| Patents for H05K 3 - Apparatus or processes for manufacturing printed circuits (118,473) |
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| 12/29/2005 | US20050284920 Solder bumps formation using solder paste with shape retaining attribute |
| 12/29/2005 | US20050284918 In-situ alloyed solders, articles made thereby, and processes of making same |
| 12/29/2005 | US20050284841 Method for forming wiring on a substrate |
| 12/29/2005 | US20050284658 Components with posts and pads |
| 12/29/2005 | US20050284657 Double-sided printed circuit board without via holes and method of fabricating the same |
| 12/29/2005 | US20050284656 Method for manufacturing printed circuit board and printed circuit board with gas venting hole |
| 12/29/2005 | US20050284655 Circuit board with asymmetrical structure and method for fabricating the same |
| 12/29/2005 | US20050284654 Structure of terminal member |
| 12/29/2005 | US20050284653 Condition display method and wiring board for wiring board design |
| 12/29/2005 | US20050284607 Cooling-assisted, heat-generating electrical component and method of manufacturing same |
| 12/29/2005 | US20050284561 Common carrier |
| 12/29/2005 | US20050284274 Integrated circuit package separators |
| 12/29/2005 | US20050283975 Circuit board |
| 12/29/2005 | DE19636735B4 Mehrschichtiges Schaltungssubstrat und Verfahren zu seiner Herstellung A multi-layer circuit substrate and method for its preparation |
| 12/29/2005 | DE10235277B4 Verfahren zur Befestigung von nicht lötbaren Komponenten auf elektronischen Leiterplatten A method for mounting non-solderable components on electronic circuit boards |
| 12/29/2005 | DE102005024950A1 Elektronische Leiterplatte mit einer darin integrierten Brennstoffzelle Electronic circuit board with a built-in fuel cell |
| 12/29/2005 | DE102004048203A1 Stackable semiconductor module for electronics packaging has electronic component with vertical opening provided with continuous metallization with layer of soldering paste to connect it to contact of another electronic component |
| 12/29/2005 | DE102004038297B3 Manufacture of housing for a position sensor involves a three-dimensional mask during deposition of electrical contact material for fitting components |
| 12/29/2005 | DE102004031834A1 Treating circuit boards comprises preparing pure or treated etching solution from a process solution container of the etching machine, feeding the consumed etching solution to a treatment station and returning to the container |
| 12/29/2005 | DE102004029589A1 Elektrisch anisotrop leitfähiger Schmelzkleber zur Implantierung von elektrischen Modulen in einen Kartenkörper Electrically conductive anisotropic melt adhesive for implanting electrical modules in a card body |
| 12/29/2005 | DE102004028445A1 Production of a template for applying solder paste in a template printing method comprises using a flat auxiliary element to apply a pre-tensioning force against the template on a surface facing electromagnetic radiation |
| 12/29/2005 | DE102004028211A1 Circuit board made from epoxy resin for chip structures comprises fixing sections for holding the circuit board, a fixing section in which components are soldered and a structure for changing the board stiffness |
| 12/29/2005 | DE102004001107B4 Strukturierung auf Oberflächen mittels Folie Structuring of surfaces by film |
| 12/29/2005 | DE10115719B4 Sende-Empfangs-Umschalt-Anordnung Transmit-receive switching arrangement |
| 12/29/2005 | CA2571135A1 Copper-containing tin powder and method for producing the copper-containing tin powder, and electroconductive paste using the copper-containing tin powder |
| 12/29/2005 | CA2570810A1 A method of recycling mixed streams of ewaste (weee) |
| 12/28/2005 | EP1610599A1 Multilayer substrate and method for producing same |
| 12/28/2005 | EP1610598A1 Anti-hacking printed circuit board having high-molecular material deposited thereon and deposition method for the same |
| 12/28/2005 | EP1610597A1 Precipitation of copper for producing conductive tracks |
| 12/28/2005 | EP1610428A2 Surface mounting discharge tube |
| 12/28/2005 | EP1610375A2 Contact carriers for populating substrates with spring contacts |
| 12/28/2005 | EP1610132A2 Fabricating interconnects using sacrificial substrates |
| 12/28/2005 | EP1609340A1 Process for manufacturing printed circuit boards and a machine for this purpose |
| 12/28/2005 | EP1609339A1 Method for manufacturing an electronic module and an electronic module |
| 12/28/2005 | EP1609338A1 A method and device for protection of a component or module |
| 12/28/2005 | EP1609217A2 Connector and printed circuit board for reducing cross-talk |
| 12/28/2005 | EP1609206A2 Coaxial waveguide microstructures and methods of formation thereof |
| 12/28/2005 | EP1608699A2 Thermally conductive adhesive composition and process for device attachment |
| 12/28/2005 | EP1608591A1 Potassium hydrogen peroxymonosulfate solutions |
| 12/28/2005 | EP1608535A1 Arrangement of electrical and/or mechanical components on a large, flexible foil-type conductor area |
| 12/28/2005 | EP1608481A1 Phase change lead-free super plastic solders |
| 12/28/2005 | EP1512114B1 Method of producing a digital fingerprint sensor and the corresponding sensor |
| 12/28/2005 | EP1330328B1 Method and device for applying material to a workpiece |
| 12/28/2005 | CN2749221Y Bevel edge processing machine having functions of drilling and bevel edge cutting |
| 12/28/2005 | CN1714609A Circuit board, multi-layer wiring board, method for making circuit board, and method for making multi-layer wiring board |
| 12/28/2005 | CN1714608A Multilayer wiring board, method for producing the came, and method for producing fiber reinforced resin board |
| 12/28/2005 | CN1714442A Semiconductor device |
| 12/28/2005 | CN1714318A Quasi-CW diode-pumped, solid-state UV laser system and method employing same |
| 12/28/2005 | CN1714314A Aqueous developable photoimageable thick film compositions for making photoimageable black electrodes |
| 12/28/2005 | CN1714170A Reduction of surface oxidation during electroplating |
| 12/28/2005 | CN1714131A Anisotropic-electroconductive adhesive, circuit connection method and structure using the same |
| 12/28/2005 | CN1713979A Heat-resistant flexible laminated board manufacturing method |
| 12/28/2005 | CN1713967A Chemical-solution supplying apparatus |
| 12/28/2005 | CN1713941A Transmitter for wireless control |
| 12/28/2005 | CN1713802A Wiring board, magnetic disc apparatus, and manufacturing method of wiring board |
| 12/28/2005 | CN1713801A Welding disk for preventing host board short circuit |
| 12/28/2005 | CN1713799A Production method of suspension board with circuit |
| 12/28/2005 | CN1713797A Wiring board, magnetic disc apparatus, and production method of wiring board |
| 12/28/2005 | CN1713406A Light-emitting diode |
| 12/28/2005 | CN1713363A Flexible contact-connection device |
| 12/28/2005 | CN1712483A Isotropic conductive adhesive and adhesive film using the same |
| 12/28/2005 | CN1234262C Clad board for printed-circuit board |
| 12/28/2005 | CN1234261C Method for mfg. circuit board |
| 12/28/2005 | CN1234152C Conductive film pattern and forming method thereof, distributing substrate, electronic device, electronic machine and medium |
| 12/28/2005 | CN1234004C Visual check supporting device for industrial products |
| 12/28/2005 | CN1233763C Metal backed printed circuit board assemblies |
| 12/28/2005 | CN1233762C Polymeric materials to metal surfaces adhesion process |
| 12/28/2005 | CN1233739C Resin compsn. adhesives prepared therewith for bonding circuit members, and circuit boards |
| 12/28/2005 | CN1233679C Ultraviolet-curable resin composition and photosolder resist ink containing the composition |
| 12/28/2005 | CN1233521C Method for producing metal laminated products |
| 12/28/2005 | CN1233495C Nozzle structure for automatic welding device |
| 12/27/2005 | US6981239 Method, system and apparatus for constructing resistive vias |
| 12/27/2005 | US6980416 Capacitor, circuit board with built-in capacitor and method of manufacturing the same |
| 12/27/2005 | US6980068 System for and method of interconnecting high-frequency transmission lines |
| 12/27/2005 | US6980066 High-frequency module |
| 12/27/2005 | US6980017 Test interconnect for bumped semiconductor components and method of fabrication |
| 12/27/2005 | US6980015 Back side probing method and assembly |
| 12/27/2005 | US6980014 Interposer and methods for fabricating same |
| 12/27/2005 | US6979910 Semiconductor package and semiconductor package mounting method |
| 12/27/2005 | US6979906 Solder on a sloped surface |
| 12/27/2005 | US6979898 Semiconductor component and a method of fabricating the semiconductor component |
| 12/27/2005 | US6979890 Intermediate substrate |
| 12/27/2005 | US6979889 Plastic lead frames for semiconductor devices |
| 12/27/2005 | US6979781 Semiconductor package, electronic circuit device, and mounting method of semiconductor device |
| 12/27/2005 | US6979712 comprises novolak epoxy resin, carboxylic acid-modified acrylonitrile butadiene rubber particles, phenolic resin, phenolic hydroxyl group-containing phosphorus compound, and filler |
| 12/27/2005 | US6979636 Method for forming heightened solder bumps on circuit boards |
| 12/27/2005 | US6979497 a polyimide film and an electro-conductive metal film in which the metal film is attached to the polyimide film using neither heat curing adhesive nor thermoplastic adhesive; good for manufacturing a flexible printed circuit board (FPC). |
| 12/27/2005 | US6979416 Method of forming an electronic component using ink |
| 12/27/2005 | US6979393 Method for plating copper conductors and devices formed |
| 12/27/2005 | US6979391 continuous reel-to-reel electrolysis and electrolytic cell; insulating wall between electrodes; one- or two-sided metallization; conductive foils for printed circuits |
| 12/27/2005 | US6979238 Connector having improved contacts with fusible members |
| 12/27/2005 | US6979159 Assembly of a circuit board with a nut |
| 12/27/2005 | US6978714 Solder paste printing method, solder paste printing apparatus, and method for manufacturing a wiring substrate having solder- printed layers |
| 12/27/2005 | US6978542 Method of reforming reformable members of an electronic package and the resultant electronic package |
| 12/27/2005 | US6978540 Method for pre-applied thermoplastic reinforcement of electronic components |
| 12/27/2005 | US6978539 Method for attaching an integrated circuit package to a circuit board |
| 12/27/2005 | US6978538 Method for making a microelectronic interposer |
| 12/27/2005 | US6978534 Device for pressure bonding an integrated circuit to a printed circuit board |
| 12/25/2005 | CA2510123A1 Tin-coated printed circuit boards with low tendency to whisker formation |
| 12/23/2005 | CA2510122A1 Article with a coating of electrically conductive polymer and process for production thereof |