same, and conductive tape using the same |
| 09/29/2005 | WO2005052688A3 Chemically amplified positive photosensitive thermosetting resin composition method of forming cured article and method of producing functional device |
| 09/29/2005 | WO2005046297A3 Measurement standard for testing optical recognition systems in smd assembly and method for producing said standard |
| 09/29/2005 | WO2005020249A3 Fabrication of thick film electrical components |
| 09/29/2005 | WO2004100253A3 Electronic component as well as system support and panel for the production thereof |
| 09/29/2005 | US20050215721 Pattern forming method, arranged fine particle pattern forming method, conductive pattern forming method, and conductive pattern material |
| 09/29/2005 | US20050215411 Dielectric ceramic material and multilayer ceramic substrate |
| 09/29/2005 | US20050215086 Sheet-form connector and production method and application therefor |
| 09/29/2005 | US20050215081 Method and apparatus for testing PCBA subcomponents |
| 09/29/2005 | US20050215045 Methods of forming bumps using barrier layers as etch masks and related structures |
| 09/29/2005 | US20050215043 Low fabrication cost, high performance, high reliability chip scale package |
| 09/29/2005 | US20050214981 Circuit device and manufacturing method thereof |
| 09/29/2005 | US20050214977 Microelectronic packaging and methods for thermally protecting package interconnects and components |
| 09/29/2005 | US20050214971 Bumping process, bump structure, packaging process and package structure |
| 09/29/2005 | US20050214693 Pattern forming method, graft pattern material, conductive pattern forming method and conductive pattern material |
| 09/29/2005 | US20050214621 Flat panel direct methanol fuel cell and method of making the same |
| 09/29/2005 | US20050214552 Flexible metal foil-polyimide laminate and making method |
| 09/29/2005 | US20050214551 Enhanced adhesion between the intermediate layer and the film by including in the intermediate layer Mo, Cr, Ni, and/or Si dispersed to a depth of 20 nm or less from the surface; and a copper or copper alloy conductive layer formed on the intermediate layer |
| 09/29/2005 | US20050214550 Method of forming a pattern, conductive patterned material, and method of forming a conductive pattern |
| 09/29/2005 | US20050214528 Transfer functional film, method for forming functional layer and object to which functional layer is applied |
| 09/29/2005 | US20050214526 Transparent, electrically conductive, coated polyester film, process for its production, and its use |
| 09/29/2005 | US20050214518 Circuit board, process for producing the same, and power module |
| 09/29/2005 | US20050214516 Multi-layer ceramic substrate and manufacturing method thereof |
| 09/29/2005 | US20050214508 Supported greensheet structure and method in MLC processing |
| 09/29/2005 | US20050214480 Nano-powder-based coating and ink compositions |
| 09/29/2005 | US20050214449 Solvent swell for texturing resinous material and desmearing and removing resinous material |
| 09/29/2005 | US20050214448 Compositions containing heterocyclic nitrogen compounds and glycols for texturing resinous material and desmearing and removing resinous meterial |
| 09/29/2005 | US20050213806 System and method for manufacturing printed circuit boards employing non-uniformly modified images |
| 09/29/2005 | US20050213788 Acoustically active element formed in a multi-layer circuit-board structure, a method for forming acoustically active element in a multi-layer circuit-board structure, and a multi-layer circuit-board structure |
| 09/29/2005 | US20050213308 Hybrid integrated circuit device |
| 09/29/2005 | US20050213307 Pivoting apparatus with a shielding function |
| 09/29/2005 | US20050213073 Machine for exposing printed circuit boards |
| 09/29/2005 | US20050212906 Methods and systems for processing a device, methods and systems for modeling same and the device |
| 09/29/2005 | US20050212864 Manufacturing method of ink-jet head |
| 09/29/2005 | US20050212858 Method for manufacturing ink-jet head |
| 09/29/2005 | US20050212837 Processing apparatus which performs predetermined processing while supplying a processing liquid to a substrate |
| 09/29/2005 | US20050212638 Lead-in for electronic bobbins |
| 09/29/2005 | US20050212624 Microwave circuit |
| 09/29/2005 | US20050212178 Capacitive measurement method and system for nanoimprint process monitoring |
| 09/29/2005 | US20050212140 Semiconductor chip mounting substrate, a method of producing the same, and a method of mounting a semiconductor chip |
| 09/29/2005 | US20050212130 Semiconductor chip, semiconductor device, method for producing semiconductor device, and electronic equipment |
| 09/29/2005 | US20050212122 Multi-layer fet array and method of fabricating |
| 09/29/2005 | US20050212120 Electronic assembly with integrated IO and power contacts |
| 09/29/2005 | US20050212113 Spaced pads arranged along side surface of circuit substrate, with leads fixed thereto |
| 09/29/2005 | US20050212107 Circuit device and manufacturing method thereof |
| 09/29/2005 | US20050212102 Method for attaching shields on substrates |
| 09/29/2005 | US20050211990 Flat display device |
| 09/29/2005 | US20050211979 IC package, inspection method of IC package mounting body, repairing method of IC package mounting body, and inspection pin for IC package mounting body |
| 09/29/2005 | US20050211919 System and method for patterning a flexible substrate in a lithography tool |
| 09/29/2005 | US20050211750 Method of creating solder bar connections on electronic packages |
| 09/29/2005 | US20050211561 plating solutions comprising a mixture of copper sulfate, sulfuric acid, chlorine ions and adjuvants comprising a leveling agent and a brighteners, capable of forming the upper face of via-hole and conductor circuit in the same layer in approximately the same plane at the time of manufacturing circuits |
| 09/29/2005 | US20050211560 applying cothodic potentials to electroconductive layers formed on substrate having depression patterns, then dipping in a solution that is in contact with an anode, to form films; electrochemistry; electrodepostion |
| 09/29/2005 | US20050211465 Electronic parts packaging structure and method of manufacturing the same |
| 09/29/2005 | US20050211464 connecting microcircuits patterns such as tape carrier packages, flexible printed circuit, liquid crystal displays or printed circuit board using dielectric thermoplastic resins and anisotropic electroconductive adhesive including conductive particles |
| 09/29/2005 | US20050211461 Flat cable conductor, method of making the same and flat cable using the same |
| 09/29/2005 | US20050211236 Dicing saw with variable indexing capability |
| 09/29/2005 | US20050211163 Apparatus and method of dispensing small-scale powders |
| 09/29/2005 | US20050210951 Electromagnetic punch presses with feedback device |
| 09/29/2005 | US20050210673 Soldering an electronics package to a motherboard |
| 09/29/2005 | US20050210666 Substrate holding method and method of manufacturing electronic part |
| 09/29/2005 | DE202005010867U1 Soldered joint`s shape and height manipulating body, has laser holes that are annealed vertically into silicone elastomer band, where solder joints are coated by body to determine shape and height of joints which can be controlled |
| 09/29/2005 | DE19630794B4 Temperaturmeßvorrichtung Temperature measuring |
| 09/29/2005 | DE112004000057T5 Plasmabehandlungsapparat, Verfahren zur Herstellung eines Reaktionsgefäßes zur Plasmaerzeugung und Plasmabehandlungsverfahren Plasma processing apparatus, method for the preparation of a reaction vessel for the plasma generation and plasma treatment process |
| 09/29/2005 | DE10351720B4 Prüfnormal zum Prüfen von in der SMD-Montage eingesetzten optischen Erkennungssystemen und Verfahren zum Herstellen desselben Test standard for testing thereof used in the surface mounting optical recognition systems and methods for preparing |